Telink provides low-power wireless System-on-Chips (SoCs) integrating multiple IoT connectivity protocols like Bluetooth, Zigbee, Thread, Matter, and Wi-Fi. These highly integrated SoCs simplify the development of smart devices, reducing BOM costs and accelerating time-to-market for applications in smart home, wearables, and industrial automation.
Funding
Funding not disclosed
Founders
Product
Problem
Developing advanced IoT devices requires robust and versatile wireless connectivity solutions. Integrating multiple communication protocols into a single chip can be complex and costly, hindering the rapid deployment of smart products across diverse applications.
Solution
Telink designs and supplies low-power wireless System-on-Chips (SoCs) that integrate a comprehensive suite of connectivity protocols, including Bluetooth (Classic, LE, and Mesh), Zigbee, Thread, Matter, and Wi-Fi. These SoCs provide a unified hardware platform that simplifies the development process for IoT devices. By offering extensive protocol support and development resources, Telink enables manufacturers to accelerate time-to-market for smart home devices, wearables, automotive components, and industrial automation systems. The company's focus on low-power consumption and high integration aims to reduce Bill of Materials (BOM) costs and enhance device performance.
Target Audience
Telink targets Original Design Manufacturers (ODMs), Original Equipment Manufacturers (OEMs), and embedded systems developers who require integrated wireless connectivity solutions for IoT product development.
Features
- Multi-protocol SoCs supporting Bluetooth (Classic, LE, Mesh), Zigbee, Thread, Matter, and Wi-Fi 6.
- RISC-V based microcontroller units (MCUs) for efficient processing.
- Integrated hardware-accelerated security features for enhanced device protection.
- Low-power consumption design optimized for battery-powered IoT applications.
- Comprehensive Software Development Kits (SDKs) and integrated development environments (IDEs) like Telink IoT Studio.
- Support for AI and Machine Learning workloads with platforms like TL-EdgeAI, enabling edge computing capabilities.
- High integration to reduce external component count and lower Bill of Materials (BOM).
- Solutions tailored for diverse applications including Smart Home, Wireless Audio, Remote Controls, Automotive, and Industrial IoT.