Omni Design Technologies offers Wideband Signal Processing™ IP cores—high‑speed ADCs, DACs, and mixed‑signal chiplets—for integration into advanced semiconductor designs. Their ultra‑low‑power, multi‑gigahertz converters provide high linearity and real‑time PVT monitoring, enabling faster, more efficient AI accelerators, 5G/6G radios, autonomous‑vehicle systems, data‑center interconnects, and quantum‑computing hardware.
Funding
$35M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
7OCTFounders
Product
Problem
Modern high‑performance systems such as AI accelerators, 5G/6G radios, autonomous vehicles, and data‑center interconnects require ultra‑fast, low‑power conversion of analog signals to digital data and vice‑versa. Existing converters often consume excessive power, lack the bandwidth for wideband signals, or cannot be integrated efficiently into advanced SoCs, limiting system speed, energy efficiency, and form factor.
Solution
Omni Design Technologies provides Wideband Signal Processing™ IP cores—including high‑speed ADCs, DACs, and mixed‑signal chiplets—designed for the most advanced FinFET process nodes. These cores deliver multi‑gigahertz sampling rates with superior linearity and low noise while consuming minimal power, enabling direct RF sampling and high‑order modulation support. The IP is offered as configurable IP blocks, chiplet packages, or “Droplets” SoC integrations, allowing designers to embed the converters directly into their silicon. Built‑in OmniTRUST™ PVT monitoring adds real‑time voltage, temperature, and process variation tracking for dynamic biasing, DVFS, and predictive reliability. By delivering high data throughput, precise signal integrity, and ultra‑low power consumption, Omni Design’s solutions accelerate time‑to‑market for next‑generation AI, communications, automotive, aerospace, and quantum computing products.
Target Audience
Primary customers are semiconductor design teams developing AI accelerators, 5G/6G radios, autonomous‑vehicle sensor suites, data‑center networking ASICs, and quantum‑computing interfaces that require high‑performance mixed‑signal IP.
Features
- Multi‑GS/s ADC/DAC architectures with >9 GS/s rates and >64 GS/s prototypes for ultra‑high‑bandwidth applications
- Ultra‑low power design optimized for dense data‑center and battery‑operated deployments
- High linearity and low noise (SFDR, SNR) to support advanced modulation schemes such as 4096‑QAM and PAM4
- Direct RF sampling capability that eliminates intermediate down‑conversion stages
- Integrated OmniTRUST™ PVT monitors for real‑time bias adjustment, DVFS, and reliability analytics
- Chiplet and “Droplet” delivery formats for seamless SoC integration and reduced board footprint
- Compatibility with leading advanced process nodes (including 3 nm and 5 nm FinFET) for future‑proof designs