Ltphotonics provides a detachable fiber‑to‑chip connector that eliminates micro‑optics, bump‑on‑carrier structures, active alignment, and epoxy bonding, enabling ultra‑low insertion loss (demonstrated under 800 mdB) with passive alignment in under three seconds. The technology is designed for high‑volume silicon photonic modules used in quantum computing and AI accelerator hardware, targeting scalable production of millions of units with loss goals as low as 10 mdB per connection.
Funding
$759.3K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Current fiber-to-chip interconnects for silicon photonics often require micro-optics, bump-on-carrier structures, active alignment, and epoxy bonding, which add manufacturing complexity, increase insertion loss, and limit scalability to high‑volume production.
Solution
Ltphotonics offers a detachable fiber‑to‑chip connection technology that eliminates micro‑optics, bump‑on‑carrier (BOC) structures, active alignment steps, and epoxy bonding. The approach achieves ultra‑low insertion loss—demonstrated at under 800 mdB per connection with passive alignment times under three seconds—and is engineered to scale toward 10 mdB loss per connection across hundreds of millions of units. By simplifying the assembly process and reducing optical loss, the solution enables high‑performance silicon photonic interfaces for quantum computing and AI hardware applications while supporting mass‑manufacturable production volumes.
Target Audience
Primary customers are manufacturers of silicon photonic modules for quantum computing and AI accelerator hardware who need low‑loss, scalable fiber‑to‑chip interconnects.
Features
- Detachable connector architecture with passive alignment under 3 seconds
- No micro‑optics, bump‑on‑carrier, active alignment, or epoxy required
- Demonstrated insertion loss below 800 mdB per connection, targeting <400 mdB and ultimately 10 mdB at scale
- Proven ultra‑low‑loss performance validated in peer‑reviewed silicon photonic quantum computing experiments
- Designed for high‑volume manufacturing, aiming at 10 million‑unit production pathways