Top 50 3d Ic Packaging in Europe

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

The startup operates an online marketplace for custom-branded packaging, providing services such as production, engineering, and prototyping, along with supply chain optimization and quality assurance. This platform enables e-commerce brands and retailers to efficiently meet complex packaging requirements while ensuring high-quality standards and streamlined logistics.

SEMRON develops a 3D-scalable AI inference chip using its proprietary CapRAM™ technology, which integrates compute-in-memory architecture to enhance energy efficiency and parameter density for AI applications. This technology addresses the high costs and power consumption of traditional AI chips, enabling efficient deployment of generative AI models directly on edge devices like smartphones and wearables.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.

Besi offers advanced semiconductor assembly equipment for high-volume, high-precision manufacturing. Their solutions support leadframe, substrate, and wafer-level packaging, enabling increased throughput and cost-effectiveness for complex semiconductor devices.

Nearfield Instruments develops high-throughput atomic force microscopy systems for 3D metrology in the semiconductor manufacturing industry, enabling atom-scale resolution at production-level speeds. Their technology addresses the need for precise process control in nano-electronics, enhancing yield and efficiency in semiconductor fabrication.

Irradiant Technologies develops a 3D nano-optics and photonics fabrication platform that utilizes implosion fabrication lithography to create complex, non-contiguous geometries at nanoscale. This technology enables rapid prototyping and mass production of advanced optical components, addressing the challenges of miniaturization and integration in light-based systems.

The startup develops a desktop vacuum stage 3D printer that utilizes molding techniques to create intricate three-dimensional shapes and structures. This technology provides design enthusiasts and 3D artists with a versatile tool that streamlines the production of complex 3D objects.

Yangi develops Cellera™, a proprietary dry-forming technology that utilizes airlaid fiber to produce rigid, cellulose-based packaging, significantly reducing CO₂ emissions by up to 70% compared to traditional plastic options. This solution addresses the urgent need for sustainable packaging alternatives in response to regulatory pressures and consumer demand for eco-friendly products.

This company provides an AI-powered packaging platform called Quartermaster that transforms complexity into clarity for packaging go-to-market strategies. The platform uses AI-driven insights to optimize material scouting, accelerate packing trials, and ensure product-market fit for new packaging solutions. They deliver ready-to-use, sustainable packaging options balanced for performance, cost, and regulatory compliance.

Develops a 3D printing system for manufacturing printed circuit boards (PCBs) that integrates substrate and conductive trace production in a single process using high-viscosity metal and polymer materials. This technology reduces production time to 24 hours, minimizes waste and energy consumption, and eliminates the risks of supply chain disruptions and intellectual property theft associated with traditional PCB manufacturing.

The startup develops laser micromachining technology that automates the connection of electrical components by directly integrating wires and printed electronics onto product surfaces. This technology enhances manufacturing efficiency and product functionality while lowering production costs in the consumer electronics, automotive, and aerospace sectors.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

The startup manufactures automatic optical inspection systems that utilize artificial intelligence and three-dimensional inspection technologies to detect defects in printed circuit boards. By ensuring components meet strict quality standards, the systems help electronics manufacturers increase yield and lower production costs.

Nanusens develops nanoscale sensors and digitally tunable capacitors embedded within CMOS chips, enabling ultra-compact, single-chip solutions that significantly reduce size and cost compared to traditional multi-component sensors. This technology addresses the need for smaller, more efficient sensors in applications like 6G mobile devices, allowing for enhanced functionality and longer battery life.

Eyco designs and manufactures smart circuits for the European microelectronics sector, focusing on enhancing the efficiency and performance of electronic devices. The company addresses the industry's need for reliable and scalable circuit solutions to support the growing demand for advanced electronic applications.

Provides foundry services for thin-film lithium niobate (TFLN) photonic integrated circuits, manufacturing 200 mm wafers in a high-volume, production-ready environment. Enables rapid prototyping and scalable production with a comprehensive process development kit (PDK) supporting multiple bandwidths, delivering high-speed modulation (>100 GHz), low-voltage operation (V𝛑 ≤ 1V), and a wide transparency range (350 - 5,500 nm) for applications in data centers and beyond.

The startup develops a deep-tech semiconductor chipset that enhances data movement by bringing data processing closer to computation. This technology improves the execution speed of large language models while increasing data privacy and energy efficiency.

The startup develops a three-dimensional magnetic field generator that provides wafer-level characterization and testing services for magnetic devices and sensors. This technology enables spintronics-based device testing that meets the electrical probing requirements for mass production, offering a viable alternative to embedded memory in system-on-chip applications.

QuantWare designs and manufactures superconducting quantum processors and related hardware components for the quantum computing ecosystem. Their VIO™ 3D architecture enables faster, scalable quantum computing solutions with high compute power per watt. The company provides commercially available quantum processors, peripherals, and foundry services to support the development of utility-scale quantum computers.

This company develops organ-on-chip devices and assays for drug discovery and diagnostics. They provide products like chip devices for invasion and chemotaxis, alongside CRO services for assessing cell-cell interactions in 3D cell culture using their chip, enhanced by AI-based image analysis for quantitative assessment.

The startup develops a high-resolution 3D printer specifically designed for bioprinting live cells using optimized biocompatible materials. This technology enables the production of sterile support structures for tissue regeneration, facilitating the creation of precise microcomponents essential for cell research.

ChipFlow provides an end-to-end ASIC reference platform that simplifies custom chip development for product companies. This solution includes essential IP and a unified toolchain, allowing engineering teams to tailor designs for automotive, IoT, and consumer electronics applications. The platform accelerates the process, enabling customers to receive finished custom silicon within 12 months.

Chiral provides automated, scalable nanomaterial integration equipment for semiconductor manufacturing. Its proprietary nanoassembly platform precisely assembles high‑quality 1D and 2D materials such as carbon nanotubes, TMDs, and hBN onto chips, replacing liquid‑based deposition methods. This enables chip makers to produce next‑generation transistors with higher performance and industrial‑scale throughput.

3NERGY specializes in the design and manufacturing of power electronics utilizing GaN transistors to enhance power density in applications such as universal chargers, EV chargers, and solar inverters. The company addresses the need for compact and efficient energy conversion solutions in the automotive and medical sectors, significantly reducing size and improving performance compared to traditional systems.

Lumiphase designs and manufactures optical communication chips using Barium Titanate (BTO) and silicon photonics to enable efficient light control for high-speed data transmission. These chips provide compact, low-power solutions that meet the growing demand for cost-effective performance in optical networking applications.

Black Semiconductor utilizes graphene to create ultra-fast, energy-efficient chip networks that enable thousands of chips to communicate as a single unit. This technology addresses the limitations of traditional electronic connections by integrating photonics with electronics, enhancing data communication speed and scalability in the semiconductor and electronics industries.

Ephos designs and manufactures glass-based integrated photonic circuits using proprietary femtosecond laser writing techniques to minimize signal loss in computational devices. This technology enables the development of scalable classical and quantum infrastructures, addressing the need for efficient and high-performance computing solutions.

Movopack provides customizable, reusable packaging systems for retail, e-commerce, and B2B logistics sectors. The company manages the entire circular process, from design and deployment to customer return and redistribution. This service reduces waste and CO₂ emissions while enhancing brand perception for clients.

The startup develops a machine for high-volume spatial atomic layer deposition using super spatial precursor separation technology, which significantly enhances throughput and uptime. This technology enables manufacturers to efficiently integrate atomic layer deposition into their production processes, reducing costs and increasing scalability.

Polariton Technologies manufactures the fastest electro-optic modulators using plasmonic structures integrated into photonic circuits, enabling high-speed data transmission for next-generation transceivers. Their technology addresses the demand for increased bandwidth in telecommunications, achieving speeds of up to 3.2 terabits per second.

ASM provides specialized wafer processing equipment for thin-film deposition, enabling semiconductor manufacturers to produce advanced integrated circuits. Our solutions, including Atomic Layer Deposition (ALD) and Epitaxy, facilitate the creation of smaller, faster, and more powerful chips essential for next-generation devices.

Quantica utilizes advanced inkjet technology to enable digital manufacturing of high-viscosity materials for 2D and 3D applications, allowing for precise, drop-on-demand printing that minimizes waste. This technology provides manufacturers with the ability to customize designs rapidly and efficiently, supporting high-speed production for various industrial sectors.

VOIDLESS designs and manufactures on-demand packaging machinery that produces custom-sized boxes directly within the warehouse environment. This automation eliminates overpackaging and the need for storing multiple standard box formats, significantly reducing material waste and logistics costs. The systems also offer automated dimensional measurement capabilities to optimize inventory and shipping efficiency.

Scalinx designs and industrializes high-performance semiconductor chips for analog signal conversion, featuring proprietary SCCORE™ technology that optimizes size, weight, and power consumption. Their solutions include highly configurable data converter cores and agile RF receivers, addressing the need for efficient, low-noise signal processing in communication, defense, and test measurement applications.

The startup develops silicon carbide substrates that are free from Basal Plane Dislocation (BPD), carbon inclusions, and other defects, ensuring high-quality performance in power devices. These substrates enhance device reliability and efficiency, addressing the critical need for superior semiconductor materials in the industry.

The Magical Mushroom Company produces Mushroom Packaging using mycelium composite technology, which combines mycelium with agricultural waste to create a home-compostable alternative to plastic foams. This solution effectively reduces plastic waste by replacing over 5,000 tonnes of expanded polystyrene (EPS) packaging with sustainable materials since 2020.

3SP Technologies designs and manufactures high-power, energy-efficient III-V semiconductor pump laser modules for optical communications. Their components enhance optical signal-to-noise ratio in data transmission networks, supporting increased data capacity demands.

The startup provides supply chain services focused on circular packaging by utilizing specialized cleaning and preparation technologies for reusable packaging. This approach addresses the issue of packaging waste by enabling brands to efficiently reuse materials, thereby reducing environmental impact.

Aion Silicon provides high-performance semiconductor design services for advanced System-on-Chip (SoC) and ASIC solutions. They guide customers through the entire design process, from architecture to volume production, reducing technical risk and accelerating time-to-market. Their expertise serves diverse industries including AI, automotive, and 5G.

Beneq offers Atomic Layer Deposition (ALD) equipment for precise nanoscale material deposition. Their systems enable the fabrication of high-quality, conformal thin films with atomic-level control, essential for semiconductor manufacturing and advanced coatings.

Lidrotec utilizes ultra-short pulse laser technology to achieve high-precision micro-manufacturing and material modification across various substrates. This technology enhances accuracy and efficiency in industrial applications, meeting the demand for improved processing capabilities.

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

The startup specializes in thermoformed packaging designed for the food packaging industry, focusing on optimizing recycled content and enhancing product recyclability. By providing sustainable packaging solutions, the company aims to reduce plastic usage and improve operational efficiency within the food sector.

Inuru manufactures low-cost, printed OLED technology that can be integrated into packaging, clothing, and medical applications to enhance visibility and communication. This approach addresses the high cost of traditional OLED production, enabling illuminated labels and garments that improve medication adherence and safety while promoting sustainability through recyclable materials.

Skrym provides algorithmic optimization systems that minimize excess air in e-commerce packaging by calculating the best package sizes for various product shapes in real-time. This technology reduces shipping costs and emissions, enhancing logistics efficiency for businesses.

NanoMatter Technologies provides advanced thin film deposition solutions for semiconductor manufacturing. Our proprietary techniques enable atomic-level control over film composition and structure, improving material properties and device performance for next-generation integrated circuits.

Smartkem develops advanced semiconductor inks that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible plastic substrates. This technology reduces manufacturing costs and expands the possibilities for flexible, transparent electronic devices like next-generation displays and sensors.

Photosynthetic provides an advanced 3D lithography technology for additive mass-microfabrication. This solution delivers submicron resolution and high manufacturing efficiency for complex components. The technology supports mass-production scale applications across biotechnology, medical, and aerospace industries.