The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.
Funding
$5.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Integrating photonic integrated circuits (PICs) into functional modules requires precise and cost-effective assembly and packaging, which presents a significant challenge for volume manufacturing. Connecting PICs to components like optical fibers, RF electronics, and other micro-optics with high accuracy is crucial but complex.
Solution
PHIX Photonics Assembly provides comprehensive assembly and packaging services for PICs, enabling scalable production volumes for optoelectronic modules and components. As an independent packaging foundry, PHIX specializes in hybrid integration, optical assembly, and electrical connectivity, supporting all major PIC technology platforms, including indium phosphide, silicon photonics, and silicon nitride. The company offers solutions ranging from prototype packages to volume packages and contract manufacturing, ensuring a seamless transition from design to mass production. By offering design support early in the chip development phase, PHIX optimizes manufacturability and facilitates the integration of PICs into various applications, such as LiDAR systems, 5G and beyond, medical devices, and quantum computing.
Target Audience
The primary target audience includes companies developing PIC-based solutions for LiDAR systems, 5G and beyond communication, medical devices, quantum computing, and other advanced technology applications.
Features
- Prototype packages for quick and affordable testing of PIC-enabled modules, including housing with electrical connections, optical interfaces, and thermal management
- Volume packages for designing and assembling modules for telecommunications, industrial, automotive, medical, space, and defense applications
- Contract manufacturing services, offering dedicated production steps such as wafer dicing, die bonding, wire bonding, and fiber attachment
- Fiber array manufacturing with sub-micron fiber spacing accuracy and uniform fiber core center line
- Lensed fiber arrays with 3D printed lenses for free space coupling to PICs or other components
- Hybrid assembly with sub-micron precision using active alignment for edge-coupling or vertical coupling of different material platforms
- Capability to co-package multiple PIC technologies into one product
- Hermetic sealing for modules using adhesive bonding or laser welding