The startup develops semiconductor packaging and assembly technology that utilizes single or multiple viscosity materials such as polymers, metals, and ceramics to enhance electronic miniaturization and sustainability. Their method combines the productivity of screen printing with high-quality resolution and industrial production speed, facilitating semiconductor packaging re-shoring.
Funding
$29.9M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Traditional electronics manufacturing methods often struggle to balance high-resolution requirements with the need for high-speed, high-yield production using standard industrial materials. Existing processes can also generate significant waste and involve toxic substances, increasing environmental concerns and costs.
Solution
ioTech provides an additive manufacturing technology called Continuous Laser Assisted Deposition (C.L.A.D.) for electronics and other industries. This system micro-coats materials onto a foil, then uses pulse-laser jetting to deposit them onto a substrate. Integrated in-line post-processing, including UV and thermal curing as well as laser sintering and ablation, enables rapid production of end-use parts in a single step. The technology supports a wide range of industry-certified materials, including polymers, adhesives, metal pastes, and ceramic pastes, offering an eco-friendly alternative to traditional methods with less toxicity and waste. C.L.A.D. enables manufacturers to achieve previously unattainable designs with high resolution and control over material deposition, leading to improved production yields.
Target Audience
The primary target audience includes manufacturers in the SMT, PCB, OSAT, and EMS sectors, as well as those involved in advanced packaging, HDI PCB manufacturing, and other electronics applications.
Features
- Continuous Laser Assisted Deposition (C.L.A.D.) technology for high-resolution, high-speed additive manufacturing
- Compatibility with a wide range of standard industrial materials, including polymers, adhesives, metal pastes, and ceramic pastes
- Multi-function in-line post-processing capabilities, including UV and thermal curing, and laser sintering and ablation
- Contact-free, mask-free, and nozzle-free deposition process, minimizing maintenance and clogging issues
- Micron-level precision in material coating and jetting with continuous closed-loop monitoring
- Ability to produce complex, multi-material designs with exceptional resolution (up to 20μm)
- Eco-friendly process with reduced toxicity and waste compared to traditional manufacturing methods