Suzhou Xinrui Technology specializes in the research, development, and production of semiconductor wafer bonding and debonding equipment, catering to wafer sizes from 2 to 12 inches. The company addresses the need for efficient and customizable bonding solutions across various semiconductor applications, including advanced packaging and power devices, by leveraging over 20 years of industry experience in its technical team.
Funding
Funding not disclosed
Founders
Product
Problem
The semiconductor industry requires precise and efficient wafer bonding and debonding processes for advanced packaging, power devices, and other applications. Existing solutions may lack the necessary customization options to accommodate diverse wafer sizes and bonding materials, hindering process optimization and throughput.
Solution
Suzhou Xinrui Technology provides a range of wafer bonding and debonding equipment designed for semiconductor manufacturing. Their equipment supports wafer sizes from 2 to 12 inches and accommodates various bonding techniques, including temporary bonding (using胶与蜡), permanent bonding, and hybrid bonding. Xinrui's solutions address the need for customizable equipment by offering options for different bonding materials and processes, including laser debonding with UV-IR laser sources and plasma treatment for surface preparation. The company's offerings include fully automated and semi-automatic machines to cater to different production volumes and automation requirements.
Target Audience
The primary customers are semiconductor manufacturers involved in advanced packaging, power devices, RF devices, optical communication, CIS, and other applications requiring wafer bonding and debonding processes.
Features
- Equipment supports wafer sizes from 2 to 12 inches.
- Offers both fully automated and semi-automatic systems.
- Provides solutions for temporary bonding, permanent bonding, and hybrid bonding.
- Utilizes laser debonding technology with options for UV-IR laser sources.
- Includes plasma activation systems for surface preparation to enhance bonding strength.
- Offers customization options to accommodate diverse bonding materials and processes.
- Fully automated equipment can integrate with SECS/GEM for data transmission.