Sangtera builds micro‑hydraulic actuation stages that provide nanometer‑scale positioning in a compact form factor, enabling fast, high‑throughput alignment for chiplet‑to‑wafer hybrid bonding and precision robotic manipulators. Their closed‑loop, low‑latency control delivers high stiffness and repeatability while integrating easily into existing semiconductor fab equipment and robot end‑effectors, reducing cycle time and equipment cost.
Funding
$100K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
MFounders
Product
Problem
Manufacturing advanced semiconductor packages and robotic systems requires sub-micron positioning accuracy and high throughput, but existing motion platforms are bulky, slow, and lack the precision needed for chiplet-to-wafer hybrid bonding and fine robotic manipulation.
Solution
Sangtera develops microhydraulic actuation technology that delivers compact, high‑resolution motion stages capable of nanometer‑scale positioning at speeds suitable for mass production. The technology integrates a small‑form‑factor precision stage with closed‑loop control and low‑latency feedback, enabling accurate alignment of chiplets during hybrid bonding and precise actuation in dexterous robotic applications. By combining hydraulic force amplification with electronic control, Sangtera’s stages achieve high stiffness and repeatability while maintaining a minimal footprint. The platform is designed for easy integration into existing semiconductor fabs and robotic end‑effectors, reducing equipment cost and cycle time. Sangtera also provides engineering support for customizing stage specifications to match specific process requirements.
Target Audience
Primary customers are semiconductor manufacturers developing chiplet‑based packages and robotics companies building high‑precision, dexterous end‑effectors.
Features
- Microhydraulic actuation delivering nanometer positioning resolution with sub‑micron repeatability
- Compact form factor suitable for integration into wafer‑scale bonding tools and robotic manipulators
- High‑speed closed‑loop control enabling rapid alignment and bonding cycles
- Scalable design that supports both low‑volume prototyping and high‑throughput manufacturing
- Compatibility with standard wafer handling equipment and robot interfaces
- Built‑in diagnostics and calibration routines for maintaining precision over long runtimes