Top 50 3d Ic Packaging in Asia

Silicon Box provides semiconductor integration services that encompass full chip design and manufacturing. The company addresses the challenges of complex chip development by offering streamlined processes that enhance design efficiency and reduce time-to-market for semiconductor products.

Aantaric Technologies specializes in custom integrated circuit (IC) development, focusing on analog and mixed-signal designs for applications such as power management and automotive controllers. The startup addresses the need for efficient product development in the semiconductor industry by providing end-to-end solutions that accelerate electronic product design and enhance system performance.

The startup manufactures a chip that utilizes Compute Express Link technology to enable data center operators to efficiently pool and manage artificial intelligence accelerators, processors, and memory. This approach enhances system performance by providing adequate memory resources for diverse device integration, addressing the challenges of scalability and resource allocation in large-scale computing environments.

RAAAM develops GCRAM, a high-density on-chip memory technology that integrates seamlessly with standard CMOS processes, offering up to 50% area reduction and 10 times lower power consumption compared to traditional SRAM. This technology addresses the limitations of SRAM scaling, enabling semiconductor companies to enhance memory capacity and efficiency in applications such as AI, automotive, and 5G without incurring additional fabrication costs.

OPENEDGES Technology offers integrated memory subsystem IP solutions for ASIC and ASSP development. Their IP suite, including DDR PHY, memory controllers, and interconnects, optimizes power, silicon area, and DRAM performance for advanced computing applications.

The startup develops digital infrastructure technology that integrates semiconductor expertise with data center design and operations to enhance the delivery of application-specific integrated circuits (ASICs). With a 35-year supply chain partnership with Taiwan Semiconductor Manufacturing Corporation (TSMC), the company ensures timely access to high-performance ASICs, addressing the demand for efficient and reliable semiconductor solutions.

DustPhotonics develops pluggable optical modules utilizing Low Loss Laser Coupling (L3C) technology to integrate off-the-shelf lasers on silicon, enabling high-speed data transmission at rates of 400Gb/s to 1.6Tb/s. This technology addresses the need for lower power consumption and reduced costs in data center and high-performance computing applications by minimizing the number of lasers required in the system.

InCore designs customizable RISC-V processor cores and automation tools that streamline the development of system-on-chip (SoC) solutions, significantly reducing design time and costs. Their technology addresses the inefficiencies of traditional chip design methods, enabling faster and more flexible silicon development for various applications.

FermionIC Design develops custom high-speed SERDES and PLLs optimized for wireline communication standards, specifically focusing on NRZ and PAM4 transceiver cores. Their solutions enhance data transmission efficiency and reliability in backplane applications, addressing the growing demand for high-performance connectivity in semiconductor technology.

This fabless company designs and plans to manufacture semiconductor chips in India, targeting sectors such as electric vehicles, green energy, and consumer electronics. By offering customized chip solutions, they aim to enhance product performance and meet the specific needs of Indian manufacturers.

This company designs semiconductors and RF modules with proprietary intellectual property for use in IoT, healthcare, automotive, and defense applications. Their chips aim to address semiconductor shortages in the technology sector.

Rimal Semiconductors offers end-to-end design services for high-performance power semiconductor chips, including MOSFETs, IGBTs, SiC, and GaN. They also provide comprehensive Printed Circuit Board Assembly (PCBA) development, accelerating product realization from concept to mass production for energy, mobility, and industrial applications.

The startup develops semiconductor packaging and assembly technology that utilizes single or multiple viscosity materials such as polymers, metals, and ceramics to enhance electronic miniaturization and sustainability. Their method combines the productivity of screen printing with high-quality resolution and industrial production speed, facilitating semiconductor packaging re-shoring.

PxE has developed a chip-based 3D imaging technology that replaces traditional Bayer filters with a holographic imaging system, enabling the capture of RGB, infrared, and depth data from a single snapshot. This solution addresses the limitations of standard CMOS cameras by providing high-resolution images with precise depth information, suitable for cost-sensitive applications across various platforms.

This company designs and manufactures silicon photonics chips for light emission and detection. Their advanced photonic components and systems, including nano-photonic sensors and integrated photonic circuits, leverage Taiwan's semiconductor manufacturing ecosystem.

The startup develops a silicon-photonics platform that integrates a single-chip optical engine for optical transceivers, enabling deployment in various ICT environments. This technology offers a low-cost, low-maintenance solution that provides customized, compact, and reliable systems for enhanced data transmission efficiency.

3PEAK designs and supplies a broad portfolio of high-performance analog integrated circuits, including amplifiers, data converters, and power management solutions. They provide application-specific components for automotive, communication, and industrial electronics, simplifying the selection process for engineers.

The startup develops a family of processors optimized for cloud and edge computing, specifically targeting artificial intelligence and machine learning workloads. Their patent-pending chip design technology reduces transistor count while enhancing performance, enabling businesses to lower power consumption and improve yield and reliability.

The startup offers a semiconductor design platform that utilizes machine learning for automated modeling, enabling self-learning from collected data. This technology reduces development time and minimizes design errors, enhancing the efficiency of semiconductor design processes.

The startup has developed a 3D viewing technology that utilizes a lenticular array combined with proprietary eye-tracking and pixel-mapping algorithms to deliver autostereoscopic content on smartphones and tablets. This technology enables users to experience 3D effects without the need for glasses or head-mounted displays, making 3D content more accessible and economical.

MetaX specializes in integrated circuit design, focusing on optimizing power efficiency and performance for high-speed applications. The company addresses the challenges of increasing energy consumption and heat generation in electronic devices by providing tailored circuit solutions that enhance reliability and reduce operational costs.

Relectra provides hardware solutions that enhance design efficiency and lower production costs through a robust procurement network and engineering expertise. The startup focuses on optimizing supply chain operations for clients in manufacturing, ensuring reliable sourcing and streamlined processes.

ChromoPIC develops application-specific photonic integrated chips tailored for OEMs in industries such as medical devices and quantum technology, enhancing integration and reliability in complex systems. Their technology addresses the need for high-fidelity signal processing and detection in applications like spectroscopy and inertial measurement units.

SAPIEN Semiconductors develops display driver ASIC solutions specifically for micro-LED technology, targeting applications in augmented reality, mixed reality, and digital signage. Their products enable high-resolution displays with pixel pitches of 4 to 5 micrometers, addressing the need for compact, energy-efficient visual solutions in various industries.

Gigalane delivers integrated RF connectivity solutions and semiconductor manufacturing equipment for the telecommunications and microelectronics industries. They provide mmWave RF connectivity for 5G infrastructure and advanced fabrication tools like etchers and nanoimprint systems for next-generation electronic components.

Silicon Craft Technology designs and fabricates RFID and NFC integrated circuits, offering custom ASIC development for specialized semiconductor needs. They provide tailored IC solutions for industries like industrial IoT, automotive, and healthcare, streamlining the integration of secure and connected functionalities.

This startup provides a software platform that optimizes chip development workflows by integrating design, simulation, and testing processes. By enhancing collaboration and reducing time-to-market, it addresses inefficiencies in hardware development that can lead to increased costs and delays.

Vessel offers advanced manufacturing equipment and specialized materials for the display and semiconductor industries. Their solutions include In-Line Systems, 3D Lamination, and Dispenser equipment, alongside Thermal Pads and EMC materials, to enhance precision and quality in electronic component production.

ASPEED Technology designs fabless System-on-Chip (SoC) solutions for advanced computing and media processing. Their specialized SoCs enable efficient remote server management, PC/AV extension, and panoramic image processing for cloud, enterprise, and smart AV applications.

The startup develops 3D air floating image technology products that utilize nanotechnology, laser processing, and optical design to create precise mold designs and ultra-fine processing on curved surfaces. This technology enables manufacturers to efficiently prototype and implement innovations inspired by natural processes, enhancing production capabilities and reducing time-to-market.

Simetric Semiconductor provides integrated solutions for advanced packaging materials through the sale of wet processing equipment and process management services. The company enhances production efficiency and reduces time-to-market for manufacturers by optimizing manufacturing lines and improving yield rates in the substrate production process.

ADChips offers integrated SoC design and development services, providing a portfolio of processors and IP cores to accelerate the creation of custom semiconductor solutions. They enable companies to integrate advanced functionality into embedded systems and consumer electronics without extensive in-house ASIC design capabilities.

Aivatech develops 3D-vision AIoT chips that integrate advanced facial and palm vein recognition technologies, RGB-D depth cameras, and vehicle license plate recognition systems. These solutions enhance security and automation in various applications, addressing the need for efficient and accurate identification in smart environments.

This company researches and develops advanced semiconductor materials, providing specialized compounds to semiconductor manufacturers. Their focus is on delivering high-performance materials essential for next-generation electronic devices.

Tyntek develops and manufactures high-brightness LED chips and optoelectronic components, including InGaN, AlGaInP, and InGaAs-based devices. They provide advanced solutions for lighting, automotive, and telecommunications applications.