Find Investable Startups and Competitors
Search thousands of startups using natural language—just describe what you're looking for
Top 50 Chiplet Packaging in Europe
Discover the top 50 Chiplet Packaging startups in Europe. Browse funding data, key metrics, and company insights. Average funding: $20.4M.
Sort by
ChipFlow
-Cambridge, United KingdomChipFlow is an open-source platform that enables manufacturers to design custom integrated circuits using Python-based hardware design, significantly reducing costs and time to market. The platform provides direct access to chip manufacturers, addressing the challenge of high barriers to entry for OEMs seeking tailored semiconductor solutions.
Funding: $1M+
Rough estimate of the amount of funding raised
Alphawave Semi
-London, United KingdomAlphawave Semi manufactures silicon IP and custom silicon solutions, including high-speed connectivity chiplets and subsystems, utilizing advanced technologies like 3nm UCIe™ and HBM3E. Their products address the need for reliable, low-latency interconnects in data centers, AI infrastructure, and 5G networks, enhancing performance and efficiency in high-demand computing environments.
Funding: $100M+
Rough estimate of the amount of funding raised
VerticalCompute
-Louvain-la-Neuve, BelgiumThe startup develops a deep-tech semiconductor chipset that enhances data movement by bringing data processing closer to computation. This technology improves the execution speed of large language models while increasing data privacy and energy efficiency.
Funding: $20M+
Rough estimate of the amount of funding raised
PHIX Photonics Assembly
-Enschede, The NetherlandsThe startup develops light chips designed to enhance the production of photonic integrated circuits (PICs) by enabling cost-effective assembly and packaging at scale. This technology facilitates the integration of photonics and electronics into a single module, addressing the challenges of high-volume fabrication in the photonics industry.
Funding: $5M+
Rough estimate of the amount of funding raised
Lotus Microsystems
-Kongens Lyngby, DenmarkLotus Microsystems develops high-performance power modules utilizing proprietary silicon interposer technology, which integrates active and passive components in 2.5D and 3D packaging. This technology enhances thermal performance by up to 60% and increases power density, addressing the challenges of heat management and space constraints in high-power applications such as AI and telecommunications.
Funding: $5M+
Rough estimate of the amount of funding raised
Chipmetrics
-Joensuu, FinlandThe startup develops test structures and chips that provide precise thin film conformality data for microelectronics manufacturing. Their products enable clients to evaluate and compare various 3D thin film processes and reactors, enhancing the efficiency of material applications.
Funding: $3M+
Rough estimate of the amount of funding raised
NcodiN
-Palaiseau, FranceThe startup develops an optical interposer that utilizes light for energy-efficient die-to-die interconnects, enabling high-performance computing (HPC) processors to achieve full scalability with multi-chipset configurations. This technology addresses the limitations of traditional electrical interconnects, enhancing data transfer speeds while reducing power consumption.
Funding: $3M+
Rough estimate of the amount of funding raised
Corintis
-Lausanne, SwitzerlandCorintis develops microfluidic cooling solutions that integrate microscopically small cooling channels within semiconductor chips, enabling heat extraction that is ten times more effective and over fifty times more energy-efficient than current alternatives. This technology addresses the critical thermal limitations faced by high-performance chips in data centers, facilitating increased computational power while reducing energy consumption.
Funding: $3M+
Rough estimate of the amount of funding raised
Salience Labs
-Oxford, United KingdomSalience Labs is developing a hybrid photonic-electronic chip designed to enhance the processing speed and energy efficiency of artificial intelligence applications. This technology addresses the limitations of traditional electronic chips by enabling faster data transfer and lower power consumption, crucial for scaling AI systems.
Funding: $20M+
Rough estimate of the amount of funding raised
SEMRON
-Dresden, GermanySEMRON develops a 3D-scalable AI inference chip using its proprietary CapRAM™ technology, which integrates compute-in-memory architecture to enhance energy efficiency and parameter density for AI applications. This technology addresses the high costs and power consumption of traditional AI chips, enabling efficient deployment of generative AI models directly on edge devices like smartphones and wearables.
Funding: $5M+
Rough estimate of the amount of funding raised
GEMESYS
-Bochum, GermanyThe startup develops a neuromorphic chip that mimics human brain information-processing mechanisms to enhance artificial intelligence hardware. This technology addresses computing bottlenecks by enabling more efficient training of neural networks for AI applications.
Funding: $5M+
Rough estimate of the amount of funding raised
Smartkem
-Manchester, United KingdomSmartkem develops advanced semiconductor inks that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible plastic substrates. This technology reduces manufacturing costs and expands the possibilities for flexible, transparent electronic devices like next-generation displays and sensors.
Funding: $5M+
Rough estimate of the amount of funding raised
Aion Silicon
-Reading, United KingdomFunding: $5M+
Rough estimate of the amount of funding raised
Chiral Nano
-Zürich, SwitzerlandChiral provides a fully automated, high-speed manufacturing solution for nanotransistors, utilizing advanced nanoassembly technology to achieve unprecedented yield rates. This technology addresses the challenge of scaling production for next-generation electronics using nanomaterials, ensuring efficiency and reliability in semiconductor manufacturing.
Funding: $3M+
Rough estimate of the amount of funding raised
Black Semiconductor
-Aachen, GermanyBlack Semiconductor utilizes graphene to create ultra-fast, energy-efficient chip networks that enable thousands of chips to communicate as a single unit. This technology addresses the limitations of traditional electronic connections by integrating photonics with electronics, enhancing data communication speed and scalability in the semiconductor and electronics industries.
Funding: $200M+
Rough estimate of the amount of funding raised
Silex
-Järfälla, SwedenFunding: $20M+
Rough estimate of the amount of funding raised
PHOTON IP
-Eindhoven, The NetherlandsPHOTON IP develops advanced optical chips utilizing innovative photonics technologies to enhance data transmission and processing capabilities. The startup addresses the limitations of current optical systems by providing high-performance solutions that improve efficiency and reduce energy consumption in various applications.
Funding: $3M+
Rough estimate of the amount of funding raised
AlixLabs
-Lund, SwedenAlixLabs specializes in Atomic Layer Etch (ALE) Pitch Splitting technology, enabling the fabrication of nanostructures with dimensions smaller than 20 nanometers on 200 millimeter and 300 millimeter silicon wafers. This process addresses the semiconductor industry's need for cost-effective and energy-efficient manufacturing methods as it transitions to the ångström era.
Funding: $3M+
Rough estimate of the amount of funding raised
New Origin
-Enschede, The NetherlandsThe startup manufactures silicon nitride photonic chips for optical communication applications, utilizing wafer-scale manufacturing and light propagation techniques to handle wavelengths from visible to near-infrared. This technology enables industries to achieve high-performance data transmission with minimal loss, addressing the need for efficient communication solutions in a data-driven world.
Funding: $5M+
Rough estimate of the amount of funding raised
Ephos
-Milan, ItalyEphos designs and manufactures glass-based integrated photonic circuits using proprietary femtosecond laser writing techniques to minimize signal loss in computational devices. This technology enables the development of scalable classical and quantum infrastructures, addressing the need for efficient and high-performance computing solutions.
Funding: $5M+
Rough estimate of the amount of funding raised
Lidrotec
-Bochum, GermanyLidrotec utilizes ultra-short pulse laser technology to achieve high-precision micro-manufacturing and material modification across various substrates. This technology enhances accuracy and efficiency in industrial applications, meeting the demand for improved processing capabilities.
Funding: $5M+
Rough estimate of the amount of funding raised
Keysom
-Pessac, FranceKeysom develops RISC-V based processor architectures that are automatically generated from application source code, allowing for custom designs tailored to specific requirements. This technology reduces processor area and power consumption by up to 50%, enabling semiconductor companies to optimize performance without being constrained by existing processor options.
Funding: $3M+
Rough estimate of the amount of funding raised
Voidless
-Pavia, ItalyVoidless develops on-demand packaging machinery that produces custom-sized boxes in real-time, effectively eliminating over-packaging in logistics. This technology optimizes storage and transportation efficiency, reduces material waste, and enhances the customer experience through tailored packaging solutions.
Funding: $2M+
Rough estimate of the amount of funding raised
Lightium
-Zürich, SwitzerlandProvides foundry services for thin-film lithium niobate (TFLN) photonic integrated circuits, manufacturing 200 mm wafers in a high-volume, production-ready environment. Enables rapid prototyping and scalable production with a comprehensive process development kit (PDK) supporting multiple bandwidths, delivering high-speed modulation (>100 GHz), low-voltage operation (V𝛑 ≤ 1V), and a wide transparency range (350 - 5,500 nm) for applications in data centers and beyond.
Funding: $5M+
Rough estimate of the amount of funding raised
CELUS
-Munich, GermanyProvides an AI-driven platform that automates electronics design by transforming conceptual ideas into detailed circuit layouts compatible with EDA tools. This solution reduces development time and complexity for engineers while enabling manufacturers to leverage data-driven insights for improved scalability and market reach.
Funding: $20M+
Rough estimate of the amount of funding raised
MintNeuro
-London, United KingdomMintNeuro develops scalable semiconductor technology for next-generation neural implants that enhance the treatment of neurological conditions through compact, low-power solutions. The company aims to improve patient outcomes by enabling minimally invasive procedures that offer high performance and accessibility in medical interventions.
Funding: $1M+
Rough estimate of the amount of funding raised
Circuit Mind
-London, United KingdomProvides an AI-powered platform for electronic engineering teams to automatically generate and optimize circuit schematics and component selections based on user-defined architectural diagrams and requirements. This reduces design time from weeks or months to seconds, minimizes errors, and ensures cost, size, and performance optimization by evaluating trillions of design combinations.
Funding: $10M+
Rough estimate of the amount of funding raised
RaiderChip
-Ares, SpainRaiderChip designs semiconductor hardware accelerators that enhance AI performance by addressing memory bandwidth limitations. Their solutions enable efficient AI inference for both edge and cloud applications, allowing users to run complex large language models locally with full privacy and without ongoing subscriptions.
Funding: $1M+
Rough estimate of the amount of funding raised
Packhelp
-Warsaw, PolandThe startup operates an online marketplace for custom-branded packaging, providing services such as production, engineering, and prototyping, along with supply chain optimization and quality assurance. This platform enables e-commerce brands and retailers to efficiently meet complex packaging requirements while ensuring high-quality standards and streamlined logistics.
Funding: $50M+
Rough estimate of the amount of funding raised
Delvitech SA
-Mendrisio, Schweiz/Suisse/Svizzera/SvizraThe startup manufactures automatic optical inspection systems that utilize artificial intelligence and three-dimensional inspection technologies to detect defects in printed circuit boards. By ensuring components meet strict quality standards, the systems help electronics manufacturers increase yield and lower production costs.
Funding: $10M+
Rough estimate of the amount of funding raised
BeammWave
-Lund, SwedenBeammWave develops a single-chip solution that integrates digital beamforming and antenna arrays for mmWave technology, enabling efficient connectivity for 5G and IoT devices. This technology addresses the challenges of size, cost, and power consumption in delivering high-speed internet across various connected applications.
Funding: $100K+
Rough estimate of the amount of funding raised
Porotech
-Cambridge, United KingdomThe startup develops gallium nitride (GaN) material technology to create energy-efficient wide-bandgap semiconductors for the electronics industry. This technology enhances the performance and efficiency of light-emitting diodes and other electronic devices, addressing the need for improved energy consumption in modern electronics.
Funding: $20M+
Rough estimate of the amount of funding raised
SiPearl
-Maisons-Laffitte, FranceSiPearl is developing a high-performance, low-power microprocessor specifically for supercomputing and artificial intelligence, designed to integrate with any third-party accelerator. This technology addresses the need for efficient processing of large volumes of data in critical fields such as medical research, energy management, and climate modeling, while minimizing carbon footprint.
Funding: $100M+
Rough estimate of the amount of funding raised
Eyco
-Trets, FranceEyco designs and manufactures smart circuits for the European microelectronics sector, focusing on enhancing the efficiency and performance of electronic devices. The company addresses the industry's need for reliable and scalable circuit solutions to support the growing demand for advanced electronic applications.
Wave Photonics
-Cambridge, United KingdomWave Photonics employs computational techniques to expedite the design of photonic integrated circuits across various wavelengths and platforms. This approach addresses the lengthy development cycles in integrated photonics, enabling faster time-to-market for new products.
Funding: $5M+
Rough estimate of the amount of funding raised
Codasip
-Munich, GermanyCodasip provides customizable RISC-V processor solutions that allow developers to tailor microarchitecture and instruction sets to meet specific performance, power, and area requirements. This enables technology innovators to create differentiated products while ensuring compliance with safety and cybersecurity standards.
Funding: $10M+
Rough estimate of the amount of funding raised
SCIL Nanoimprint solutions
-Eindhoven, The NetherlandsSCIL Nanoimprint Solutions utilizes Substrate Conformal Imprint Lithography (SCIL) to achieve high-resolution patterning of nano-structures on various substrates, ensuring nanometer precision at scale. This technology addresses the need for cost-effective and robust manufacturing processes in industries requiring advanced nano-patterning capabilities.
Funding: $10M+
Rough estimate of the amount of funding raised
Aniah
-Grenoble, FranceThe startup develops a chip verification platform that utilizes an algorithm for electrically accurate, full-chip analysis at the transistor level. This technology reduces errors in semiconductor design, enhancing precision and efficiency during complex project workflows.
Funding: $5M+
Rough estimate of the amount of funding raised
Microbritt LTD
-Newcastle upon Tyne, United KingdomThe startup specializes in micromachining technology that fabricates custom products from a wide range of materials, enabling defect-free processing of brittle materials at wafer-scale and beyond. This technology facilitates rapid prototyping, significantly accelerating the product development cycle for manufacturers.
Funding: $500K+
Rough estimate of the amount of funding raised
Nanomation
-London, United KingdomNanomation develops automation software that enhances the application of nanomaterials in chip manufacturing, enabling the production of faster and more efficient microchips without increasing transistor density. This technology addresses the limitations of traditional chipmaking methods as they approach physical density constraints, facilitating broader use of nanotechnology across various industries.
Funding: $100K+
Rough estimate of the amount of funding raised
Skrym
-Stockholm, SwedenSkrym provides algorithmic optimization systems that minimize excess air in e-commerce packaging by calculating the best package sizes for various product shapes in real-time. This technology reduces shipping costs and emissions, enhancing logistics efficiency for businesses.
Funding: $1M+
Rough estimate of the amount of funding raised
Essegi Automation srl
-Sovizzo, ItaliaThe startup develops intelligent storage management software for SMT and THT components, enabling seamless integration with ERP and MES systems as well as factory machinery. This solution minimizes human errors, optimizes storage space, reduces setup time, and ensures quality through effective traceability and MSL control.
Funding: $10M+
Rough estimate of the amount of funding raised
DIASENSE
-Copenhagen, DenmarkThe startup is developing a quantum diamond-magnetic microscope designed for neuroscientists to detect and analyze magnetic fields associated with neural activity. This technology aims to enhance disease diagnosis and facilitate the discovery of potential cures by providing high-resolution imaging of biological processes at the quantum level.
Funding: $500K+
Rough estimate of the amount of funding raised
Vaire
-London, United KingdomVaire Computing develops near-zero energy chips utilizing adiabatic reversible computing to significantly reduce energy consumption in computing processes. This technology addresses the escalating energy demands of modern computing, particularly in AI applications, by minimizing heat generation and enhancing efficiency.
Funding: $3M+
Rough estimate of the amount of funding raised
Advanced Material Development
-Guildford, United KingdomThe startup develops a nanotechnology platform that collaborates with universities to fund research and commercialize materials for industrial applications, including advanced sensors and functional coatings. This approach addresses the need for innovative solutions in environmental and societal challenges by enabling the development of specialized technologies and materials.
Funding: $5M+
Rough estimate of the amount of funding raised
Tropic Square
-Prague, CzechiaTropic Square designs and manufactures open-architecture secure element chips that provide customizable and transparent solutions for enhancing the security of digital transactions and data storage. Their technology mitigates vulnerabilities in hardware security by enabling independent auditing and accountability, ensuring robust protection against potential threats.
Funding: $3M+
Rough estimate of the amount of funding raised
SCALINQ
-Rothenburg, SwedenSCALINQ develops high-density cryogenic solutions, including the LINQER packaging system and compact quantum filters, to enhance the performance of superconducting and spin-qubit processors. The company addresses the challenges of scaling quantum bits by providing customizable hardware that minimizes signal crosstalk and optimizes space efficiency for quantum computing applications.
PICadvanced
-Aveiro, PortugalPICadvanced specializes in the design, development, and packaging of photonic integrated circuits (PICs) across various platforms, including SiPh and InP, to enhance the performance of optical network systems. The company provides comprehensive testing and characterization services to ensure reliability and quality in transceiver and optical component production for telecommunications applications.
Funding: $3M+
Rough estimate of the amount of funding raised
Comptek Solutions
-Turku, FinlandThe startup specializes in passivation technology that enhances the performance of compound semiconductor devices through tailored surface engineering techniques. By optimizing substrate and chip manufacturing processes, the company enables clients to produce devices that are more efficient, reliable, and cost-effective.
Funding: $10M+
Rough estimate of the amount of funding raised
ALCYON PHOTONICS
-Madrid, SpainALCYON PHOTONICS develops integrated photonic circuits that combine optical components like waveguides and modulators on a single chip, enabling compact and high-performance solutions for various applications. The company provides access to a portfolio of intellectual property and custom development services, helping customers accelerate their product development cycles in industries such as communications, sensors, and medical devices.
Funding: $500K+
Rough estimate of the amount of funding raised