TeraNova

This startup develops metrology instruments using optical and terahertz radiations for semiconductor characterization and scatterometry. These instruments provide quality control for wafers used in photonics and quantum applications.

Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

The fabrication of nanostructures and thin films for photonics, semiconductor, and quantum technologies requires precise quality control to ensure optimal performance. Traditional methods for characterizing these materials can be destructive or lack the necessary resolution and sensitivity to detect subtle variations in geometrical parameters and optical properties. This can lead to inefficiencies in production and compromised device performance.

Solution

TeraNova provides non-destructive metrology solutions utilizing optical scatterometry and terahertz radiation to characterize semiconductor wafers and nanostructures. Their patented technology enables the inspection of gratings and thin films, determining modifications of geometrical parameters and optical properties during fabrication. The LabScatter instrument employs Fourier microscopy with collimated illumination to simultaneously collect the intensity of diffracted and reflected light, extracting crucial information such as grating pitch, height, width, residual layer thickness, sidewall angle, and refractive index. Additionally, their Terahertz Time-Domain Near-Field Microscopy allows for the investigation of transient photo-conductivity and carrier lifetime in photo-excited semiconductors, providing valuable data for semiconductor characterization and quality inspection.

Target Audience

TeraNova's primary customers are manufacturers and researchers in the photonics, semiconductor, and quantum technology industries who require precise and non-destructive characterization of nanostructures and thin films.

Features

LabScatter instrument for critical dimension metrology and scatterometry of gratings and thin films
Terahertz Time-Domain Near-Field Microscopy for semiconductor characterization
Single-nanometer resolution, sensitivity, and reproducibility in metrology measurements
Non-destructive and contact-free inspection methods
Patented technology for determining modifications of geometrical parameters and optical properties
Capability to measure grating pitch, height, width/diameter, residual layer thickness, side wall angle, and refractive index
High throughput and compatibility with various substrate sizes (semiconductor, metal, glass, diamond, etc.)
Intuitive operation equipped with fully automatic software package