SAAZ Micro Inc develops and manufactures space‑qualified image sensors covering UV, visible, NIR and IR spectra, including scanners, star trackers, LiDAR, and AI‑driven neuromorphic event‑based detectors. Their offerings combine advanced technologies such as tiled 3‑D IC packaging and cryogenic cooling with custom sensor packaging and high‑performance readout integrated circuits to meet the stringent performance and durability needs of aerospace, air and ground imaging applications.
Funding
Funding not disclosed
Founders
Product
Problem
Space, airborne, and ground imaging platforms require sensors that can detect ultraviolet, visible, near‑infrared, and infrared light with extremely low noise and high sensitivity, while surviving harsh environmental conditions and strict reliability standards. Conventional sensors often lack the performance, radiation tolerance, or packaging flexibility needed for these demanding applications.
Solution
SAAS Micro provides fully space‑qualified image sensor solutions that cover the UV to IR spectrum, including avalanche photodiodes, high‑performance readout integrated circuits (ROICs), and AI‑driven neuromorphic/event‑based detectors. The company leverages tiled 3D‑IC packaging and cryogenic cooling architectures to achieve ultra‑low noise and high sensitivity. It offers end‑to‑end services from custom sensor design and packaging to production and delivery, ensuring each sensor meets the stringent performance, reliability, and form‑factor requirements of aerospace, air‑borne, and ground‑based platforms.
Target Audience
Primary customers are satellite manufacturers, defense and aerospace contractors, unmanned aerial vehicle (UAV) developers, and high‑performance ground‑based imaging system integrators that require bespoke, radiation‑hard, low‑noise sensors for mission‑critical applications.
Features
- Avalanche photodiodes operating in linear or Geiger mode for high‑gain detection across UV‑IR bands
- High‑performance ROICs delivering low‑noise readout and advanced on‑chip image processing
- Custom sensor packaging and integration using tiled 3D‑IC technology for compact, rugged form factors
- Neuromorphic and event‑based sensors with AI‑enabled real‑time event detection and tracking
- Cryogenic cooling solutions that reduce dark current and enhance sensitivity for low‑light imaging
- LiDAR and 3D imaging sensor modules providing precise depth mapping and object detection