TERASi develops system-in-package (SiP) technology that integrates passive components with semiconductor devices to create compact, lightweight RF systems capable of operating beyond 100 GHz. This approach addresses the challenge of building efficient and cost-effective wireless solutions needed for the increasing bandwidth demands of future networks like 6G.
Funding
Funding not disclosed
Founders
Product
Problem
The increasing demand for bandwidth in future wireless networks, such as 6G, requires efficient and cost-effective radio frequency (RF) systems capable of operating beyond 100 GHz, but current solutions struggle to provide the necessary performance, size, and weight characteristics at these frequencies. Existing semiconductor technologies lack the ability to build efficient passive components needed for complete RF systems.
Solution
TERASi addresses the challenges of next-generation wireless communication by developing system-in-package (SiP) technology that integrates passive components with semiconductor devices. This approach enables the creation of compact, lightweight RF systems that deliver best-in-class performance beyond 100 GHz, outperforming conventional systems-on-chip (SoCs). TERASi's SiP technology merges ultra-low loss, pinpoint precision, and featherlight design into a single, scalable platform, redefining the future of wireless technology.
Target Audience
The primary target audience includes companies developing next-generation wireless communication systems, particularly in the telecom, radar, and satellite industries, who require high-performance, compact, and cost-effective RF solutions.
Features
- Proprietary system-in-package (SiP) technology for RF systems
- Direct integration of semiconductor devices with passive components
- Scalable manufacturing process for cost-effective production
- Ultra-low loss design for high-performance RF systems
- Compact and lightweight design for size and weight-sensitive applications
- Standard components available for telecoms, radar, and satellite applications
- Custom solutions available to meet specific customer requirements