X‑Trinsic provides end‑to‑end chemical‑mechanical planarization and precision grinding services for wide band gap semiconductor wafers, including custom slurry development, equipment qualification, and process diagnostics to improve yield and reduce time‑to‑volume. It also offers equipment leasing and commercial support such as marketing, branding, and business‑development consulting to help customers bring SiC, GaN and other WBG products to market.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturers of wide band gap (WBG) semiconductors encounter significant hurdles in chemical‑mechanical planarization (CMP) and precision grinding/polishing of ultrahard wafers such as silicon carbide. These processes require specialized equipment, expert know‑how, and extensive diagnostics, which many companies lack in‑house, leading to longer development cycles and lower yields. Additionally, WBG firms often need targeted marketing and business‑development support to bring their technologies to market effectively.
Solution
X‑Trinsic delivers a combined technical and commercial service platform for WBG semiconductor producers. The company provides end‑to‑end CMP and precision grinding/polishing process development, from R&D prototyping through volume manufacturing, leveraging proprietary slurry formulations and equipment expertise. Process diagnostics and failure‑analysis services identify root causes and optimize throughput, while equipment access or leasing options reduce capital outlay. Complementary marketing, branding, and business‑development teams help customers position their WBG products, craft go‑to‑market strategies, and connect with potential partners or customers. By integrating deep material‑processing knowledge with commercial expertise, X‑Trinsic shortens time‑to‑volume and improves product profitability.
Target Audience
Primary customers are WBG semiconductor manufacturers and fab facilities developing silicon carbide, gallium nitride, or other wide band gap devices, as well as technology startups seeking both process optimization and market‑entry support.
Features
- CMP process engineering for ultrahard wafers (SiC, GaN) including custom slurry development and endpoint detection
- Precision grinding and polishing workflows optimized for sub‑nanometer surface roughness and low defectivity
- Full‑scale prototype-to‑volume production support, including equipment qualification and fab integration
- Process diagnostics suite offering metrology, defect analysis, and data‑driven yield optimization
- Equipment access models (lease, shared‑use) to minimize upfront capital expenditure
- Marketing and branding services tailored to WBG technology positioning, messaging, and collateral creation
- Business‑development consulting covering partner identification, sales enablement, and market entry planning
- Cross‑functional project management that synchronizes technical and commercial activities for seamless product rollout