Lux Semiconductors develops metal substrates and interposers that enhance thermal dissipation and reduce warpage in system-in-package designs, addressing the limitations of traditional glass and organic substrates. Their technology enables higher performance in chip packaging, supporting the demands of larger superchips in applications such as artificial intelligence and autonomous vehicles.
Funding
$3.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
HVLTLMNSFounders
Product
Problem
Traditional glass and organic substrates used in system-in-package (SiP) designs can limit thermal dissipation and cause warpage, hindering the performance of increasingly large and complex superchips. These limitations pose challenges for applications requiring high computational power and reliability.
Solution
Lux Semiconductors develops metal substrates and interposers designed to enhance thermal management and reduce warpage in advanced SiP designs. Their metal substrates offer significantly higher thermal conductivity and greater resistance to warpage compared to conventional glass and organic alternatives. By using a rigid, low-CTE metal substrate, designers can achieve optimal flatness across varying temperatures and deliver ample low-loss power. This technology enables true 3D SiP designs, allowing for vertical stacking of components like memory and processors without heat buildup limitations. The metal package also acts as an electromagnetic shield, eliminating cross-talk within the substrate.
Target Audience
The primary target audience includes manufacturers in fields such as artificial intelligence, autonomous vehicles, and advanced healthcare, as well as defense contractors requiring high-performance, reliable packaging solutions.
Features
- Patented coaxial through-metal vias that eliminate cross-talk within the substrate.
- Integrated ground metal for low-loss power delivery networks.
- Compatibility with standard EDA tools like Cadence APD or Siemens XPD.
- Simple conversion process to replace the core layer of existing designs.
- Reduced layer counts by replacing two laminate layers with a single metal core.
- Drop-in replacement for organic substrates.
- Manufacturing in the USA.