NcodiN

About NcodiN

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

<problem> High-performance computing (HPC) and artificial intelligence (AI) applications are increasingly limited by the bandwidth and energy consumption of traditional electrical interconnects between dies in multi-chipset processors. Copper wires cannot scale to meet the demands of modern computing architectures, creating a bottleneck for data transfer. </problem> <solution> NcodiN develops optical interposers that use light to enable ultra-fast and energy-efficient die-to-die interconnects, unlocking the full scalability of multi-chiplet-based HPC processors. Their NConnect technology features the world's smallest laser integrated on silicon, achieving unmatched efficiency and ultra-dense integration. This optical network-on-chip seamlessly integrates with existing chiplet architectures and advanced packaging, delivering high bandwidth and limitless scalability without disrupting existing infrastructure. NcodiN's solution overcomes the limitations of copper interconnects, enabling the next generation of AI computing with increased reach, low power consumption, and unprecedented bandwidth. </solution> <features> - Optical interposer technology for die-to-die interconnects - NConnect: Optical network-on-chip - World's smallest laser integrated on silicon - Bandwidth density: ≥60 Tbps/mm² - Energy efficiency: <0.1 pJ/bit - Reach: ≥50 mm - Seamless integration with existing chiplet architectures and advanced packaging </features> <target_audience> NcodiN's primary customers are chipmakers and system integrators in the high-performance computing (HPC), artificial intelligence (AI), telecommunications, and smart cities sectors. </target_audience>

What does NcodiN do?

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

Where is NcodiN located?

NcodiN is based in Palaiseau, France.

When was NcodiN founded?

NcodiN was founded in 2023.

How much funding has NcodiN raised?

NcodiN has raised 3780000.

Location
Palaiseau, France
Founded
2023
Funding
3780000
Employees
16 employees

Find Investable Startups and Competitors

Search thousands of startups using natural language

NcodiN

⚠️ AI-generated overview based on web search data – may contain errors, please verify information yourself! You can claim this account with your email domain to make edits.

Executive Summary

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

ncodin.com1K+
cb
Crunchbase
Founded 2023Palaiseau, France

Funding

$

Estimated Funding

$3M+

Team (15+)

No team information available.

Company Description

Problem

High-performance computing (HPC) and artificial intelligence (AI) applications are increasingly limited by the bandwidth and energy consumption of traditional electrical interconnects between dies in multi-chipset processors. Copper wires cannot scale to meet the demands of modern computing architectures, creating a bottleneck for data transfer.

Solution

NcodiN develops optical interposers that use light to enable ultra-fast and energy-efficient die-to-die interconnects, unlocking the full scalability of multi-chiplet-based HPC processors. Their NConnect technology features the world's smallest laser integrated on silicon, achieving unmatched efficiency and ultra-dense integration. This optical network-on-chip seamlessly integrates with existing chiplet architectures and advanced packaging, delivering high bandwidth and limitless scalability without disrupting existing infrastructure. NcodiN's solution overcomes the limitations of copper interconnects, enabling the next generation of AI computing with increased reach, low power consumption, and unprecedented bandwidth.

Features

Optical interposer technology for die-to-die interconnects

NConnect: Optical network-on-chip

World's smallest laser integrated on silicon

Bandwidth density: ≥60 Tbps/mm²

Energy efficiency: <0.1 pJ/bit

Reach: ≥50 mm

Seamless integration with existing chiplet architectures and advanced packaging

Target Audience

NcodiN's primary customers are chipmakers and system integrators in the high-performance computing (HPC), artificial intelligence (AI), telecommunications, and smart cities sectors.

Want to add first party data to your startup here or get your entry removed? You can edit it yourself by logging in with your company domain.