Qnnect develops high-performance interconnect technology and hermetic packaging solutions that ensure reliable connectivity for high-density and high-speed applications in demanding environments. Their products address critical connectivity challenges in sectors such as aerospace, defense, semiconductor, and medical, with over 4,000 customers relying on their expertise and quality components.
Funding
Funding not disclosed
Founders
Product
Problem
High-density and high-speed electronic applications in harsh environments require reliable interconnect technology and hermetic packaging to prevent performance degradation and failures. Existing solutions often lack the robustness needed to withstand extreme conditions, leading to compromised connectivity and system downtime.
Solution
Qnnect provides interconnect and hermetic packaging solutions engineered for demanding environments, ensuring signal integrity and reliable performance in critical applications. By combining advanced materials science, precision manufacturing, and application-specific designs, Qnnect delivers robust connectivity solutions that withstand extreme temperatures, pressures, and corrosive elements. Their portfolio includes hermetic connectors, EMI filters, micro-miniature connectors, and high-performance cable assemblies tailored to meet the stringent requirements of aerospace, defense, semiconductor, and medical industries. Qnnect's vertically integrated manufacturing capabilities and focus on signal integrity enable them to provide custom solutions that optimize performance and minimize downtime for their customers.
Target Audience
Qnnect serves OEMs and system integrators in aerospace, defense, semiconductor, datacom, and medical sectors requiring high-reliability interconnect solutions for mission-critical applications.
Features
- Hermetic connectors utilizing glass-to-metal and ceramic-to-metal sealing for robust protection against environmental factors
- EMI filters including micro/mini, eyelet, and bolt options for signal integrity in noisy environments
- Micro-miniature and nano-miniature connectors for high-density applications
- High-performance cable assemblies designed for signal integrity and durability
- Custom interconnect solutions utilizing Fuzz Button® contact pins and Hardhat pins
- Bonded metals using explosive bonding, forming, and hardening techniques
- Precision machining with 3 and 4 axis machines
- In-house Ni and Au plating capabilities