Scintil Photonics develops silicon photonic integrated circuits (PICs) that integrate DFB lasers and optical amplifiers to enhance performance and energy efficiency for data centers, AI/ML applications, and 5G networks. Their technology enables high-speed optical interconnects, supporting data rates of 800Gbps and beyond, while simplifying packaging and reducing power consumption.
Funding
$24.8M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Data centers, AI/ML infrastructure, and 5G networks require high-speed, energy-efficient optical interconnects to manage increasing data traffic. Traditional optical solutions face challenges in performance, power consumption, packaging complexity, and scalability to meet the demands of next-generation applications.
Solution
Scintil Photonics develops silicon photonic integrated circuits (PICs) that incorporate distributed feedback (DFB) lasers and optical amplifiers to enhance performance and energy efficiency for data centers, AI/ML applications, and 5G networks. Their laser-augmented PICs support high data rates of 800Gbps and beyond, while simplifying packaging and reducing power consumption. The company's heterogeneous integration process of III-V materials with silicon leverages standard silicon photonics processing, enabling scalable production of PICs with integrated lasers. Scintil's technology addresses the requirements of pluggable optics and co-packaged optics, providing multi-wavelength light sources for denser, faster, and lower-power optical interconnects.
Target Audience
The primary customers are datacenter operators, AI/ML infrastructure providers, and 5G network equipment manufacturers seeking high-speed, low-power optical interconnect solutions.
Features
- Photonic integrated circuits (PIC) with monolithically integrated DFB lasers and optical amplifiers (SOA)
- Supports 800G and 1.6T data rates with coarse Wavelength Division Multiplexed (CWDM4)
- LEAF Light™: Dense multi-wavelength laser source fabricated with SCINTIL Heterogeneous Integrated Photonics (SHIP™) circuit technology
- LEAF Light™ PIC integrates two sets of 8 DFB laser arrays
- Available with three output configurations offering either 8 or 16 wavelengths per port with 200 or 100 GHz channel spacing
- Each laser can be independently and accurately controlled to maintain perfect channel spacing
- LEAF Light™ module: Highly integrated system consisting of the LEAF Light PIC and its dedicated control electronics
- Paddle card circuit board designed for integration into an External Laser Small Form Factor Pluggable (ELSFP) module