Top 50 Chiplet Packaging

Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer, enhancing die-to-die bandwidth and external I/O speeds. This approach improves power integrity and system performance, addressing the limitations of traditional semiconductor scaling in AI and high-performance computing applications.

Eliyan provides the NuLink™ PHY, a die-to-die physical layer enabling high-speed, low-power interconnects between chiplets for AI and HPC systems. This UCIe-compliant technology achieves up to 64 Gbps per bump, overcoming bandwidth limitations in multi-die architectures on standard and advanced packaging.

DreamBig Semiconductor offers a Chiplet platform with SMARTNIC-DPU solutions designed for low latency and high throughput in AI, data centers, and storage acceleration. Their technology addresses the need for efficient data processing and inherent security in high-demand computing environments.

Ayar Labs has developed the first in-package optical I/O solution, utilizing the TeraPHY™ optical I/O chiplet and SuperNova™ remote light source to enable high-speed data transfer between chips. This technology addresses the limitations of traditional interconnects by providing 5-10 times higher bandwidth, 4-8 times greater power efficiency, and 10 times lower latency, essential for scaling AI infrastructure.

This company designs custom Application-Specific Integrated Circuits (ASICs) for high-performance computing (HPC) in AI and automotive Advanced Driver-Assistance Systems (ADAS). They specialize in chiplet architectures to optimize performance and efficiency for specific applications.

Baya Systems develops customizable, software-driven System IP solutions for chiplet-based semiconductor systems, enabling efficient data movement and high-performance computing. Their technology addresses the complexity and cost of delivering scalable, modular architectures by providing a unified fabric that supports advanced cache coherency and optimized throughput for diverse applications.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

Omni Design Technologies provides high‑speed, low‑power analog‑to‑digital converter and front‑end semiconductor IP for heterogeneous system‑on‑chip designs, offered as reusable IP blocks, chiplet “droplets,” or hard macros. Their 64 GS/s ADC cores and multi‑channel analog front‑ends deliver >10 ENOB with sub‑100 µW power per channel, include on‑chip PVT monitoring, and support DSP‑ready interfaces such as JESD204B/C and high‑bandwidth SerDes. The IP enables fabless and in‑house design teams to accelerate development of AI accelerators, data‑center networking, automotive ADAS, telecom RF, aerospace, and quantum computing products.

Rebellions develops AI accelerators that utilize HBM3e chiplet architecture and 5nm System-on-Chip technology to enhance energy efficiency and computational performance for deep learning applications. The company addresses the need for scalable and efficient AI inference solutions in the rapidly growing generative AI market.

Atlas Magnetics develops semiconductor packaging materials that integrate passive components within integrated circuit (IC) substrates, enabling the production of custom ASICs in just 10 minutes without non-recurring engineering costs. This approach reduces the number of components on system boards, addressing the challenges of space and cost in modern electronics design.

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

Black Semiconductor utilizes graphene to create ultra-fast, energy-efficient chip networks that enable thousands of chips to communicate as a single unit. This technology addresses the limitations of traditional electronic connections by integrating photonics with electronics, enhancing data communication speed and scalability in the semiconductor and electronics industries.

Lightmatter develops photonic processors that utilize advanced interconnect and packaging technology to enhance computing speed and energy efficiency for AI applications. By addressing the limitations of traditional silicon chips, their solutions enable scalable, high-bandwidth connections between numerous chips, facilitating the pursuit of artificial general intelligence (AGI).

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

QuickLogic provides embedded FPGA (eFPGA) IP, discrete FPGAs, and FPGA SoCs for applications requiring hardware re-programmability and optimization. Their solutions cater to critical infrastructure and extreme environments, offering custom FPGA devices, chiplets, and security features. The company focuses on delivering silicon-efficient, reliable, and scalable programmable logic architectures with long-term supply assurance.

Evanesce manufactures 100% compostable food packaging solutions using upcycled agricultural waste, designed to decompose within 90 days. The company provides an affordable alternative to single-use plastics and polystyrene, addressing the environmental impact of traditional packaging materials.

Lightspeed Photonics develops modular optoelectronic processors and interconnects, specifically the LightSiP™ system, which combines reconfigurable electronics with high data rate free-space optical interconnects for efficient chip-to-chip communication. This technology reduces data latency and power consumption while increasing data bandwidth and performance, addressing the demands of data centers and near-edge computing environments.

The startup develops bio-based packaging materials using green processing technology that eliminates toxic chemicals, providing sustainable alternatives to single-use plastics. Their compostable food packaging products offer organizations a measurable reduction in environmental impact compared to conventional plastic options.

Flexi-Hex manufactures protective packaging sleeves using a patented honeycomb design made from 100% recycled paper, which significantly reduces breakage rates during transit. This solution replaces traditional plastic packaging, minimizing environmental waste while ensuring the safe delivery of fragile products across various industries.

Pack2Earth develops sustainable packaging materials for the food industry, offering eco-friendly alternatives to traditional plastics. Their materials aim to reduce environmental impact and promote circular economy principles within the packaging supply chain.

Bpacks has developed a bark packaging technology that utilizes by-products from the timber industry to create fully compostable packaging solutions, effectively replacing petroleum-based rigid plastics. This approach addresses the significant environmental impact of single-use plastic food packaging, which contributes to global waste and pollution.

SEEQC develops a semiconductor-based quantum computing system-on-a-chip that integrates heterogeneous quantum processing units (QPUs), graphics processing units (GPUs), and central processing units (CPUs) for scalable quantum applications. This technology addresses the limitations of traditional quantum computing by enabling efficient chip-to-chip integration and supporting various qubit modalities for commercial use.

This startup produces biodegradable packaging and decorative materials using hemp stalks and mycelium, which decompose in soil within a month. By providing an eco-friendly alternative to plastic packaging, the company enables businesses to enhance their sustainability efforts while maintaining aesthetic appeal.

The startup manufactures a chip that utilizes Compute Express Link technology to enable data center operators to efficiently pool and manage artificial intelligence accelerators, processors, and memory. This approach enhances system performance by providing adequate memory resources for diverse device integration, addressing the challenges of scalability and resource allocation in large-scale computing environments.

Avicena Tech manufactures microLED-based optical interconnects that provide ultra-low power and high bandwidth for chip-to-chip communications, addressing the need for efficient data transfer in high-performance computing and cloud applications. Their technology enables multi-terabit per second data rates while minimizing energy consumption, making it suitable for industries such as autonomous vehicles and aerospace.

This startup develops compostable biomaterials using lignin and cellulose to create sustainable packaging solutions. Their technology reduces reliance on traditional plastics, enabling businesses to offer eco-friendly packaging that maintains functionality and aesthetics at competitive costs.

Dizzie provides a reusable packaging system for grocery retailers and brands, facilitating the transition from single-use to refillable packaging. This solution reduces packaging waste and CO2 emissions while offering services such as packaging cleaning and returns management to streamline operations.

The startup specializes in thermoformed packaging designed for the food packaging industry, focusing on optimizing recycled content and enhancing product recyclability. By providing sustainable packaging solutions, the company aims to reduce plastic usage and improve operational efficiency within the food sector.

Chipletti designs and manufactures advanced node chiplet modules specifically for AI compute applications. Their technology enables high-performance, scalable solutions for demanding AI workloads.

Zinite develops a high-performance thin-film transistor technology that enables the construction of 3D chips, maximizing performance per area within existing product real estate. This approach allows manufacturers to enhance chip functionality without requiring new fabrication facilities, addressing the limitations of traditional 2D chip designs in the Post-Moore Era.

This startup produces sustainable packaging solutions designed to eliminate packing waste and promote a circular economy. By offering affordable, eco-friendly packaging products, the company facilitates the transition to sustainable consumption while minimizing environmental impact.

The startup manufactures thermal packaging solutions, including temperature-controlled packaging and insulated shipping products, to ensure the safe transport of temperature-sensitive goods. Their offerings enable clients to maintain product integrity during transit, reducing spoilage and loss associated with temperature fluctuations.

Primemas develops low-cost, high-performance Hub Chiplet SoC modules that utilize high-bandwidth, low-latency D2D interfaces for efficient infrastructure sharing with custom partner dies. This technology reduces the design and manufacturing time of custom SoCs by up to 90%, catering to diverse markets such as CXL, AI, Crypto, and Data Analytics.

LeapFrog Semiconductor develops a chiplet-based modem for 5G infrastructure, offering a modular and scalable architecture that enhances wireless signal processing efficiency. Their technology delivers ten times higher performance per watt compared to legacy systems, enabling more users per base station and facilitating rapid productization in a standards-based open ecosystem.

Alphawave IP provides silicon IP solutions for high-speed connectivity, including industry-leading 3nm, 24Gbps UCIe™ subsystems and multi-protocol I/O chiplets. Their technology addresses the need for reliable, low-latency interconnections in data centers, AI infrastructure, and advanced computing applications.

SCALINQ develops high-density cryogenic solutions, including the LINQER packaging system and compact quantum filters, to enhance the performance of superconducting and spin-qubit processors. The company addresses the challenges of scaling quantum bits by providing customizable hardware that minimizes signal crosstalk and optimizes space efficiency for quantum computing applications.

PICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.

Lux Semiconductors develops metal substrates and interposers that enhance thermal dissipation and reduce warpage in system-in-package designs, addressing the limitations of traditional glass and organic substrates. Their technology enables higher performance in chip packaging, supporting the demands of larger superchips in applications such as artificial intelligence and autonomous vehicles.

This startup provides a reusable packaging system for restaurants, canteens, and supermarkets, managed through a proprietary app and B2B platform. It uses QR and RFID technologies to track packaging, monitor inventory and return rates, and quantify environmental impact, helping businesses reduce single-use waste.

Silego’s GreenPAK family offers programmable mixed‑signal ICs that let hardware engineers replace multiple discrete analog, digital, and timing components with a single chip. Using a drag‑and‑drop design environment, users configure analog primitives, logic blocks, and timing generators, storing the setup in non‑volatile memory for field updates via I²C, SPI, or UART. The devices reduce component count, board area, and power consumption, accelerating prototype cycles for IoT and consumer electronics.

This startup manufactures custom, sustainable molded fiber packaging that replaces traditional styrofoam and plastic options, which contribute to landfill waste. By providing compostable packaging solutions, the company enables businesses of all sizes to adopt environmentally friendly practices while reducing their ecological footprint.

Beacon Photonics develops a heterogeneous photonics platform that integrates advanced optical microsystems on a chip, significantly reducing the cost and size of photonic devices. Their technology addresses the limitations of traditional, expensive, hand-built optical systems, enabling high-performance applications in communications, sensing, and quantum technologies.

The startup produces plant-based cushioning packaging materials derived from agricultural residue, providing a sustainable alternative to traditional packaging solutions. This technology enables businesses to lower their environmental impact and packaging costs while ensuring product protection.

This startup manufactures blown PET packaging, producing transparent and recyclable plastic containers with enhanced oxygen barrier and heat resistance. Their monolayer design reduces weight and cost, providing the food industry with a sustainable packaging solution that minimizes ecological impact.

This startup manufactures biodegradable packaging materials using naturally molded plant pulp fiber, providing an eco-friendly alternative to plastic and aluminum. Their products cater to large consumer and FMCG brands, addressing the environmental impact of traditional packaging materials.

IC Photonics develops Co-Packaged Optics (CPO) technology that integrates proprietary CMOS and pump laser components with silicon photonics to enhance optical interconnects in data centers and AI applications. This technology delivers high-bandwidth, low-power optical input/output solutions, improving communication efficiency between chips, blades, and racks.

Precisement specializes in precision robotics and laser processing for semiconductor and optoelectronics packaging, focusing on microscale component handling, assembly, and integration into System-in-Package solutions. The company addresses the need for enhanced manufacturing traceability and quality control in the production of advanced deep-tech applications, particularly in healthcare and medical devices.

This startup manufactures biodegradable plastics and packaging materials from food production side-streams, effectively utilizing waste to create sustainable packaging solutions. By transforming industrial food waste into high-quality raw materials, the company helps packaging firms reduce their environmental impact and promote regenerative practices.

This startup produces 100% compostable packaging made from seaweed, providing a sustainable alternative to traditional plastic materials. By utilizing biodegradable seaweed-based polymers, the company addresses the environmental impact of plastic waste in packaging.