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IC Photonics

ICPHOTONICS develops high-performance optical interconnect solutions essential for next-generation AI infrastructure. The company integrates advanced CMOS DSP, ELS, and Chiplet-on-Package (CPO) technologies utilizing Silicon Photonics (SiPh). These solutions enable faster and more efficient data transfer within demanding data center environments.

San Francisco, United StatesFounded 20243100+ followers
Updated 4 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Product

Problem

Increasing demands for data processing in data centers and AI applications require higher bandwidth and lower power consumption in chip-to-chip, blade-to-blade, and rack-to-rack communication. Existing interconnect solutions struggle to efficiently handle the escalating data rates, leading to performance bottlenecks and increased operational costs.

Solution

IC Photonics develops Co-Packaged Optics (CPO) technology that enhances optical interconnects by integrating CMOS DSP, External Laser Source (ELS), and Silicon Photonics (SiPh). This approach delivers high-bandwidth, low-power optical input/output (I/O) solutions, improving communication efficiency and scalability. By embedding RF functions into CMOS chips, IC Photonics reduces chiplet count and lowers latency, enabling faster and more efficient data transfer within data centers and AI systems.

Target Audience

IC Photonics primarily targets data centers and AI application developers seeking high-bandwidth, low-power optical interconnect solutions.

Features

  • Co-Packaged Optics (CPO) integrating CMOS DSP, ELS, and SiPh for high-density optical interconnects
  • High-speed data rates of 6.4Tb/s (200G/lane) and 12.8Tb/s (400G/lane) with a roadmap to 400G+ per I/O
  • Fully integrated RF functions into CMOS chip, embedding TIA and Driver into ADC and DAC
  • Low latency communication with <5ns + Time of Flight (TOF) latency
  • High-reliability External Laser Source (ELS) designed for maximized yield, reliability, and power efficiency for 256+ I/Os
  • Scalable reach enabling communications ranging from mm to km
  • Power efficiency of 5pJ/b with a roadmap to scale down to < 3pJ/b
This profile is AI-generated and may contain inaccuracies.