Ultrascale Digital Infrastructure develops vertical immersion cooling and Rear-Door Heat eXchanger technologies to enhance data center efficiency, enabling support for over 300 kW per rack while achieving a Power Usage Effectiveness (PUE) of 1.03. The company addresses the high energy consumption and water usage of traditional data centers by providing near-zero carbon emissions and eliminating the need for refrigerants or water in cooling processes.
Funding
$1.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Traditional data centers consume significant energy and water, contributing to high operational costs and environmental impact. They often struggle to efficiently cool high-density racks, limiting the ability to support advanced computing technologies like AI and HPC.
Solution
Ultrascale Digital Infrastructure (UDI) provides innovative cooling solutions for data centers, combining vertical immersion cooling with Rear-Door Heat eXchanger (RDHx) technologies. This approach enables data centers to support over 300kW per rack while achieving a Power Usage Effectiveness (PUE) of 1.03. UDI's solutions minimize carbon emissions and eliminate water consumption in cooling processes, addressing regulatory pressures and investor focus on sustainability. By optimizing resource utilization and maximizing rack density, UDI empowers data center operators to support demanding infrastructure while unlocking new possibilities for site selection, construction, and operation. The company's technologies future-proof new and existing data centers, allowing them to handle next-generation server technology and increase compute capacity per square meter.
Target Audience
UDI's primary customers are data center operators, colocation providers, and enterprises seeking to enhance energy efficiency, reduce environmental impact, and support high-density computing environments.
Features
- Vertical immersion cooling within a standard rack footprint for increased density
- Rear-Door Heat eXchanger (RDHx) technologies for efficient heat removal
- Support for over 300kW per rack, enabling the use of high-powered chipsets
- Power Usage Effectiveness (PUE) of 1.03, ensuring energy-efficient operation in any climate
- Near-zero carbon emissions, aligning with environmental responsibility goals
- Zero water consumption, eliminating the need for water-based cooling systems
- Compatibility with both legacy and greenfield data centers, providing versatile solutions
- Capability to handle future chips at 1000 Watts Thermal Design Power (TDP) or higher