Corintis designs and mass‑produces microfluidic cold plates and co‑packaged cooling solutions for high‑power AI and HPC chips. Their platform delivers up to 10× better chip cooling with lower flow rates and pressure drops, enabling higher TDP in data‑center and HPC environments. The technology is built for large‑scale production, targeting more efficient thermal management in next‑generation compute workloads.
Funding
$4.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
High-performance computing applications, particularly in data centers, are constrained by the thermal limitations of current chip cooling solutions. Existing methods struggle to dissipate the increasing heat generated by densely packed, high-power chips, leading to reduced computational power and increased energy consumption.
Solution
Corintis provides microfluidic cooling solutions that integrate cooling channels directly within semiconductor chips, enabling efficient heat extraction. By mimicking the human circulatory system, Corintis' technology uses a network of microchannels to target heat dissipation at specific locations on the chip. This approach allows for higher thermal design power (TDP) with lower flow rates and pressure drops, resulting in improved energy efficiency and the ability to reliably operate high-power chips at lower temperatures. The company's Glacierware platform facilitates the design, building, testing, and mass production of microfluidic cold plates and co-packaged cooling solutions.
Target Audience
The primary target audience includes data centers and high-performance computing (HPC) applications requiring advanced cooling solutions for high-power chips.
Features
- Microfluidic channels integrated directly into the semiconductor die for targeted cooling
- Design inspired by the human circulatory system, optimizing liquid flow to high-heat areas
- Glacierware platform for streamlined design, simulation, and manufacturing of cooling solutions
- Support for high thermal design power (TDP) chips
- Reduced flow rate and pressure drop compared to traditional cooling methods
- Compatibility with gallium nitride (GaN) on silicon substrates