Silicon Box specializes in advanced semiconductor integration, focusing on next-generation chiplet adoption solutions. The company operates a state-of-the-art foundry utilizing sub-5 micron technology for high-density packaging. They provide expertise across multiple sectors to enable scalable deployment of complex chiplet-based platforms.
Funding
$669.2M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
The increasing complexity of semiconductor design and manufacturing presents challenges in achieving optimal performance, power efficiency, and time-to-market, particularly with the adoption of chiplet architectures. Integrating diverse technologies and ensuring efficient interconnection between chiplets requires specialized expertise and advanced manufacturing capabilities.
Solution
Silicon Box provides advanced semiconductor integration services, specializing in chiplet technology to address the challenges of modern chip design. The company offers full execution, from initial design to manufacturing, leveraging its proprietary sub-5 micron technology for high-density interconnects. By focusing on heterogeneous integration, Silicon Box enables enhanced performance, improved power efficiency, and reduced form factors for complex systems. Their solutions facilitate faster development cycles, lower device costs, and quicker time-to-market for industry partners in sectors such as AI, data centers, electric vehicles, mobile, and wearables.
Target Audience
Silicon Box primarily serves semiconductor companies and system designers in industries such as artificial intelligence, data centers, electric vehicles, mobile, and wearables, who require advanced chiplet integration solutions.
Features
- Collaborative and flexible design approach with upfront customer engagement and IP protection
- Fine design-rule solutions compliant with BoW & UCle for customizable and cost-efficient heterogeneous architectures
- IC integration and interconnection using proprietary fabrication methods with sub-5 micron technology
- High-yield, large-format manufacturing for advanced packaging solutions and efficient interconnection
- Ecosystem collaboration with co-designing partners, advanced materials suppliers, and key equipment suppliers
- State-of-the-art automated factory with resource-efficient facilities and integration methods for low power consumption
- Support for interconnection of AI processors, general processors, HPC, RF frontends, power management modules, analog, and motor drives
- Commitment to resource efficiency with NeWater purification and 50% post-manufacturing wastewater recycling