The startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.
Funding
$3M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
In semiconductor manufacturing, accurately measuring thin film conformality in 3D structures with high aspect ratios is challenging, especially when developing new materials or optimizing deposition processes. Traditional methods are often time-consuming, destructive, and lack the precision needed for advanced process control.
Solution
Chipmetrics provides metrology solutions based on test chips and wafers that enable precise and rapid assessment of thin film conformality in 3D high aspect ratio structures. Their products allow semiconductor manufacturers to evaluate and compare different thin film processes and reactors, accelerating process development, tool qualification, and quality assurance. By integrating specialized test structures with advanced measurement techniques, Chipmetrics delivers detailed insights into film properties within complex geometries, enhancing process control and improving yields. Their solutions support the scaling of semiconductor processes from R&D to mass production, ensuring efficient translation of innovations into high-volume manufacturing.
Target Audience
Chipmetrics' primary customers are semiconductor manufacturers, equipment suppliers, and material providers involved in process development, tool qualification, and quality control for advanced semiconductor devices.
Features
- PillarHall test chips featuring lateral high aspect ratio (LHAR) structures for evaluating film penetration depth and conformality
- Chipmetrics VHAR1 test chips with vertical holes designed for ultra-high aspect ratio metrology through cross-sectional analysis
- Pocket Wafer, integrating PillarHall chips within a standard 300mm wafer format for scaling processes from coupon size to full wafer
- Measurement service providing detailed film penetration depth profile analysis using techniques like SEM, reflectometry, and imaging ellipsometry
- Solutions for area-selective deposition (ASD) studies, enabling selective film deposition on patterned materials
- Compatibility with various analytical instruments, including XPS, ToF-SIMS, and Raman spectroscopy, for chemical and elemental composition mapping
- Support for atomic layer deposition (ALD) and chemical vapor deposition (CVD) process development and optimization