Top 50 3d Ic Packaging

Atlas Magnetics develops semiconductor packaging materials that integrate passive components within integrated circuit (IC) substrates, enabling the production of custom ASICs in just 10 minutes without non-recurring engineering costs. This approach reduces the number of components on system boards, addressing the challenges of space and cost in modern electronics design.

Chipletz offers Smart Substrate™, a technology that integrates multiple chiplets without an interposer, enhancing die-to-die bandwidth and external I/O speeds. This approach improves power integrity and system performance, addressing the limitations of traditional semiconductor scaling in AI and high-performance computing applications.

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

Silicon Box provides semiconductor integration services that encompass full chip design and manufacturing. The company addresses the challenges of complex chip development by offering streamlined processes that enhance design efficiency and reduce time-to-market for semiconductor products.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

Eliyan manufactures semiconductor interconnects using its NuLink™ PHY technology, which enables the creation of large System-in-Package (SiP) designs on standard packaging. This technology enhances AI performance by up to 10 times and increases bandwidth, power efficiency, and SiP size by up to four times, effectively addressing the limitations imposed by the memory wall in chiplet-based systems.

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

This company designs custom Application-Specific Integrated Circuits (ASICs) for high-performance computing (HPC) in AI and automotive Advanced Driver-Assistance Systems (ADAS). They specialize in chiplet architectures to optimize performance and efficiency for specific applications.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

Irradiant Technologies develops a 3D nano-optics and photonics fabrication platform that utilizes implosion fabrication lithography to create complex, non-contiguous geometries at nanoscale. This technology enables rapid prototyping and mass production of advanced optical components, addressing the challenges of miniaturization and integration in light-based systems.

The startup provides integrated-circuit design and manufacturing services, including chip design, technology incubation, and multi-project wafer (MPW) services, to semiconductor and systems companies. By offering power management ICs and RF front-end products, the company enables design firms to achieve cost-effective solutions and faster time-to-market for energy-efficient and reliable electronic devices.

This startup manufactures multi-material 3D printing technology that utilizes electrochemistry to fabricate micro and nano-scale electronics, including sensors, photovoltaics, batteries, and PCBs. By enabling in-house production of these devices, the company allows clients to design and develop electronic products without reliance on external manufacturing facilities.

The startup develops silicon technology that enables engineers to customize designs and streamline the silicon fabrication process, significantly reducing time-to-silicon for new generations of products. By codifying design methodologies, the technology minimizes risks associated with silicon engineering, allowing for faster innovation cycles.

ATLANT 3D utilizes its proprietary Direct Atomic Layer Processing (DALP®) technology to enable atomic-scale manufacturing of microelectronics and photonics, facilitating precise material deposition across over 450 materials. This technology addresses the inefficiencies in traditional manufacturing processes by reducing waste and production timelines while ensuring compatibility with semiconductor industry standards.

The startup develops a deep-tech semiconductor chipset that enhances data movement by bringing data processing closer to computation. This technology improves the execution speed of large language models while increasing data privacy and energy efficiency.

Avicena Tech manufactures microLED-based optical interconnects that provide ultra-low power and high bandwidth for chip-to-chip communications, addressing the need for efficient data transfer in high-performance computing and cloud applications. Their technology enables multi-terabit per second data rates while minimizing energy consumption, making it suitable for industries such as autonomous vehicles and aerospace.

SkyWater Technology is a semiconductor manufacturer specializing in advanced fabrication processes for integrated circuits. The company provides reliable and cost-effective solutions for the semiconductor supply chain, addressing the growing demand for high-performance chips in various applications.

Inversion Semiconductor is developing a lithography platform to create advanced semiconductors. Their technology aims to enable the production of next-generation microchips with improved performance and efficiency.

Lightspeed Photonics develops modular optoelectronic processors and interconnects, specifically the LightSiP™ system, which combines reconfigurable electronics with high data rate free-space optical interconnects for efficient chip-to-chip communication. This technology reduces data latency and power consumption while increasing data bandwidth and performance, addressing the demands of data centers and near-edge computing environments.

Aantaric Technologies specializes in custom integrated circuit (IC) development, focusing on analog and mixed-signal designs for applications such as power management and automotive controllers. The startup addresses the need for efficient product development in the semiconductor industry by providing end-to-end solutions that accelerate electronic product design and enhance system performance.

Arteris provides semiconductor system IP and SoC integration automation tools to accelerate the development of advanced systems-on-chip. Their silicon-proven Network-on-Chip (NoC) interconnect IP and automation software help companies achieve higher performance, reduce power consumption, and shorten time-to-market.

The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.

Onto Innovation offers metrology, inspection, and software solutions for semiconductor manufacturing. Their technologies provide process control and yield optimization for advanced devices, from wafers to packaging.

Zinite develops a high-performance thin-film transistor technology that enables the construction of 3D chips, maximizing performance per area within existing product real estate. This approach allows manufacturers to enhance chip functionality without requiring new fabrication facilities, addressing the limitations of traditional 2D chip designs in the Post-Moore Era.

Chipletti designs and manufactures advanced node chiplet modules specifically for AI compute applications. Their technology enables high-performance, scalable solutions for demanding AI workloads.

This company manufactures integrated circuits that combine compound semiconductors and silicon CMOS technology. Their chips are used in lighting systems, power electronics, and DC-to-DC converters, enabling improved performance and new functionalities in electronic applications.

Saras Micro Devices manufactures customized, integrated passive modules that enhance power delivery for high-performance computing applications, specifically targeting the demands of artificial intelligence and advanced networking. Their multi-domain capacitor technology simplifies power delivery configurations, improving efficiency and performance in semiconductor devices.

Primemas develops low-cost, high-performance Hub Chiplet SoC modules that utilize high-bandwidth, low-latency D2D interfaces for efficient infrastructure sharing with custom partner dies. This technology reduces the design and manufacturing time of custom SoCs by up to 90%, catering to diverse markets such as CXL, AI, Crypto, and Data Analytics.

Alphawave IP provides silicon IP solutions for high-speed connectivity, including industry-leading 3nm, 24Gbps UCIe™ subsystems and multi-protocol I/O chiplets. Their technology addresses the need for reliable, low-latency interconnections in data centers, AI infrastructure, and advanced computing applications.

PICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.

Lux Semiconductors develops metal substrates and interposers that enhance thermal dissipation and reduce warpage in system-in-package designs, addressing the limitations of traditional glass and organic substrates. Their technology enables higher performance in chip packaging, supporting the demands of larger superchips in applications such as artificial intelligence and autonomous vehicles.

R&D Altanova provides end-to-end test interface solutions for semiconductor automated test equipment (ATE). They design, simulate, and fabricate probe cards, load boards, and multi-layer organic (MLO) substrates to enable testing of advanced ICs at fine wafer nodes and complex package configurations.

This startup is developing a high-throughput precision system for building AI processors. The system aims to enhance the efficiency and performance of AI hardware development.

The startup develops mathematical modeling and simulation tools specifically for integrated circuit design, enabling engineers to perform complex analysis and optimization tasks efficiently. By reducing the intricacies involved in designing complex systems, the tools help clients accelerate their design processes and improve overall productivity.

AMSIMCEL develops a GPU-powered Physical Verification framework for Integrated Circuits, significantly enhancing verification speed and scalability in chip design. This technology addresses the inefficiencies of traditional CPU-based solutions, delivering performance that is 20 times faster while maintaining accuracy comparable to foundry standards.

IC Photonics develops Co-Packaged Optics (CPO) technology that integrates proprietary CMOS and pump laser components with silicon photonics to enhance optical interconnects in data centers and AI applications. This technology delivers high-bandwidth, low-power optical input/output solutions, improving communication efficiency between chips, blades, and racks.

Terecircuits develops specialized materials and processes for micron-scale assembly and mass transfer in advanced electronics, enabling the production of components smaller than a grain of pollen with 500-nanometer accuracy. This technology addresses the need for faster and more precise manufacturing methods, achieving assembly speeds 1000 times faster than current best practices.

Precisement specializes in precision robotics and laser processing for semiconductor and optoelectronics packaging, focusing on microscale component handling, assembly, and integration into System-in-Package solutions. The company addresses the need for enhanced manufacturing traceability and quality control in the production of advanced deep-tech applications, particularly in healthcare and medical devices.

This startup automates 3D imaging of nanostructures using artificial intelligence and machine learning, converting raw 2D data into accurate 3D models within minutes. Their technology enhances the precision of sample preparation and STEM microscopy, enabling researchers and manufacturers to gain deeper insights into microstructures at the nanoscale.

zGlue provides a platform for on-demand custom chip design, utilizing a unique assembly process that allows for rapid prototyping and production. This technology addresses the need for tailored semiconductor solutions in a market that demands flexibility and speed in hardware development.

IDEADED develops advanced technologies beyond traditional silicon-based semiconductors. They focus on creating novel materials and devices for applications requiring enhanced performance and efficiency.

Dream Photonics specializes in integrated photonics technologies, including PWB laser and fiber integration, to enhance the performance and scalability of electronic devices. The company aims to enable the widespread adoption of photonic solutions across one billion devices, addressing the need for efficient data transmission and processing in modern electronics.

Silicon Integrated designs and manufactures high-performance mixed-signal chips, including smart audio amplifiers and Time-of-Flight sensors utilizing back-illuminated (BSI) technology. These products enhance device capabilities in applications such as artificial intelligence, facial recognition, and 3D imaging, addressing the need for precision and efficiency in modern electronics.

PicoJool provides high-bandwidth, low-latency optical interconnect solutions for hyperscale data centers. Their VCSEL-based, massively parallel optical engines enable co-packaged optics (CPO) and optics-on-board (OBO) architectures, increasing bandwidth and reducing power consumption for AI and cloud infrastructure.

The startup manufactures semiconductor substrates and efficient interposers designed for multi-chipset integration in AI and high-performance computing applications. By enabling larger package areas and superior data rates, the company addresses the need for enhanced computing capabilities in data centers and organizations requiring advanced processing power.

ProChip Solutions designs Analog/Mixed-Signal and RF/mmW/THz integrated circuits to enhance the performance and reliability of wireless and wireline communication systems, biomedical devices, and industrial telemetry. Their semiconductor IPs and system solutions address the need for efficient and high-performance circuit designs in an increasingly complex technology landscape.

3D Click provides an online platform for creating and customizing 3D packaging solutions, enabling clients to design and personalize packaging in real-time while adhering to production constraints. This technology streamlines the packaging selection process, enhancing sales efficiency and improving customer engagement in the packaging ecosystem.

This company develops chip design and nanotechnology equipment that integrates graphene into CMOS technology for next-generation ICs. Their energy-efficient electronics offer higher current-carrying capacity and simplified manufacturing compared to traditional methods, enabling continued IC scaling.

S3 Solutions offers simulation and optimization software for the semiconductor industry. Their tools help engineers design and improve chip performance while reducing development costs.

SILITH designs integrated photoelectric chips using compound semiconductor materials and advanced packaging technologies. Their chiplet-based solutions target applications like FMCW lidar, high-speed data communication, and sensors.