About Chipletz

Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer, enhancing die-to-die bandwidth and external I/O speeds. This approach improves power integrity and system performance, addressing the limitations of traditional semiconductor scaling in AI and high-performance computing applications.

```xml <problem> Traditional semiconductor scaling faces limitations in enhancing die-to-die bandwidth and external I/O speeds, hindering performance gains in AI and high-performance computing applications. Interposer-based integration methods add complexity and can compromise power integrity. </problem> <solution> Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer. This approach enhances die-to-die bandwidth and external I/O speeds, improving power integrity and overall system performance. By eliminating the interposer, Smart Substrate™ allows for denser and faster on-package interconnects, enabling superior interconnectivity between chiplets. The technology facilitates faster high-speed I/O to external compute modules and peripherals, addressing the limitations of traditional scaling methods. Smart Substrate™ reimagines AI and HPC systems from the ground up, scaling performance beyond Moore's Law. </solution> <features> - Interposer-less integration of multiple chiplets - Enhanced die-to-die bandwidth through denser on-package interconnects - Faster high-speed I/O to external compute modules and peripherals - Improved power integrity and total system power - Seamless integration of diverse chiplets, including compute, I/O, security, and HBM </features> <target_audience> The primary target audience includes companies developing AI and high-performance computing systems seeking to overcome the limitations of traditional semiconductor scaling. </target_audience> ```

What does Chipletz do?

Where is Chipletz located?

Chipletz is based in Austin, United States.

When was Chipletz founded?

Chipletz was founded in 2021.

How much funding has Chipletz raised?

Chipletz has raised 32250000.

Location

Austin, United States

Founded

2021

Funding

32250000

Employees

22 employees

Major Investors

SKC

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Chipletz

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Executive Summary

chipletz.com 700+

Crunchbase

Founded 2021 – Austin, United States

Funding

Estimated Funding

$20M+

Major Investors

SKC

Team (20+)

No team information available.

Company Description

Problem

Traditional semiconductor scaling faces limitations in enhancing die-to-die bandwidth and external I/O speeds, hindering performance gains in AI and high-performance computing applications. Interposer-based integration methods add complexity and can compromise power integrity.

Solution

Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer. This approach enhances die-to-die bandwidth and external I/O speeds, improving power integrity and overall system performance. By eliminating the interposer, Smart Substrate™ allows for denser and faster on-package interconnects, enabling superior interconnectivity between chiplets. The technology facilitates faster high-speed I/O to external compute modules and peripherals, addressing the limitations of traditional scaling methods. Smart Substrate™ reimagines AI and HPC systems from the ground up, scaling performance beyond Moore's Law.

Features

Interposer-less integration of multiple chiplets

Enhanced die-to-die bandwidth through denser on-package interconnects

Faster high-speed I/O to external compute modules and peripherals

Improved power integrity and total system power

Seamless integration of diverse chiplets, including compute, I/O, security, and HBM

Target Audience

The primary target audience includes companies developing AI and high-performance computing systems seeking to overcome the limitations of traditional semiconductor scaling.