ZutaCore offers a waterless, two-phase liquid cooling system that directly cools processors, eliminating throttling and enhancing sustained performance. This technology reduces power consumption and operational costs, making it ideal for high-performance computing and AI data centers.
Funding
Funding not disclosed
WFounders
Product
Problem
High-performance computing (HPC) and AI data centers face increasing challenges in managing the heat generated by increasingly powerful processors, leading to performance throttling, high energy consumption, and increased operational costs. Traditional air-cooling methods are becoming insufficient to handle the thermal loads of modern processors, while water-based liquid cooling systems introduce risks of leaks and corrosion.
Solution
ZutaCore offers HyperCool, a direct-to-chip, waterless liquid cooling solution designed to efficiently remove heat from high-density computing environments. Utilizing a two-phase boiling and condensation process with a non-conductive heat transfer fluid, HyperCool directly cools processors, eliminating performance throttling and enabling higher sustained performance. The closed-loop system is scalable and can be deployed in new or retrofitted data centers, supporting computing power of 120kW and above. This approach allows for server densification, reduces power consumption by up to 82% compared to air cooling, and enables 100% heat reuse for applications like heating adjacent offices.
Target Audience
The primary target audience includes data centers, AI factories, HPC facilities, and enterprises seeking to improve cooling efficiency, reduce energy consumption, and increase compute density while maintaining system reliability and sustainability.
Features
- Direct-to-chip cooling using a two-phase, closed-loop system with a non-conductive heat transfer fluid
- Waterless design eliminates the risk of leaks, corrosion, and water-related damage to IT equipment
- Supports processors with thermal design power (TDP) of 2800W and beyond
- Scalable solution that can be deployed in new or retrofitted data centers
- Increases compute density by supporting >250kW per rack
- Reduces energy consumption by up to 82% compared to air-based cooling
- Enables 100% heat reuse for applications like heating adjacent offices
- Optional Software Defined Cooling (SDC) platform automates resource provisioning and management to improve system performance and optimization