Analogport provides custom silicon IP and design services for ultra‑fast, low‑latency interconnects between GPUs, memory, and compute modules, supporting standards such as PCIe Gen3‑6, CXL, UCIe, Ethernet, and DDR. Their solutions are PPA‑optimized for advanced process nodes (3 nm GAAFET, FinFET, FDSOI) and include modular, security‑first chiplet interfaces that can be delivered from prototype to high‑volume production.
Funding
Funding not disclosed
Founders
Product
Problem
Designing AI accelerators and high-performance computing systems requires ultra-fast, low-latency data movement between GPUs, memory, and other compute modules, but existing interconnect solutions often fall short in bandwidth, power efficiency, or scalability across advanced process nodes.
Solution
Analogport delivers custom silicon IP and design services that enable massive data transfer between GPUs and memory using PCIe Gen3‑6, CXL, UCIe, and high‑speed parallel interfaces such as PAM2‑4. Their engineering team optimizes power, performance, and area (PPA) for die‑to‑die and board‑level connections, supporting the latest GDDR6/GDDR7, DDR, Ethernet, and storage protocols. By leveraging proprietary design flows and deep expertise in FinFET, SOI, and GAA FET technologies, Analogport provides modular, security‑first accelerator solutions that can be integrated into both low‑volume prototypes and high‑volume production. The resulting interconnects deliver the bandwidth and latency needed for large AI models while maintaining power efficiency and manufacturability at leading process nodes.
Target Audience
Analogport’s primary customers are semiconductor companies and system integrators developing AI accelerators, high‑performance compute platforms, and data‑center hardware that require custom high‑speed interconnect solutions.
Features
- PPA‑optimized high‑speed serial and parallel interfaces (PCIe Gen3‑6, CXL, UCIe, Ethernet, DDR, USB) for die‑to‑die, chip‑to‑chip, and backplane connectivity
- Support for the latest memory standards (GDDR6, GDDR7, DDR) and storage protocols
- Design methodology that spans advanced nodes (3 nm GAAFET, 16‑3 nm FinFET, 22 nm FDSOI) and ensures high‑volume manufacturability
- Modular chiplet interface IP (UCIe, BOW) enabling flexible system‑level integration of AI accelerators
- Security‑first architecture with built‑in data integrity and isolation features
- End‑to‑end engineering services from custom R&D to production hand‑off