Top 50 Chiplet Packaging

Kiwimoore develops packaging chiplet technology that enhances the efficiency and scalability of semiconductor manufacturing. This technology addresses the challenges of space and thermal management in electronic devices, enabling higher performance and reduced costs for manufacturers.

Chipletz develops advanced packaging solutions using its Smart Substrate™ technology to integrate diverse chiplets seamlessly. This approach scales system performance beyond traditional transistor scaling limits for demanding AI and HPC applications. The substrate functions as the complete system, offering superior die-to-die bandwidth and improved power integrity.

Chiplet.US offers a full‑stack design‑for‑manufacturability and integration service for chiplet‑based 2.5D/3D‑IC architectures, covering AI‑accelerated DFM analysis, RTL‑to‑GDSII implementation, SI/PI simulation, and advanced packaging trade studies. The cloud‑based workflow provides early risk metrics, yield forecasts, and compliance documentation, enabling semiconductor firms and system integrators to reduce NRE, shorten development cycles, and improve first‑pass assembly yield.

Silicon Box specializes in advanced semiconductor integration, focusing on next-generation chiplet adoption solutions. The company operates a state-of-the-art foundry utilizing sub-5 micron technology for high-density packaging. They provide expertise across multiple sectors to enable scalable deployment of complex chiplet-based platforms.

The startup develops silicon technology that enables engineers to customize designs and streamline the silicon fabrication process, significantly reducing time-to-silicon for new generations of products. By codifying design methodologies, the technology minimizes risks associated with silicon engineering, allowing for faster innovation cycles.

This company develops technology for 2.5D and 3D chiplet stacking, enhancing semiconductor chip performance. Their solutions aim to improve chip density and processing power through advanced packaging techniques.

Eliyan manufactures semiconductor interconnects using its NuLink™ PHY technology, which enables the creation of large System-in-Package (SiP) designs on standard packaging. This technology enhances AI performance by up to 10 times and increases bandwidth, power efficiency, and SiP size by up to four times, effectively addressing the limitations imposed by the memory wall in chiplet-based systems.

This company designs custom Application-Specific Integrated Circuits (ASICs) for high-performance computing (HPC) in AI and automotive Advanced Driver-Assistance Systems (ADAS). They specialize in chiplet architectures to optimize performance and efficiency for specific applications.

Thinktrans Semiconductor provides IC carrier boards and flexible printed circuits that use ion‑implantation vapor deposition (IVD) and ion‑implantation semi‑additive (I‑SAP) dry‑process metallization. These techniques deliver fine line/space dimensions (down to 1 µm) and high‑frequency performance up to 100 GHz across multiple substrate materials, supporting multi‑layer high‑density interconnects for memory, mobile, TV, GPU/XPU and chiplet packaging. The products target semiconductor OEMs, fabless designers and system integrators needing compact, high‑speed packaging without redesigning existing manufacturing lines.

DreamBig Semiconductor offers a Chiplet platform with SMARTNIC-DPU solutions designed for low latency and high throughput in AI, data centers, and storage acceleration. Their technology addresses the need for efficient data processing and inherent security in high-demand computing environments.

PowerLattice provides a monolithic power‑delivery chiplet that integrates voltage regulation, on‑die magnetic inductors, and analog control directly within the processor package. By shortening the power path to a few hundred micrometers, it cuts conduction loss by over 50 % and improves performance‑per‑watt for AI accelerators, with a programmable software layer and scalable tiling for any SoC power topology.

InfiniLink develops high-speed SerDes and optical transceiver chiplets utilizing Silicon and silicon photonics technologies to enhance data transfer rates in next-generation AI data centers. The startup addresses the need for energy-efficient connectivity solutions to manage increasing data volumes while minimizing power consumption.

Ventana develops high-performance RISC-V CPUs with extensible instruction sets, available as multi-core chiplets or core IP, tailored for demanding applications in cloud, data center, 5G, AI, and automotive sectors. Their technology enables rapid productization and cost-effective custom system designs, addressing the need for efficient and scalable processing solutions in modern computing environments.

Ayar Labs has developed the first in-package optical I/O solution, utilizing the TeraPHY™ optical I/O chiplet and SuperNova™ remote light source to enable high-speed data transfer between chips. This technology addresses the limitations of traditional interconnects by providing 5-10 times higher bandwidth, 4-8 times greater power efficiency, and 10 times lower latency, essential for scaling AI infrastructure.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

Kuixin Technology provides integrated circuits that address computing power scaling and interconnection challenges. Their products cater to data centers, artificial intelligence, consumer electronics, automotive, and IoT applications.

Rebellions develops AI accelerators that utilize HBM3e chiplet architecture and 5nm System-on-Chip technology to enhance energy efficiency and computational performance for deep learning applications. The company addresses the need for scalable and efficient AI inference solutions in the rapidly growing generative AI market.

AnalogPort supplies semiconductor IP and design services that deliver power‑performance‑area‑optimized high‑speed interconnects for AI accelerators, including UCIe chiplet interfaces, multi‑protocol SerDes links, and advanced memory interfaces. Its silicon‑proven portfolio supports 16‑64 Gbps chiplet communication, up to 112 Gbps serial links, and GDDR7/HBM memory, enabling fabless AI chip designers and data‑center hardware vendors to integrate disaggregated compute with reduced risk and faster time‑to‑market.

Omni Design Technologies provides high‑speed, low‑power analog‑to‑digital converter and front‑end semiconductor IP for heterogeneous system‑on‑chip designs, offered as reusable IP blocks, chiplet “droplets,” or hard macros. Their 64 GS/s ADC cores and multi‑channel analog front‑ends deliver >10 ENOB with sub‑100 µW power per channel, include on‑chip PVT monitoring, and support DSP‑ready interfaces such as JESD204B/C and high‑bandwidth SerDes. The IP enables fabless and in‑house design teams to accelerate development of AI accelerators, data‑center networking, automotive ADAS, telecom RF, aerospace, and quantum computing products.

Baya Systems develops customizable, software-driven System IP solutions for chiplet-based semiconductor systems, enabling efficient data movement and high-performance computing. Their technology addresses the complexity and cost of delivering scalable, modular architectures by providing a unified fabric that supports advanced cache coherency and optimized throughput for diverse applications.

Zhongke Zhixin Integration specializes in packaging and chip integration technology for integrated circuits, focusing on enhancing performance and reducing size in semiconductor applications. The company addresses the challenges of power consumption and space constraints in modern electronic devices by providing efficient integration solutions.

L3MATRIX provides a co‑packaged silicon photonics matrix that integrates a 2‑D optical interconnect with a switching ASIC, using on‑chip DFB lasers and flip‑chip assembly to deliver 25 Gb/s per wavelength over single‑mode fiber. The high‑radix, single‑stage architecture achieves petabit‑scale aggregate bandwidth, 10–20 ns latency, and roughly tenfold lower power consumption than conventional electronic packet switches, and can be added to existing data‑center switch designs via a standard electrical‑to‑optical interface.

CHIPX provides a vertically integrated semiconductor platform that links advanced material suppliers, fabrication partners, and system integrators through its CHIPX Connect™ ecosystem. The platform delivers proprietary high‑performance chip architectures, advanced interconnect and modular packaging solutions, and end‑to‑end process control to lower energy consumption, emissions, and time‑to‑market for fabless designers, foundries, and OEM integrators.

The startup provides an AI platform that embeds engineered safety protocols—automated alignment scoring, red‑team testing, and programmable kill‑switches—directly into model development cycles to keep autonomous agents aligned with human intent. It also offers a federated learning SDK for secure on‑device model updates with differential privacy, and a modular edge runtime that leverages chiplet‑based and neuromorphic accelerators for sub‑10 ms latency and high energy efficiency. Standardized APIs, provenance metadata, and compliance dashboards enable seamless CI/CD integration and automated regulatory reporting.

Neuron IP provides end‑to‑end ASIC design services for AI and edge workloads, handling architecture definition, RTL development, synthesis, physical design, and tape‑out management. The company also offers a library of configurable silicon IP blocks and chiplet interface IP with automated verification, enabling fabless semiconductor firms and system integrators to accelerate time‑to‑market without extensive in‑house expertise.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

Indiana Integrated Circuits develops and licenses Quilt Packaging technology, a patented system for integrating disparate microelectronic chips into high-performance packages. This technology achieves world-record interchip interconnect performance suitable for RF, digital, and power applications. The company also offers custom microfabrication and nanofabrication services for prototyping and research builds.

Melanin MicroChips provides end‑to‑end testing, assembly, and advanced packaging services for high‑performance semiconductor devices, including 2.5D interposer integration and 3D TSV stacking. Its reliability qualification suite (HTOL, temperature cycling) and cloud‑based analytics deliver yield insights and predictive failure modeling to accelerate design‑for‑manufacturability cycles for AI processors, EV power modules, and wearable sensors.

InfiniNode Technologies provides high‑performance, energy‑efficient interconnect IP for heterogeneous and multi‑chiplet SoCs. Its modular fabric offers coherent and non‑coherent options with an integrated system‑level cache, delivering near‑wire‑propagation latency and low power per bit while supporting standard protocols such as AXI, OCP, and TileLink. The IP integrates into existing RTL flows, reducing validation effort and accelerating SoC development for semiconductor and ASIC designers.

Ai Kere Si Intelligent Equipment designs and manufactures high-precision die bonding equipment for advanced semiconductor packaging. Their solutions include multi-chip, chip-to-wafer hybrid, and System-in-Package (SiP) bonders, engineered to enhance throughput and accuracy in critical packaging steps.

Samba provides plasma‑based etch and thin‑film deposition equipment for advanced semiconductor packaging, delivering 2–3× higher wafer throughput and roughly 50 % lower operating costs compared with legacy tools. Its modular platform enables rapid switching among etch, PVD, CVD and ALD processes with real‑time endpoint detection and closed‑loop process control to maintain uniform critical dimensions on 300 mm wafers and large panels. Integrated software supplies recipe management, statistical process control dashboards and remote diagnostics to reduce downtime and accelerate new node introductions.

Persimmons develops flexible, low-power Generative AI inference systems based on its proprietary PL1000 chiplet architecture. This platform delivers high compute density and cost efficiency for AI applications ranging from edge devices to large data centers. The modular design enhances AI adaptability while minimizing operational energy use and development timelines.

Princeton Innotech manufactures vertical‑cavity surface‑emitting lasers that deliver single‑mode output above 10 W with less than 1 mrad divergence and support modulation speeds exceeding 200 Gb/s per device. Using a 6‑inch wafer platform, it provides high‑power VCSEL arrays and terabit‑per‑second optical links with custom packaging, thermal management, and driver integration for industrial heating, power‑beaming, high‑speed communications, atomic sensing, and AI edge‑computing applications.

Rasbon provides a fully integrated, turnkey service that covers ASIC/SoC and SiP design, functional verification, wafer fabrication, advanced packaging, and final testing under a single contract. By using leading EDA tools, automated RTL synthesis and DFM‑aware layout pipelines, and in‑house coordination with qualified fabs and packaging partners, it delivers production‑ready silicon with real‑time project visibility and compliance support for automotive, telecom and consumer standards. The offering targets fabless startups, OEM hardware divisions, and system integrators needing end‑to‑end chip development without internal supply‑chain overhead.

Yibo Semiconductor specializes in semiconductor packaging design and manufacturing processes that enhance the performance and reliability of electronic components. The company addresses the challenges of miniaturization and thermal management in high-density circuits, enabling more efficient and compact electronic devices.

The startup operates an online marketplace for custom-branded packaging, providing services such as production, engineering, and prototyping, along with supply chain optimization and quality assurance. This platform enables e-commerce brands and retailers to efficiently meet complex packaging requirements while ensuring high-quality standards and streamlined logistics.

SEMIFIVE specializes in custom silicon design, offering a complete solution from concept to manufacturing, including SoC platforms and turnkey services. The company addresses the need for efficient and reliable semiconductor development by providing end-to-end design and production support, leveraging partnerships with leading foundries and EDA providers.

The startup develops a smart packaging technology that integrates printed sensors to monitor internal conditions within food packaging throughout the supply chain. This technology enables retailers and food companies to perform noninvasive inspections, reducing food waste and enhancing revenue by identifying pack defects in real-time.

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

Atlas Magnetics designs and manufactures custom Application-Specific Integrated Circuits (ASICs) allowing customers to create proprietary silicon quickly without Non-Recurring Engineering (NRE) costs. The company also offers load switches featuring advanced functionality for enhanced power performance and operational safety. Their integrated solutions help engineers reduce component count, board size, and system costs while improving overall circuit reliability.

This company focuses on advancing the next phase of artificial intelligence through research and development in key areas like autonomous agents and generative AI safety. They explore technologies such as federated learning, edge AI, and bio-digital twins to enable privacy-preserving, high-fidelity simulations and task execution. The work aims to align agent behavior with human intent while improving hardware efficiency through innovations like chiplet architectures.

Besi offers advanced semiconductor assembly equipment for high-volume, high-precision manufacturing. Their solutions support leadframe, substrate, and wafer-level packaging, enabling increased throughput and cost-effectiveness for complex semiconductor devices.

This startup specializes in industrial automation for packing and assembly processes, utilizing robotics to enhance efficiency in the food and beverage sectors. By providing integrated warehousing and transport services, the company addresses the challenges of labor shortages and operational delays in product handling.

ePac Flexible Packaging utilizes a digital manufacturing platform to produce custom flexible packaging solutions, including standup pouches and rollstock, with lead times of 5-15 business days. This technology addresses the need for brands to reduce inventory costs and waste while providing high-quality, sustainable packaging options tailored to various industries.

Provides an online marketplace for sourcing primary packaging components directly from manufacturers, eliminating the need for intermediaries like brokers or distributors. By consolidating over 10,000 packaging options and enabling direct communication with suppliers, it reduces lead times, lowers costs, and supports sustainable practices through options like post-consumer recycled materials and refillable designs.

Mo-Link provides ultra‑compact active optical cable (AOC) and system‑in‑package (SiP) modules that deliver up to 200 Gbps within a sub‑2 mm form factor for board‑to‑board and chip‑to‑chip connections. Its portfolio includes fiber‑based HDMI 2.1, USB 3.2 Gen 2x2, DisplayPort 1.4, and magnetic‑hybrid connectors that are compatible with standard PCB footprints, helping data‑center, telecom, AV, and consumer‑electronics OEMs reduce layout complexity, assembly time, and cost.

This startup manufactures customized brand labels and container packaging using a digital printing platform that offers a variety of fonts, shapes, and sizes. Their solution enhances brand recognition for high-growth companies by providing premium packaging materials that differentiate products in a competitive market.

Hipli provides a reusable packaging solution for e-commerce that allows customers to receive their orders in eco-friendly containers, which can be easily returned and reused. This approach significantly reduces plastic waste generated by traditional single-use packaging in the online retail sector.

PeelON develops active intelligent packaging using plant-based, home-compostable liners to extend the shelf life of fresh produce. This technology naturally inhibits microbial growth and regulates moisture and ethylene to reduce postharvest food waste. The solution offers growers and retailers a sustainable alternative to plastic packaging while maintaining produce quality.

KOSES offers specialized semiconductor packaging equipment designed to improve precision and efficiency in back-end manufacturing processes. Their solutions include solder ball attach, marking, and substrate handling systems, enabling semiconductor manufacturers to enhance throughput and reliability.