Top 50 3d Ic Packaging

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer, enhancing die-to-die bandwidth and external I/O speeds. This approach improves power integrity and system performance, addressing the limitations of traditional semiconductor scaling in AI and high-performance computing applications.

Acacia provides coherent optical transceivers and client‑optics modules that integrate DSP ASICs, silicon‑photonic PICs, and 3D siliconization packaging into ultra‑compact, low‑power devices supporting 400 Gb/s to 1.2 Tb/s per wavelength. The portfolio includes MSA‑compliant pluggable formats (CFP, CFP2, OSFP, QSFP‑DD) and PAM4‑based client optics for metro, long‑haul, submarine and data‑center interconnect applications, enabling carriers and equipment manufacturers to increase capacity while reducing power and cost per bit.

Eliyan provides the NuLink™ PHY, a die-to-die physical layer enabling high-speed, low-power interconnects between chiplets for AI and HPC systems. This UCIe-compliant technology achieves up to 64 Gbps per bump, overcoming bandwidth limitations in multi-die architectures on standard and advanced packaging.

SEMRON develops a 3D-scalable AI inference chip using its proprietary CapRAM™ technology, which integrates compute-in-memory architecture to enhance energy efficiency and parameter density for AI applications. This technology addresses the high costs and power consumption of traditional AI chips, enabling efficient deployment of generative AI models directly on edge devices like smartphones and wearables.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

Atlas Magnetics develops semiconductor packaging materials that integrate passive components within integrated circuit (IC) substrates, enabling the production of custom ASICs in just 10 minutes without non-recurring engineering costs. This approach reduces the number of components on system boards, addressing the challenges of space and cost in modern electronics design.

Lightmatter develops photonic processors that utilize advanced interconnect and packaging technology to enhance computing speed and energy efficiency for AI applications. By addressing the limitations of traditional silicon chips, their solutions enable scalable, high-bandwidth connections between numerous chips, facilitating the pursuit of artificial general intelligence (AGI).

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

ATLANT 3D utilizes its proprietary Direct Atomic Layer Processing (DALP®) technology to enable atomic-scale manufacturing of microelectronics and photonics, facilitating precise material deposition across over 450 materials. This technology addresses the inefficiencies in traditional manufacturing processes by reducing waste and production timelines while ensuring compatibility with semiconductor industry standards.

Nearfield Instruments provides high-throughput scanning-probe metrology systems for semiconductor manufacturing. Its solutions enable non-destructive, atomic-level measurement of 3D nanostructures, facilitating real-time process control for advanced logic and memory chips.

The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.

This startup manufactures multi-material 3D printing technology that utilizes electrochemistry to fabricate micro and nano-scale electronics, including sensors, photovoltaics, batteries, and PCBs. By enabling in-house production of these devices, the company allows clients to design and develop electronic products without reliance on external manufacturing facilities.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

Thintronics Inc. develops high-performance interconnect insulators that optimize data transfer rates up to 224 Gbps while minimizing power consumption in advanced computing and networking applications. Their technology addresses the need for reduced channel loss and compact form factors, enabling efficient operation in AI data centers and 5G/6G infrastructure.

Irradiant Technologies develops a 3D nano-optics and photonics fabrication platform that utilizes implosion fabrication lithography to create complex, non-contiguous geometries at nanoscale. This technology enables rapid prototyping and mass production of advanced optical components, addressing the challenges of miniaturization and integration in light-based systems.

DreamBig Semiconductor offers a Chiplet platform with SMARTNIC-DPU solutions designed for low latency and high throughput in AI, data centers, and storage acceleration. Their technology addresses the need for efficient data processing and inherent security in high-demand computing environments.

This company designs custom Application-Specific Integrated Circuits (ASICs) for high-performance computing (HPC) in AI and automotive Advanced Driver-Assistance Systems (ADAS). They specialize in chiplet architectures to optimize performance and efficiency for specific applications.

Lightspeed Photonics develops modular optoelectronic processors and interconnects, specifically the LightSiP™ system, which combines reconfigurable electronics with high data rate free-space optical interconnects for efficient chip-to-chip communication. This technology reduces data latency and power consumption while increasing data bandwidth and performance, addressing the demands of data centers and near-edge computing environments.

UpNano manufactures high-resolution 3D printing systems utilizing two-photon polymerization (2PP) technology to produce microparts with feature sizes below 100 nm. Their service addresses the need for efficient, scalable production of complex microstructures in industries such as electronics, optics, and medtech.

Avicena Tech manufactures microLED-based optical interconnects that provide ultra-low power and high bandwidth for chip-to-chip communications, addressing the need for efficient data transfer in high-performance computing and cloud applications. Their technology enables multi-terabit per second data rates while minimizing energy consumption, making it suitable for industries such as autonomous vehicles and aerospace.

Onto Innovation offers metrology, inspection, and software solutions for semiconductor manufacturing. Their technologies provide process control and yield optimization for advanced devices, from wafers to packaging.

Corintis develops microfluidic cooling solutions that integrate microscopically small cooling channels within semiconductor chips, enabling heat extraction that is ten times more effective and over fifty times more energy-efficient than current alternatives. This technology addresses the critical thermal limitations faced by high-performance chips in data centers, facilitating increased computational power while reducing energy consumption.

Zinite develops a high-performance thin-film transistor technology that enables the construction of 3D chips, maximizing performance per area within existing product real estate. This approach allows manufacturers to enhance chip functionality without requiring new fabrication facilities, addressing the limitations of traditional 2D chip designs in the Post-Moore Era.

This company manufactures integrated circuits that combine compound semiconductors and silicon CMOS technology. Their chips are used in lighting systems, power electronics, and DC-to-DC converters, enabling improved performance and new functionalities in electronic applications.

Primemas develops low-cost, high-performance Hub Chiplet SoC modules that utilize high-bandwidth, low-latency D2D interfaces for efficient infrastructure sharing with custom partner dies. This technology reduces the design and manufacturing time of custom SoCs by up to 90%, catering to diverse markets such as CXL, AI, Crypto, and Data Analytics.

Sapphiretek designs and manufactures advanced integrated circuits for high‑performance computing and power‑management applications. Leveraging cutting‑edge semiconductor process technologies, its ICs improve efficiency and speed in demanding electronic systems.

Lumai develops a 3D optical processor that significantly enhances AI performance in data centers while achieving a 90% reduction in power consumption compared to traditional silicon-based solutions. This technology addresses the escalating demand for AI processing power by providing a scalable, energy-efficient alternative that lowers both capital and operational costs.

PICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.

The startup develops semiconductor packaging and assembly technology that utilizes single or multiple viscosity materials such as polymers, metals, and ceramics to enhance electronic miniaturization and sustainability. Their method combines the productivity of screen printing with high-quality resolution and industrial production speed, facilitating semiconductor packaging re-shoring.

Lux Semiconductors develops metal substrates and interposers that enhance thermal dissipation and reduce warpage in system-in-package designs, addressing the limitations of traditional glass and organic substrates. Their technology enables higher performance in chip packaging, supporting the demands of larger superchips in applications such as artificial intelligence and autonomous vehicles.

R&D Altanova provides end-to-end test interface solutions for semiconductor automated test equipment (ATE). They design, simulate, and fabricate probe cards, load boards, and multi-layer organic (MLO) substrates to enable testing of advanced ICs at fine wafer nodes and complex package configurations.

This platform leverages generative AI to facilitate the online design of custom packaging, significantly reducing the time required for production. It addresses the inefficiencies and high costs inherent in traditional packaging design processes by providing a user-friendly interface for tailored solutions.

The startup develops 3D Ferroelectric RAM technology that offers high-capacity, high-bandwidth, and low-power memory solutions for the DRAM market. This technology enables significant enhancements in data access speed while minimizing energy consumption, addressing the growing demand for efficient memory in data-intensive applications.

IC Photonics develops Co-Packaged Optics (CPO) technology that integrates proprietary CMOS and pump laser components with silicon photonics to enhance optical interconnects in data centers and AI applications. This technology delivers high-bandwidth, low-power optical input/output solutions, improving communication efficiency between chips, blades, and racks.

Terecircuits develops specialized materials and processes for micron-scale assembly and mass transfer in advanced electronics, enabling the production of components smaller than a grain of pollen with 500-nanometer accuracy. This technology addresses the need for faster and more precise manufacturing methods, achieving assembly speeds 1000 times faster than current best practices.

Precisement specializes in precision robotics and laser processing for semiconductor and optoelectronics packaging, focusing on microscale component handling, assembly, and integration into System-in-Package solutions. The company addresses the need for enhanced manufacturing traceability and quality control in the production of advanced deep-tech applications, particularly in healthcare and medical devices.

Elektrum Technologies provides a hyper‑scalable additive manufacturing platform that prints electronic‑grade materials using combined powder‑bed and extrusion processes. The system links CAD files to optimized print parameters, delivering tunable dielectric, conductive and thermal properties while eliminating molds and reducing material waste, enabling OEMs and contract manufacturers to move from prototyping to high‑volume production without retooling.

TactoTek develops and licenses in-mold structural electronics (IMSE) technology, which integrates electronic components directly into molded plastic parts. This technology enables the production of interactive and smart products, enhancing functionality while reducing assembly complexity and material waste.

Hanmi Semiconductor specializes in advanced semiconductor manufacturing equipment, offering solutions for HBM TC bonding and various wafer processing needs. Their product lineup includes precision bonders, vision placement systems, and micro sawing equipment designed for high-volume semiconductor production. The company provides essential tools for advanced packaging and chip assembly processes.

Photonect develops advanced packaging and interconnect solutions for integrated photonics, utilizing soldering techniques to enhance optical connections. Their technology achieves four times the power efficiency and ten times faster production speeds, addressing the need for more sustainable and efficient data center operations.

Ferric provides integrated voltage regulators that combine the power controller, FETs, magnetic inductor and decoupling capacitors into a single silicon package using thin‑film ferromagnetic technology. The monolithic IVRs deliver 90‑93 % efficiency, up to 4.5 A/mm² current density and regulation bandwidths above 10 MHz, reducing component count by up to 74 % and board area by more than 50 % for AI, HPC and data‑center power delivery. The product line includes single‑phase to 16‑phase converters scalable to >10 kW and supports multiple integration styles and design‑assist tools.

Scintil Photonics develops silicon photonic integrated circuits (PICs) that integrate DFB lasers and optical amplifiers to enhance performance and energy efficiency for data centers, AI/ML applications, and 5G networks. Their technology enables high-speed optical interconnects, supporting data rates of 800Gbps and beyond, while simplifying packaging and reducing power consumption.

Silicon Integrated designs and manufactures high-performance mixed-signal chips, including smart audio amplifiers and Time-of-Flight sensors utilizing back-illuminated (BSI) technology. These products enhance device capabilities in applications such as artificial intelligence, facial recognition, and 3D imaging, addressing the need for precision and efficiency in modern electronics.

The startup develops holographic packaging technology that utilizes augmented reality to create interactive virtual displays activated by scanning product labels with a smartphone camera. This technology transforms standard packaging into engaging experiences with animated visuals and 3D product representations, enhancing customer interaction and product visibility.

The startup manufactures semiconductor substrates and efficient interposers designed for multi-chipset integration in AI and high-performance computing applications. By enabling larger package areas and superior data rates, the company addresses the need for enhanced computing capabilities in data centers and organizations requiring advanced processing power.

3D Click provides an online platform for creating and customizing 3D packaging solutions, enabling clients to design and personalize packaging in real-time while adhering to production constraints. This technology streamlines the packaging selection process, enhancing sales efficiency and improving customer engagement in the packaging ecosystem.

Glancy3D is an AI-powered SaaS platform that allows users to create, edit, and visualize product packaging designs in 3D without specialized modeling skills. The system automates label generation via conversational prompts and offers instant photorealistic rendering, significantly accelerating time-to-market and reducing packaging development costs for brands.

This company develops chip design and nanotechnology equipment that integrates graphene into CMOS technology for next-generation ICs. Their energy-efficient electronics offer higher current-carrying capacity and simplified manufacturing compared to traditional methods, enabling continued IC scaling.

SILITH designs integrated photoelectric chips using compound semiconductor materials and advanced packaging technologies. Their chiplet-based solutions target applications like FMCW lidar, high-speed data communication, and sensors.