Exaddon provides micro‑3D printed probe cards that deliver ultrafine pitch (< 20 µm) and low contact force for reliable testing of fragile semiconductor structures such as microLEDs and deep‑trench sites. The printed probes are customizable on demand, compatible with existing probers, and feature replaceable heads to reduce downtime and total cost of ownership.
Funding
Funding not disclosed
Founders
Product
Problem
As semiconductor device geometries shrink, conventional probe cards struggle with precise alignment, adequate compliance, and durability, leading to lower test yields, slower throughput, and increased risk of damaging fragile wafer pads.
Solution
Exaddon offers probe cards that incorporate micro‑3D printed probes designed for advanced wafer testing. The additive‑manufactured probes provide ultrafine pitch (< 20 µm) and controlled contact force, enabling reliable testing of delicate structures such as microLEDs and deep‑trench parametric sites. Because the probes are printed directly onto the card, they can be rapidly customized to match any test layout, reducing engineering lead time and downtime. The cards are compatible with existing probers and testers, allowing seamless integration into current fab lines. Replaceable probe heads further extend card life and lower cost of ownership while maintaining high alignment precision and non‑destructive contact.
Target Audience
Primary customers are semiconductor manufacturers and test engineers who require high‑precision, high‑yield wafer probing for advanced display technologies, microLEDs, and fine‑pitch parametric testing.
Features
- Micro‑3D printed probe tips with ultrafine pitch (< 20 µm) for high‑density pad access
- Low contact force to prevent damage to fragile microLED and advanced device pads
- Rapid, on‑demand customization of probe geometry for any wafer test layout
- Multi‑parallel probe arrays to increase test throughput and reduce cycle time
- Seamless compatibility with standard wafer probers and test equipment
- Replaceable probe heads to minimize downtime and lower total cost of ownership
- Proven performance for electroluminescence (EL) and parametric wafer acceptance testing