Terecircuits develops specialized materials and processes for micron-scale assembly and mass transfer in advanced electronics, enabling the production of components smaller than a grain of pollen with 500-nanometer accuracy. This technology addresses the need for faster and more precise manufacturing methods, achieving assembly speeds 1000 times faster than current best practices.
Funding
$3.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Advanced manufacturing processes for IoT devices, wearables, and displays require faster and more precise assembly methods than current pick-and-place technologies can offer. Existing solutions struggle to handle the increasing demand for miniaturization and high-volume production of components smaller than a grain of pollen. This limitation hinders the scalability and cost-effectiveness of next-generation electronics manufacturing.
Solution
Terecircuits provides advanced materials and processes for micron-scale assembly and mass transfer, enabling the production of miniaturized components with sub-micron accuracy at significantly higher speeds. Their core product, Terefilm® photopolymer, facilitates precision mass transfer, high-resolution photolithography, and temporary bonding-debonding in semiconductor advanced packaging. By utilizing a unique controlled decomposition pathway, Terefilm® ensures uniform activation and vaporization over targeted areas, allowing for selective die release and pitch conversion. This technology enables 1000x faster assembly speeds and 10x greater accuracy compared to traditional methods, while also eliminating the need for downstream cleaning steps due to its clean decomposition properties.
Target Audience
The primary target audience includes manufacturers of IoT devices, wearables, microLED displays, and advanced System in Package (SiP) solutions seeking to improve the speed, accuracy, and scalability of their assembly processes.
Features
- Terefilm® photopolymer enables residue-free vaporization upon activation, eliminating the need for post-processing cleaning.
- Low activation energy requirements reduce power usage and extend the lifetime of optical components in laser-induced forward transfer (LIFT) systems.
- Precise patterning capabilities allow for selective die release and pitch conversion with sub-micron street width control.
- Compatible with photomasking techniques for high-throughput transfer of thousands or millions of components with a single nanosecond laser pulse.
- Offers thermal stability up to ~180 °C prior to UV exposure, allowing integration into manufacturing process flows with elevated temperature steps.
- Controlled decomposition pathway ensures uniform activation and vaporization over targeted areas.