Top 50 3d Ic Packaging in Europe

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

SEMRON develops a 3D-scalable AI inference chip using its proprietary CapRAM™ technology, which integrates compute-in-memory architecture to enhance energy efficiency and parameter density for AI applications. This technology addresses the high costs and power consumption of traditional AI chips, enabling efficient deployment of generative AI models directly on edge devices like smartphones and wearables.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

Nearfield Instruments provides high-throughput scanning-probe metrology systems for semiconductor manufacturing. Its solutions enable non-destructive, atomic-level measurement of 3D nanostructures, facilitating real-time process control for advanced logic and memory chips.

Black Semiconductor utilizes graphene to create ultra-fast, energy-efficient chip networks that enable thousands of chips to communicate as a single unit. This technology addresses the limitations of traditional electronic connections by integrating photonics with electronics, enhancing data communication speed and scalability in the semiconductor and electronics industries.

The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

Addionics manufactures 3D Current Collectors that enhance battery performance by increasing energy density and reducing material costs through a porous architecture that allows for higher active material loading. This technology enables faster charging and lighter batteries while being compatible with various battery chemistries, addressing the need for cost-effective and efficient energy storage solutions.

Irradiant Technologies develops a 3D nano-optics and photonics fabrication platform that utilizes implosion fabrication lithography to create complex, non-contiguous geometries at nanoscale. This technology enables rapid prototyping and mass production of advanced optical components, addressing the challenges of miniaturization and integration in light-based systems.

The startup develops a three-dimensional magnetic field generator that provides wafer-level characterization and testing services for magnetic devices and sensors. This technology enables spintronics-based device testing that meets the electrical probing requirements for mass production, offering a viable alternative to embedded memory in system-on-chip applications.

The startup develops laser micromachining technology that automates the connection of electrical components by directly integrating wires and printed electronics onto product surfaces. This technology enhances manufacturing efficiency and product functionality while lowering production costs in the consumer electronics, automotive, and aerospace sectors.

Corintis develops microfluidic cooling solutions that integrate microscopically small cooling channels within semiconductor chips, enabling heat extraction that is ten times more effective and over fifty times more energy-efficient than current alternatives. This technology addresses the critical thermal limitations faced by high-performance chips in data centers, facilitating increased computational power while reducing energy consumption.

The startup develops a deep-tech semiconductor chipset that enhances data movement by bringing data processing closer to computation. This technology improves the execution speed of large language models while increasing data privacy and energy efficiency.

The startup manufactures automatic optical inspection systems that utilize artificial intelligence and three-dimensional inspection technologies to detect defects in printed circuit boards. By ensuring components meet strict quality standards, the systems help electronics manufacturers increase yield and lower production costs.

LionVolt is developing a 3D structured lithium-metal anode technology that enhances energy density and charging speed for lithium-ion and sodium-ion batteries. This architecture improves cycle life and safety while enabling scalable, low-cost manufacturing, addressing the limitations of current battery performance.

Aion Silicon provides high-performance semiconductor design services for advanced System-on-Chip (SoC) and ASIC solutions. They guide customers through the entire design process, from architecture to volume production, reducing technical risk and accelerating time-to-market. Their expertise serves diverse industries including AI, automotive, and 5G.

Provides foundry services for thin-film lithium niobate (TFLN) photonic integrated circuits, manufacturing 200 mm wafers in a high-volume, production-ready environment. Enables rapid prototyping and scalable production with a comprehensive process development kit (PDK) supporting multiple bandwidths, delivering high-speed modulation (>100 GHz), low-voltage operation (V𝛑 ≤ 1V), and a wide transparency range (350 - 5,500 nm) for applications in data centers and beyond.

Aluvia Photonics provides a CMOS‑compatible aluminium‑oxide photonic integrated circuit platform that supports continuous transmission from 200 nm to ~3 µm with ultra‑low waveguide loss and native rare‑earth‑doped on‑chip amplifiers. The offering includes multi‑project wafer prototyping, dedicated volume runs, and a library of pre‑qualified passive and active design blocks to accelerate development of broadband photonic systems for communications, LIDAR, quantum information and biomedical instrumentation.

Salience Labs is developing a hybrid photonic-electronic chip designed to enhance the processing speed and energy efficiency of artificial intelligence applications. This technology addresses the limitations of traditional electronic chips by enabling faster data transfer and lower power consumption, crucial for scaling AI systems.

BeammWave develops a single-chip solution that integrates digital beamforming and antenna arrays for mmWave technology, enabling efficient connectivity for 5G and IoT devices. This technology addresses the challenges of size, cost, and power consumption in delivering high-speed internet across various connected applications.

Flexi-Hex manufactures protective packaging sleeves using a patented honeycomb design made from 100% recycled paper, which significantly reduces breakage rates during transit. This solution replaces traditional plastic packaging, minimizing environmental waste while ensuring the safe delivery of fragile products across various industries.

The startup develops a desktop vacuum stage 3D printer that utilizes molding techniques to create intricate three-dimensional shapes and structures. This technology provides design enthusiasts and 3D artists with a versatile tool that streamlines the production of complex 3D objects.

one.five provides AI-powered packaging solutions that optimize material selection, machinability, and cost while ensuring compliance with local and global sustainability regulations. The platform enables businesses to expedite their time to market by reducing trial and error in packaging design, ultimately enhancing performance and minimizing environmental impact.

HyperLight develops thin-film lithium niobate photonic integrated circuits (PICs) that deliver high bandwidth and low power consumption for applications in data centers, telecommunications, and sensing. Their technology addresses the need for efficient, high-performance electro-optic solutions with minimal on-chip loss and low drive voltage, enabling advanced communication systems and sensor functionalities.

The startup develops a sensor technology that integrates physical and digital environments through efficient three-dimensional perception systems, utilizing ultra-low power consumption and low latency by capturing new voxels with fewer than photons. This technology enables consumer electronics companies to enhance their sensing capabilities, addressing the need for more efficient and responsive sensor solutions.

Intrinsic Semiconductor Technologies develops silicon-oxide based resistive random-access memory (RRAM) to provide efficient non-volatile memory directly integrated into advanced processor chips. This technology addresses the memory bottleneck in embedded systems, significantly reducing power consumption and costs while enhancing performance for microcontrollers and edge AI applications.

Eyco designs and manufactures smart circuits for the European microelectronics sector, focusing on enhancing the efficiency and performance of electronic devices. The company addresses the industry's need for reliable and scalable circuit solutions to support the growing demand for advanced electronic applications.

Synthara provides ComputeRAM™ in‑memory computing IP that integrates MAC operations directly into SRAM cells of standard ASIC/FPGA designs, eliminating external memory accesses. The drop‑in IP delivers up to 100× higher inference throughput and 100× lower energy consumption for edge AI workloads without increasing die area, enabling ultra‑low‑power devices such as wearables, drones and smart sensors. A cloud‑based validation suite models performance and power budgets to accelerate time‑to‑market for fabless semiconductor and OEM customers.

Ephos designs and manufactures glass-based integrated photonic circuits using proprietary femtosecond laser writing techniques to minimize signal loss in computational devices. This technology enables the development of scalable classical and quantum infrastructures, addressing the need for efficient and high-performance computing solutions.

Chiral provides a fully automated, high-speed manufacturing solution for nanotransistors, utilizing advanced nanoassembly technology to achieve unprecedented yield rates. This technology addresses the challenge of scaling production for next-generation electronics using nanomaterials, ensuring efficiency and reliability in semiconductor manufacturing.

AlixLabs specializes in Atomic Layer Etch (ALE) Pitch Splitting technology, enabling the fabrication of nanostructures with dimensions smaller than 20 nanometers on 200 millimeter and 300 millimeter silicon wafers. This process addresses the semiconductor industry's need for cost-effective and energy-efficient manufacturing methods as it transitions to the ångström era.

Wave Photonics employs computational techniques to expedite the design of photonic integrated circuits across various wavelengths and platforms. This approach addresses the lengthy development cycles in integrated photonics, enabling faster time-to-market for new products.

Smartkem develops advanced semiconductor inks that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible plastic substrates. This technology reduces manufacturing costs and expands the possibilities for flexible, transparent electronic devices like next-generation displays and sensors.

The startup operates an online marketplace for custom-branded packaging, providing services such as production, engineering, and prototyping, along with supply chain optimization and quality assurance. This platform enables e-commerce brands and retailers to efficiently meet complex packaging requirements while ensuring high-quality standards and streamlined logistics.

SPHERICAL designs and manufactures custom, radiation-hardened silicon chips and integrated Power Conditioning and Distribution Units (PCDUs) specifically for space applications. This approach delivers mission-specific satellite electronics with up to five-fold improvements in SWaP-C compared to off-the-shelf components. The company provides aerospace and defense customers with a sovereign, high-performance power and control subsystem platform.

Innolume designs and manufactures semiconductor diode lasers and optical amplifiers from 780-1350 nm. They offer a vertically integrated process, from epitaxy to packaging, providing high-performance photonic components tailored for medical, scientific, industrial, and networking applications.

Plessey develops microLED display technology on a GaN-on-Silicon platform for AR/MR devices and HUDs. Their solution offers superior brightness, contrast, and power efficiency in compact form factors, addressing key manufacturing challenges for next-generation wearables and automotive interfaces.

Nanomation develops automation software that enhances the application of nanomaterials in chip manufacturing, enabling the production of faster and more efficient microchips without increasing transistor density. This technology addresses the limitations of traditional chipmaking methods as they approach physical density constraints, facilitating broader use of nanotechnology across various industries.

Skrym provides algorithmic optimization systems that minimize excess air in e-commerce packaging by calculating the best package sizes for various product shapes in real-time. This technology reduces shipping costs and emissions, enhancing logistics efficiency for businesses.

Lumai develops a 3D optical processor that significantly enhances AI performance in data centers while achieving a 90% reduction in power consumption compared to traditional silicon-based solutions. This technology addresses the escalating demand for AI processing power by providing a scalable, energy-efficient alternative that lowers both capital and operational costs.

NematX specializes in industrial 3D printing using proprietary Nematic 3DP Technology and liquid crystal polymers (LCP), which are ten times stronger than PEEK and can withstand temperatures exceeding 250°C. The company provides high-precision additive manufacturing solutions for industries such as aerospace and medical, enabling the production of complex, durable parts suitable for harsh environments.

SCALINQ develops high-density cryogenic solutions, including the LINQER packaging system and compact quantum filters, to enhance the performance of superconducting and spin-qubit processors. The company addresses the challenges of scaling quantum bits by providing customizable hardware that minimizes signal crosstalk and optimizes space efficiency for quantum computing applications.

PICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.

Bockatech develops EcoCore, a foam injection moulding technology that produces lightweight, insulated, and durable plastic packaging using polypropylene. This method reduces production cycle times by up to 80% compared to traditional foamed products, addressing the need for sustainable and cost-effective packaging solutions across various industries.

The startup specializes in passivation technology that enhances the performance of compound semiconductor devices through tailored surface engineering techniques. By optimizing substrate and chip manufacturing processes, the company enables clients to produce devices that are more efficient, reliable, and cost-effective.

Northern Waves AB specializes in additive manufacturing for microwave components, utilizing precise 3D printing techniques to create high-performance parts. This approach addresses the need for efficient production of complex microwave structures, enhancing performance while reducing material waste and lead times.

ALCYON PHOTONICS develops integrated photonic circuits that combine optical components like waveguides and modulators on a single chip, enabling compact and high-performance solutions for various applications. The company provides access to a portfolio of intellectual property and custom development services, helping customers accelerate their product development cycles in industries such as communications, sensors, and medical devices.

Xenergic provides low-power SRAM IP designed for system-on-chip (SoC) applications, enabling efficient memory integration with minimal energy consumption. Their technology addresses the need for high-performance, energy-efficient memory solutions in sectors such as artificial intelligence, IoT, and mobile devices.

LeapWave Technologies develops high-bandwidth interconnection solutions utilizing millimeter and sub-millimeter wave technologies for applications in broadband, communications, and semiconductor testing. Their technology enables faster data transfer rates and improved measurement accuracy, addressing the limitations of current interconnection capabilities.