Wintest provides advanced inspection and testing equipment for semiconductor and display manufacturers. Their solutions include CT X-ray systems for 3D imaging, IC testers for analog and digital devices, and burn-in systems to enhance product quality and optimize production yields.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturers of image sensors, displays, and integrated circuits require specialized equipment for precise testing and analysis throughout their production cycles. Ensuring the quality and reliability of these components necessitates advanced inspection and burn-in solutions that can handle diverse device types and complex testing parameters.
Solution
Wintest provides a comprehensive suite of advanced inspection and testing equipment tailored for the semiconductor and display industries. Leveraging proprietary technologies and global development capabilities, the company offers solutions for wafer-level testing, final product inspection, and burn-in processes. Their product portfolio includes specialized CT scanners for 3D imaging, versatile IC testers capable of handling various analog and digital devices, and burn-in systems designed to accelerate reliability testing. Wintest's solutions aim to enhance product quality, reduce manufacturing defects, and optimize production yields for their clients.
Target Audience
The primary target audience includes manufacturers and developers in the semiconductor industry, particularly those involved in image sensor, display panel, and integrated circuit production, as well as automotive electronics and power device sectors.
Features
- **CT X-ray Inspection Systems:**
- Ring CT X-ray inspection systems for inline factory inspection, featuring rotating X-ray sources and high-precision CMOS flat panel detectors.
- Micro CT X-ray 3D tomographic inspection systems (e.g., WTS-CT130) offering high resolution (10μm), 360-degree rotation for accurate 3D reconstruction, and 130kV X-ray energy support.
- Sealed X-ray tubes (150kV or 180kV options) with low leakage radiation (<1μSv) for operator safety.
- **Semiconductor IC Testers:**
- High-end CCD/CMOS image sensor wafer and final test equipment (e.g., WTS-311NX) with enhanced logic test capabilities, high-frequency pixel data acquisition, and multi-device parallel testing.
- Analog and mixed-signal IC test systems (e.g., WTS-89) supporting automotive and power ICs, with capabilities for high voltage (2000V) and high current (500A) testing, and patented asynchronous (ASync) measurement for resource optimization.
- General-purpose logic IC test equipment (e.g., WTS-677) with tester-in-test-head architecture for high speed, reduced footprint, and energy efficiency, also supporting linear device IC testing with optional digitizers.
- **Burn-in Systems:**
- Contact Monitor Burn-in systems that monitor contact integrity during the burn-in process.
- Monitor Burn-in (BI-M Series) for logic, analog, and high-voltage power ICs, supporting multi-power supplies and high-speed operation for fine-pitch processes.
- Dynamic Burn-in (BI-D Series) and Test Burn-in (BI-T Series) systems for logic and memory ICs, with the latter also performing internal device operation tests.
- QAT (Quality Assurance Department) Monitor Burn-in systems supporting low-temperature burn-in (-55°C).
- Custom burn-in systems and system renewal services.
- **Device Analysis and Evaluation Services:**
- Comprehensive evaluation, failure analysis, and sorting services for various devices.
- Equipped with high-speed LSI testers, wafer probers, burn-in furnaces (-70°C to 180°C), high-sampling oscilloscopes (40G), noise simulators, spectrum analyzers, and various microscopes.
- Capabilities include characterization testing, memory analysis (fail bit analysis, V SHMOO), endurance testing, and analog IC parameter measurement.
- **ROM Programming Services:**
- High-volume, high-reliability ROM programming services with a processing capacity of 3 million units per month, utilizing proprietary automated machinery.
- Services include Flash ROM programming, device inspection, reliability evaluation, and burn-in services, with a focus on short lead times and cost-effectiveness.