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Thermal Transformer

Thermal Transformer provides high‑power‑density adsorption chillers that convert low‑grade waste heat from AI data centers, high‑performance computing facilities, and industrial plants into cooling power. By driving the refrigeration cycle with heat instead of electricity, the modular system reduces the electrical load of cooling by about 30 % and can be integrated into existing liquid‑cooling loops for scalable, de‑electrified cooling.

Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Data centers and high‑performance industrial facilities generate large amounts of low‑grade waste heat, yet traditional cooling systems add additional electrical demand, increasing overall energy consumption and carbon footprint.

Solution

Thermal Transformer converts this low‑temperature waste heat into cooling power using high‑power‑density adsorption chillers. By driving the refrigeration cycle with heat rather than electricity, the technology reduces the electrical load of cooling systems by roughly 30 % compared with conventional vapor‑compression solutions. The approach is modular and can be integrated into existing liquid‑cooling loops of AI compute clusters or industrial processes, enabling a scalable, de‑electrified cooling pathway that leverages heat already produced on site.

Target Audience

Primary customers are operators of AI data centers, high‑performance computing facilities, and industrial plants that produce continuous low‑grade waste heat and require efficient cooling solutions.

Features

  • High‑power‑density adsorption chiller that operates on low‑grade waste heat (30‑80 °C)
  • Fully modular units compatible with standard liquid‑cooling infrastructure in data centers and industrial plants
  • No electrical input for the refrigeration cycle; only minimal controls and sensors require power
  • Integrated heat‑exchange network that recovers waste heat from servers or process equipment and feeds it directly to the adsorber
  • Proven performance based on decades of research in thermal management for high‑performance computing facilities
  • Scalable design allowing parallel deployment to match growing cooling demand without additional electricity
This profile is AI-generated and may contain inaccuracies.