Lotus Microsystems offers the vStrata™ Power Series, a vertical power delivery platform that integrates power conversion and thermal management into an ultra‑slim package using its proprietary Power Interposer (PIT) and LTG™ thermal guide technologies. The solution eliminates external passive components, reduces parasitic losses, and provides industry‑leading power density and low thermal resistance for AI accelerators, GPUs, FPGAs, and other high‑performance computing modules. This enables tighter integration, higher efficiency, and compact footprints in hyperscale data‑center power architectures.
Funding
DKK 60M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
High‑performance AI and hyperscale computing systems require extremely high power density, but conventional power‑module packaging struggles with heat dissipation, parasitic losses, and limited board space, leading to reliability and efficiency constraints.
Solution
Lotus Microsystems delivers the vStrata™ Power Series, a vertical power delivery platform that integrates power conversion and thermal management into a single, ultra‑slim package. The solution uses the proprietary Lotus Power Interposer (PIT) and LTG™ thermal guide technologies to provide 3‑D packaging, eliminating the need for external passive components and reducing parasitics. By routing power on the backside of the load and employing high‑aspect‑ratio TSVs, the platform achieves high current handling, superior thermal performance (high W/mm², low °C/W), and a compact footprint. This enables AI accelerators, GPUs, FPGAs and other xPU devices to be placed closer to the load, improving efficiency and supporting the power demands of next‑generation data‑center infrastructure.
Target Audience
Primary customers are designers and manufacturers of AI data‑center power modules, high‑performance computing platforms, and hyperscale computing infrastructure that need compact, high‑density power and thermal solutions.
Features
- Lotus Power Interposer (PIT) technology with high‑current, high‑voltage silicon interposer
- LTG™ thermal guide for efficient vertical and lateral heat removal
- Fully integrated design with no external passive components, reducing parasitics and board space
- Ultra‑slim backside power delivery profile for tight fit to AI chips
- Multi‑domain co‑design addressing electrical, thermal, and mechanical constraints in a single architecture
- High power density capability (industry‑leading W/mm²) and low thermal resistance (°C/W)
- Early Access Program offering engineering samples (LSC0580) shipping Q3 2026