Yalosys provides ultrafast laser microprocessing services for glass, sapphire, quartz and other transparent substrates, delivering sub‑micron dicing, drilling, welding and hermetic sealing within ISO‑5 to ISO‑7 cleanrooms. The company supports customers from feasibility studies through custom process development to low‑ and mid‑volume production, offering ISO 13485‑compliant parts, integrated metrology and engineering consultancy for medical device and optical component manufacturers.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturers of medical devices and optical components often require precise micro‑features in glass or sapphire substrates, but conventional machining methods are limited in resolution, speed, and the ability to work within cleanroom environments, leading to high costs and long development cycles for “in‑glass” microsystems.
Solution
Yalosys offers ultrafast laser microprocessing services that create high‑precision structures such as dicing, drilling, and welding directly in glass, sapphire, and related transparent materials within ISO‑5 to ISO‑7 cleanrooms. The company guides customers from feasibility assessment through custom laser process development to batch production, delivering fully documented, ISO 13485‑compliant parts and subsystems. Integrated metrology tools (optical microscopy, confocal sensing, impedance analysis) verify feature quality, while engineering and consultancy support ensure regulatory compliance and scalable manufacturing. Yalosys also provides contract manufacturing and turnkey “glass‑sealed” microsystem development for medical implants and optical devices, enabling cost‑effective low‑ to mid‑volume production.
Target Audience
Primary customers are medical device manufacturers, implant developers, and optical component producers that require precision glass or sapphire micro‑features and need ISO 13485‑compliant, cleanroom‑qualified processing.
Features
- Ultrafast laser dicing, drilling, and welding of glass, sapphire, quartz, and other transparent substrates with sub‑micron resolution
- Cleanroom (ISO 5‑7) processing to meet GMP and ISO 13485 requirements for MedTech applications
- Full process workflow: task analysis, free‑of‑charge feasibility study, custom laser process development, batch production, and detailed lab reporting
- In‑house metrology suite (Leica optical microscope, Keyence confocal sensor, Rohde & Schwarz impedance instruments) for real‑time quality control
- Engineering services covering wafer handling, component assembly, die/wire bonding, metallic layer deposition, and clean packaging
- Contract manufacturing with regulatory documentation, validation batches, and scalable pilot‑plant production
- Capability to develop hermetic glass‑to‑glass seals and integrated microsystems for implantable medical devices