Visual Semiconductor designs 3D application‑specific integrated circuits that enable glasses‑free light‑field rendering on a range of display panels, from smartphones to large‑format screens. The ASICs deliver sub‑10 mW per‑frame power consumption and support 4K+ resolution, with built‑in IP protection and a software SDK for easy integration by OEMs.
Funding
Funding not disclosed
Founders
Product
Problem
Consumers and enterprises lack affordable, high‑performance hardware that can deliver glasses‑free, immersive visual experiences on devices ranging from smartphones to large‑format displays. Existing display pipelines rely on bulky optics or generic chips that limit efficiency, increase cost, and constrain the development of AR/VR and Metaverse platforms.
Solution
Visual Semiconductor provides a portfolio of proprietary three‑dimensional application‑specific integrated circuits (3D ASICs) optimized for next‑generation display architectures. The ASICs combine low‑power, high‑throughput processing with built‑in IP protection, enabling manufacturers to embed glasses‑free light‑field rendering directly into panels. By collaborating with leading foundries such as TSMC, the company ensures wafer‑scale cost efficiency for high‑volume production. The technology is compatible with emerging panel formats—including miniLED, microLED, and Dynamic AMOLED—allowing seamless integration into smartphones, tablets, televisions, AR/VR headsets, and large‑scale advertising or cinema screens. An accompanying software stack offers drivers and APIs that simplify adoption for OEMs and accelerate time‑to‑market for immersive applications in the Metaverse and beyond.
Target Audience
Primary customers are OEMs and system integrators developing smartphones, tablets, televisions, AR/VR headsets, and large‑format commercial displays that require glasses‑free immersive visual capabilities.
Features
- 3D ASIC architecture delivering sub‑10 mW power consumption per frame while supporting 4K‑plus resolution rendering
- Integrated light‑field processing pipelines that enable glasses‑free stereoscopic output without external optics
- Fabrication partnership with TSMC for 7 nm/5 nm node production, ensuring high yield and low per‑unit cost at scale
- Compatibility layer for miniLED, microLED, and Dynamic AMOLED panels, providing native support for high‑dynamic‑range and high‑brightness use cases
- Secure IP enclave and hardware‑based encryption to protect proprietary display algorithms and content
- Comprehensive SDK with C/C++ and Python bindings, plus standardized APIs for driver integration across Android, Linux, and RTOS environments
- Licensing model that allows OEMs to embed the ASIC IP directly into custom silicon or use pre‑fabricated reference modules