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Primemas

Primemas develops low-cost, high-performance Hub Chiplet SoC modules that utilize high-bandwidth, low-latency D2D interfaces for efficient infrastructure sharing with custom partner dies. This technology reduces the design and manufacturing time of custom SoCs by up to 90%, catering to diverse markets such as CXL, AI, Crypto, and Data Analytics.

East New York, United StatesFounded 202224700+ followers
Updated 4 months ago

Funding

$10K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.

Funding rounds are not available yet.

Founders

Product

Problem

The design and manufacturing of custom System-on-Chips (SoCs) can be a lengthy and expensive process, requiring significant time and resources for development and production. This complexity poses a barrier to entry for companies seeking tailored silicon solutions for specific applications.

Solution

Primemas offers Hub Chiplet SoC modules that leverage high-bandwidth, low-latency Die-to-Die (D2D) interfaces to facilitate efficient infrastructure sharing with custom partner dies. This approach significantly reduces the time and cost associated with designing and manufacturing custom SoCs, enabling faster development cycles and quicker time-to-market. By providing pre-validated and reusable chiplet components, Primemas empowers companies to create customized silicon solutions without the need for extensive in-house expertise or lengthy development timelines. The technology allows for flexible integration of specialized functionalities, catering to diverse markets and application-specific requirements.

Target Audience

The primary target audience includes companies in CXL, AI, Crypto, and Data Analytics markets seeking custom silicon solutions with reduced development time and cost.

Features

  • High-bandwidth, low-latency D2D interfaces for efficient communication between chiplets
  • Modular design enabling flexible integration of custom partner dies
  • Pre-validated and reusable chiplet components for faster development
  • Support for various interconnect standards, including CXL
  • Reduced design and manufacturing time for custom SoCs
This profile is AI-generated and may contain inaccuracies.