Top 50 3d Ic Packaging in Europe

Lotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.

Alphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.

The startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.

The startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.

Irradiant Technologies develops a 3D nano-optics and photonics fabrication platform that utilizes implosion fabrication lithography to create complex, non-contiguous geometries at nanoscale. This technology enables rapid prototyping and mass production of advanced optical components, addressing the challenges of miniaturization and integration in light-based systems.

The startup develops a deep-tech semiconductor chipset that enhances data movement by bringing data processing closer to computation. This technology improves the execution speed of large language models while increasing data privacy and energy efficiency.

The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.

ChipFlow is an open-source platform that enables manufacturers to design custom integrated circuits using Python-based hardware design, significantly reducing costs and time to market. The platform provides direct access to chip manufacturers, addressing the challenge of high barriers to entry for OEMs seeking tailored semiconductor solutions.

Corintis develops microfluidic cooling solutions that integrate microscopically small cooling channels within semiconductor chips, enabling heat extraction that is ten times more effective and over fifty times more energy-efficient than current alternatives. This technology addresses the critical thermal limitations faced by high-performance chips in data centers, facilitating increased computational power while reducing energy consumption.

Smartkem develops advanced semiconductor inks that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible plastic substrates. This technology reduces manufacturing costs and expands the possibilities for flexible, transparent electronic devices like next-generation displays and sensors.

Nearfield Instruments provides high-throughput scanning-probe metrology systems for semiconductor manufacturing. Its solutions enable non-destructive, atomic-level measurement of 3D nanostructures, facilitating real-time process control for advanced logic and memory chips.

SEMRON develops a 3D-scalable AI inference chip using its proprietary CapRAM™ technology, which integrates compute-in-memory architecture to enhance energy efficiency and parameter density for AI applications. This technology addresses the high costs and power consumption of traditional AI chips, enabling efficient deployment of generative AI models directly on edge devices like smartphones and wearables.

Threedys offers instant3Dhub, a platform that enables the visualization and management of large-scale 3D data across various applications and devices. This technology enhances data automation and collaboration, addressing inefficiencies in industrial 3D processes.

Lidrotec utilizes ultra-short pulse laser technology to achieve high-precision micro-manufacturing and material modification across various substrates. This technology enhances accuracy and efficiency in industrial applications, meeting the demand for improved processing capabilities.

AlixLabs specializes in Atomic Layer Etch (ALE) Pitch Splitting technology, enabling the fabrication of nanostructures with dimensions smaller than 20 nanometers on 200 millimeter and 300 millimeter silicon wafers. This process addresses the semiconductor industry's need for cost-effective and energy-efficient manufacturing methods as it transitions to the ångström era.

The startup develops a high-resolution 3D printer specifically designed for bioprinting live cells using optimized biocompatible materials. This technology enables the production of sterile support structures for tissue regeneration, facilitating the creation of precise microcomponents essential for cell research.

The startup manufactures automatic optical inspection systems that utilize artificial intelligence and three-dimensional inspection technologies to detect defects in printed circuit boards. By ensuring components meet strict quality standards, the systems help electronics manufacturers increase yield and lower production costs.

Provides foundry services for thin-film lithium niobate (TFLN) photonic integrated circuits, manufacturing 200 mm wafers in a high-volume, production-ready environment. Enables rapid prototyping and scalable production with a comprehensive process development kit (PDK) supporting multiple bandwidths, delivering high-speed modulation (>100 GHz), low-voltage operation (V𝛑 ≤ 1V), and a wide transparency range (350 - 5,500 nm) for applications in data centers and beyond.

Voidless develops on-demand packaging machinery that produces custom-sized boxes in real-time, effectively eliminating over-packaging in logistics. This technology optimizes storage and transportation efficiency, reduces material waste, and enhances the customer experience through tailored packaging solutions.

Morphotonics offers a large-area nanoimprinting platform for high-volume manufacturing of nanoscale optical components. Their integrated solution enables the precise replication of sub-100 nm features across meter-scale surfaces, accelerating the production of advanced displays and smart glasses.

The startup develops a three-dimensional magnetic field generator that provides wafer-level characterization and testing services for magnetic devices and sensors. This technology enables spintronics-based device testing that meets the electrical probing requirements for mass production, offering a viable alternative to embedded memory in system-on-chip applications.

Black Semiconductor utilizes graphene to create ultra-fast, energy-efficient chip networks that enable thousands of chips to communicate as a single unit. This technology addresses the limitations of traditional electronic connections by integrating photonics with electronics, enhancing data communication speed and scalability in the semiconductor and electronics industries.

Chiral provides a fully automated, high-speed manufacturing solution for nanotransistors, utilizing advanced nanoassembly technology to achieve unprecedented yield rates. This technology addresses the challenge of scaling production for next-generation electronics using nanomaterials, ensuring efficiency and reliability in semiconductor manufacturing.

Intrinsic Semiconductor Technologies develops silicon-oxide based resistive random-access memory (RRAM) to provide efficient non-volatile memory directly integrated into advanced processor chips. This technology addresses the memory bottleneck in embedded systems, significantly reducing power consumption and costs while enhancing performance for microcontrollers and edge AI applications.

Salience Labs is developing a hybrid photonic-electronic chip designed to enhance the processing speed and energy efficiency of artificial intelligence applications. This technology addresses the limitations of traditional electronic chips by enabling faster data transfer and lower power consumption, crucial for scaling AI systems.

Vector Photonics produces Photonic Crystal Surface-Emitting Lasers (PCSELs) that offer low-cost, high-power solutions with a broad wavelength range, specifically designed for integration into data center applications. These lasers significantly reduce power consumption, addressing the growing demand for efficient optical components in data communications and related technologies.

DPhi Space is developing a ridesharing platform for deploying space payloads, enabling users to launch up to 3U payloads with integrated power, computing, and communication capabilities. This platform addresses the high costs and complexities associated with accessing space, making it more affordable and accessible for various payload developers.

HyperLight develops thin-film lithium niobate photonic integrated circuits (PICs) that deliver high bandwidth and low power consumption for applications in data centers, telecommunications, and sensing. Their technology addresses the need for efficient, high-performance electro-optic solutions with minimal on-chip loss and low drive voltage, enabling advanced communication systems and sensor functionalities.

Lumiphase designs and manufactures optical communication chips using Barium Titanate (BTO) and silicon photonics to enable efficient light control for high-speed data transmission. These chips provide compact, low-power solutions that meet the growing demand for cost-effective performance in optical networking applications.

Wave Photonics employs computational techniques to expedite the design of photonic integrated circuits across various wavelengths and platforms. This approach addresses the lengthy development cycles in integrated photonics, enabling faster time-to-market for new products.

Keysom develops RISC-V based processor architectures that are automatically generated from application source code, allowing for custom designs tailored to specific requirements. This technology reduces processor area and power consumption by up to 50%, enabling semiconductor companies to optimize performance without being constrained by existing processor options.

The startup develops a sensor technology that integrates physical and digital environments through efficient three-dimensional perception systems, utilizing ultra-low power consumption and low latency by capturing new voxels with fewer than photons. This technology enables consumer electronics companies to enhance their sensing capabilities, addressing the need for more efficient and responsive sensor solutions.

The startup develops gallium nitride (GaN) material technology to create energy-efficient wide-bandgap semiconductors for the electronics industry. This technology enhances the performance and efficiency of light-emitting diodes and other electronic devices, addressing the need for improved energy consumption in modern electronics.

Eyco designs and manufactures smart circuits for the European microelectronics sector, focusing on enhancing the efficiency and performance of electronic devices. The company addresses the industry's need for reliable and scalable circuit solutions to support the growing demand for advanced electronic applications.

Ephos designs and manufactures glass-based integrated photonic circuits using proprietary femtosecond laser writing techniques to minimize signal loss in computational devices. This technology enables the development of scalable classical and quantum infrastructures, addressing the need for efficient and high-performance computing solutions.

indie develops automotive semiconductors and software platforms that integrate edge sensors, including LiDAR, radar, and computer vision, to enhance Advanced Driver Assistance Systems (ADAS) and in-cabin user experiences. Their technology addresses the need for improved driver safety and vehicle electrification, enabling seamless connectivity and advanced functionality in electric and autonomous vehicles.

Delft Circuits provides the Cri/oFlex® platform, a flexible stripline cable system designed for cryogenic environments. This technology integrates attenuators and filters directly into the cable, significantly reducing thermal load and enabling high-density interconnects for quantum computing hardware.

SCIL Nanoimprint Solutions utilizes Substrate Conformal Imprint Lithography (SCIL) to achieve high-resolution patterning of nano-structures on various substrates, ensuring nanometer precision at scale. This technology addresses the need for cost-effective and robust manufacturing processes in industries requiring advanced nano-patterning capabilities.

DGG offers RapidCompact, a platform that optimizes 3D models through advanced techniques such as mesh decimation, texture baking, and format transcoding, enabling businesses to efficiently manage and scale their 3D digital assets. This technology significantly reduces production time and costs, allowing users to achieve up to 95% savings while enhancing the quality and accessibility of their 3D content.

The startup develops a chip verification platform that utilizes an algorithm for electrically accurate, full-chip analysis at the transistor level. This technology reduces errors in semiconductor design, enhancing precision and efficiency during complex project workflows.

Innolume designs and manufactures semiconductor diode lasers and optical amplifiers from 780-1350 nm. They offer a vertically integrated process, from epitaxy to packaging, providing high-performance photonic components tailored for medical, scientific, industrial, and networking applications.

SparkNano utilizes Spatial Atomic Layer Deposition (ALD) technology to enable the mass production of energy and display devices with significantly reduced reliance on scarce materials. This approach enhances performance and efficiency in applications such as hydrogen production, batteries, and solar cells, addressing the critical need for sustainable manufacturing solutions.

The startup specializes in micromachining technology that fabricates custom products from a wide range of materials, enabling defect-free processing of brittle materials at wafer-scale and beyond. This technology facilitates rapid prototyping, significantly accelerating the product development cycle for manufacturers.

Hybrid Software Group develops enterprise software for industrial print manufacturing, utilizing workflow automation and color management technologies to enhance production efficiency. The platform minimizes operational errors, enabling manufacturers to optimize printing processes and improve output quality.

Nanomation develops automation software that enhances the application of nanomaterials in chip manufacturing, enabling the production of faster and more efficient microchips without increasing transistor density. This technology addresses the limitations of traditional chipmaking methods as they approach physical density constraints, facilitating broader use of nanotechnology across various industries.

The startup develops intelligent storage management software for SMT and THT components, enabling seamless integration with ERP and MES systems as well as factory machinery. This solution minimizes human errors, optimizes storage space, reduces setup time, and ensures quality through effective traceability and MSL control.

Lumai develops a 3D optical processor that significantly enhances AI performance in data centers while achieving a 90% reduction in power consumption compared to traditional silicon-based solutions. This technology addresses the escalating demand for AI processing power by providing a scalable, energy-efficient alternative that lowers both capital and operational costs.

The startup is developing a quantum diamond-magnetic microscope designed for neuroscientists to detect and analyze magnetic fields associated with neural activity. This technology aims to enhance disease diagnosis and facilitate the discovery of potential cures by providing high-resolution imaging of biological processes at the quantum level.