Francisco Rodrigues
CEO
P
PICadvanced
PICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.
- Hardware
- Semiconductor
- Telecommunications
Updated 23 months ago
Funding
Raised to date
$4.7MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Product
Problem
The increasing demand for high-performance optical network systems requires advanced photonic integrated circuits (PICs) with enhanced reliability and quality, but the design, development, and testing processes can be complex and costly. Ensuring the performance and reliability of transceivers and optical components across various platforms (SiPh, InP, etc.) presents a significant challenge.
Solution
PICadvanced offers comprehensive solutions for photonic integrated circuit (PIC) design, development, packaging, and testing, enabling enhanced performance in optical network systems. The company provides simulation, design, and layout capabilities for optical components and architectures on various platforms, including SiPh, InP, Si3N4, and LiNbO3. PICadvanced's innovative packaging platform offers a high degree of freedom for optical and electrical alignment, as well as thermal management. The company also provides full characterization at the component, module, and transceiver level, including quality, stress, and aging tests.
Target Audience
PICadvanced serves the telecommunications market, specifically companies that require PICs for transceiver and optical component production.
Features
- Simulation, design, and layout of optical components and architectures on SiPh, InP, Si3N4, and LiNbO3 platforms
- Innovative packaging platform with high-precision optical and electrical alignment, and thermal management
- Comprehensive testing and characterization at component, module, and transceiver levels
- Automated testing processes for quality, stress, and aging
- Electronic circuit design for optical network system transceivers based on optical sub-assembly components or PICs
- Customized design applications and algorithms based on software, firmware, or digital signal processing (DSP) units
- Productization and production management, from prototypes to automated production lines