TeraSignal develops Intelligent Re-Driver (IRD) technology for protocol-agnostic, linear pluggable optics (LPO) in AI infrastructure. Their TSLink solution offers DSP-free operation, achieving significant power reduction and near-zero latency for 200G+ copper interconnects. This technology provides real-time link diagnostics and automatic link training to ensure signal integrity for high-performance computing and data center applications.
Funding
Funding not disclosed
Founders
Product
Problem
High-speed data transmission in AI infrastructure faces challenges in power consumption, latency, and link reliability, particularly with the increasing demands of data centers. Traditional Linear Pluggable Optics (LPO) modules rely on DSP-based retimers, which add to power consumption and latency. Existing solutions lack the automatic adaptation and real-time diagnostics needed for optimal link performance in complex environments.
Solution
TeraSignal's TSLink Intelligent Re-Driver (IRD) technology provides a CMOS-based solution for enhancing high-speed data transmission in AI infrastructure. Unlike traditional LPO modules, TSLink eliminates the need for DSPs by using existing microcontroller resources for automatic link training and real-time performance monitoring. This approach significantly reduces power consumption, minimizes latency, and ensures reliable link integrity. The TS8401/02 intelligent 400G (4x100G) PAM-4 modulator driver integrates digital eye monitoring and link training to provide real-time insights and automatic configuration, optimizing data transmission for AI and high-performance computing environments.
Target Audience
The primary target audience includes data centers, AI infrastructure providers, and developers of high-performance computing systems who require efficient, low-latency, and reliable interconnect solutions.
Features
- CMOS-based Intelligent Re-Driver (IRD) technology for high-speed data transmission
- Automatic link training and real-time performance monitoring, eliminating the need for DSPs
- Digital eye monitoring and BER reporting for continuous, peak link performance
- CMIS integration for automatic connection optimization between host and module
- Support for PCIe and CXL connectivity for GPUs, accelerators, and FPGAs
- Compatibility with Active Ethernet (100/50/25G per Lane) for intra-rack and inter-rack connectivity
- Solutions for expanding memory bandwidth and capacity