GSME offers a full‑stack semiconductor services platform that handles custom chip design, multi‑project wafer (MPW) access, and end‑to‑end manufacturing, enabling customers to bring RF, power‑management, and mixed‑signal ICs to market faster and more affordably. Their services include architecture definition, RTL coding, verification, tape‑out, wafer fab selection, packaging, testing, and logistics, as well as technology incubation for next‑generation semiconductor innovations.
Funding
$8M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Developing custom silicon requires specialized expertise, expensive fabrication facilities, and long lead times, which makes it difficult for companies—especially startups and small‑to‑medium enterprises—to bring new RF, power‑management or other mixed‑signal ICs to market quickly and affordably.
Solution
GSME provides an end‑to‑end semiconductor services platform that covers custom chip design, multi‑project wafer (MPW) access, full‑scale manufacturing, and technology incubation. Their chip‑design service guides customers from architecture specification through RTL coding, verification, DFT, place‑and‑route, and tape‑out sign‑off, ensuring performance and manufacturability. MPW services share wafer costs among multiple projects, giving designers access to advanced process nodes at reduced expense and with faster turnaround. The manufacturing offering handles wafer fabrication, packaging, test development, qualification, and logistics, delivering a complete production flow from prototype to volume. Advanced technology incubation accelerates innovation by providing expertise and resources for next‑generation RF front‑ends, power‑management ICs, and other specialized IP.
Target Audience
Primary customers are semiconductor design houses, system companies, and hardware startups that need custom ASICs, RF front‑ends, or power‑management solutions, as well as firms seeking affordable MPW access and turnkey manufacturing.
Features
- Full‑stack chip design services including architecture definition, RTL coding, verification, DFT, synthesis, place‑and‑route, and physical verification
- Multi‑project wafer (MPW) platform that enables cost‑sharing, design flexibility, and access to cutting‑edge process technologies
- End‑to‑end manufacturing capabilities covering wafer fab selection, packaging, test program development, qualification per JEDEC standards, and logistics support
- Power‑management IC portfolio featuring high‑efficiency buck converters, LDO regulators, multi‑rail PMICs, and dynamic scaling voltage technology
- RF front‑end modules and mmWave IP designed for 5G/6G connectivity, integrated with custom silicon solutions
- Advanced control architectures (Voltage Mode, Current Mode, Adaptive Constant On‑Time) for precise power regulation and fast transient response
- Technology incubation services that provide expert guidance and resources to accelerate development of next‑generation semiconductor products