Rimal Semiconductors provides a full‑stack semiconductor engineering service that designs custom power chips—including MOSFETs, SJ‑MOSFETs, IGBTs, SiC and GaN devices—and develops PCBA assemblies with end‑to‑end verification and reliability testing. Their offering also includes an 8–12‑week design‑training program to equip engineers with hands‑on experience in chip and PCB design using industry tools. This integrated approach shortens development cycles for OEMs and system integrators in renewable energy, EVs, industrial drives, and smart‑lighting.
Funding
Funding not disclosed
Founders
Product
Problem
Companies developing power electronics and renewable energy solutions often lack in‑house expertise and local resources for custom semiconductor chip design, PCB assembly, and reliable testing, leading to long development cycles and dependence on overseas partners.
Solution
Rimal Semiconductors offers a full‑stack semiconductor engineering service that covers custom chip design (including MOSFETs, SJ‑MOSFETs, IGBTs, SiC and GaN devices), PCB assembly development, and comprehensive verification. Their design flow follows industry‑standard stages—from requirements gathering and architecture through RTL verification, physical layout, tape‑out, fabrication, and post‑fabrication testing—ensuring high‑performance, low‑loss power components. The company also provides a design‑training program that equips Saudi engineers with hands‑on experience in chip and PCBA design, verification, and testing, bridging academic knowledge with real‑world projects. By integrating design, manufacturing, and talent development, Rimal reduces time‑to‑market and lowers reliance on external foundries.
Target Audience
Primary customers are OEMs and system integrators in renewable energy, electric vehicles, industrial power drives, and smart‑lighting sectors that require custom power semiconductors and reliable PCBA solutions, as well as engineering teams seeking specialized training in semiconductor design.
Features
- Custom power‑chip design covering versatile MOSFETs, efficient SJ‑MOSFETs, robust IGBTs, high‑performance SiC and compact GaN devices
- End‑to‑end design workflow: specification, architecture, RTL coding, formal verification, physical layout, tape‑out, and foundry hand‑off
- Post‑fabrication testing and packaging with functional, burn‑in, and reliability assessments
- PCBA development service including schematic capture, component selection, high‑speed layout, prototype fabrication, SMT/THT assembly, and comprehensive functional testing
- Accelerated project timelines (≈5.5 weeks for PCBA) with detailed DRC/DFM analysis and 1000‑hour reliability testing for first‑batch units
- Design‑training program delivering 8–12 week chip design tracks and 6–10 week PCBA tracks using industry tools such as Cadence, Synopsys, Altium Designer, and KiCad
- International exchange placements and mentorship from global design firms to provide real‑world project experience