Eliyan manufactures semiconductor interconnects using its NuLink™ PHY technology, which enables the creation of large System-in-Package (SiP) designs on standard packaging. This technology enhances AI performance by up to 10 times and increases bandwidth, power efficiency, and SiP size by up to four times, effectively addressing the limitations imposed by the memory wall in chiplet-based systems.
Funding
$140M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
SCTG+2Founders
Product
Problem
Chiplet-based systems face limitations due to the "memory wall," where interconnect bandwidth and power efficiency constrain overall performance, especially in AI applications requiring high data throughput. Traditional packaging methods struggle to support the increasing size and complexity of these multi-die systems.
Solution
Eliyan addresses these challenges with its NuLink™ PHY technology, a chiplet interconnect solution designed for large System-in-Package (SiP) designs using standard packaging. NuLink™ enhances AI performance by improving bandwidth, power efficiency, and SiP size. The technology enables simultaneous bi-directional switching, optimizing data flow between chiplets and memory. By overcoming the memory wall, Eliyan's interconnects facilitate the creation of more powerful and efficient multi-die systems.
Target Audience
The primary target audience includes semiconductor manufacturers and system designers developing high-performance computing and AI solutions that utilize chiplet architectures.
Features
- NuLink™ PHY technology for high-performance chiplet interconnects
- Supports large System-in-Package (SiP) designs on standard packaging
- Simultaneous bi-directional switching for optimized data flow
- UCIe-compliant chiplet interconnect technology
- Achieves up to 40 Gbps bandwidth
- Designed for power efficiency