Onto Innovation offers metrology, inspection, and software solutions for semiconductor manufacturing. Their technologies provide process control and yield optimization for advanced devices, from wafers to packaging.
Funding
Funding not disclosed
Founders
Product
Problem
Semiconductor manufacturing processes are complex, with numerous steps requiring precise control to ensure high yields and product reliability. Challenges such as subtle process variations, defectivity, and dimensional inaccuracies can lead to significant yield loss and impact time-to-market for advanced devices.
Solution
Onto Innovation provides a comprehensive suite of metrology, inspection, and advanced software solutions designed to address critical challenges across the semiconductor manufacturing lifecycle. Their offerings enable manufacturers to achieve greater process control, accelerate product development, and optimize yields. By leveraging advanced optical and analytical technologies, Onto Innovation's solutions provide deep insights into process performance, allowing for proactive adjustments and improved manufacturing efficiency. This integrated approach supports the development and high-volume production of next-generation semiconductor devices, from bare wafers to advanced packaging.
Target Audience
The primary customers are semiconductor manufacturers, foundries, integrated device manufacturers (IDMs), and advanced packaging houses involved in the production of logic, memory, RF/MEMS, image sensors, power devices, and other semiconductor components.
Features
- Optical Critical Dimension (OCD) and thin film metrology solutions for advanced device manufacturing, including FinFET, Gate-All-Around (GAA), 3D NAND, and DRAM.
- High-speed, automated defect inspection systems for inline process control, covering bare wafer, patterned wafers, and advanced packaging substrates.
- Photoluminescence (PL) mapping for subsurface defect detection in compound semiconductor materials like SiC and GaN.
- Fourier Transform Infrared (FTIR) spectroscopy for epitaxial film thickness measurement and impurity analysis.
- Lithography systems optimized for advanced packaging applications, including panel-level processing.
- Smart manufacturing software for advanced process control (APC), including Run-to-Run (R2R) and Fault Detection and Classification (FDC) capabilities.
- Data analysis and yield management software to transform inspection and metrology data into actionable process improvements.
- Specialized inspection and metrology solutions for advanced packaging challenges such as die shift, fine pitch RDL, bump metrology, non-visual defects, die crack detection, and substrate warpage.