Syphos designs and manufactures thin‑film lithium niobate (TFLN) photonic integrated circuits that serve as compact optical engines for metrology, spectroscopy, and quantum applications. Its platform offers validated IP blocks, ready‑to‑package dies, modular components, and custom design services, enabling OEMs and research labs to replace bulky free‑space optics with high‑speed, low‑loss chip‑scale solutions and accelerate time‑to‑market.
Funding
Funding not disclosed
Founders
Product
Problem
Current high‑performance optical systems for metrology, spectroscopy, and quantum technologies rely on discrete components that must be precisely aligned and packaged. This leads to bulky, costly, and less reliable solutions that are difficult to scale for volume manufacturing.
Solution
Syphos provides a comprehensive ecosystem built around thin‑film lithium niobate (TFLN) photonic integrated circuits (PICs) that replace traditional free‑space optics with chip‑scale functionality. By offering validated IP blocks, ready‑to‑package dies, modular components, and custom design services, Syphos enables customers to develop compact, high‑speed, low‑loss optical engines without the complexity of discrete assemblies. The platform supports a broad wavelength range (400 nm–4000 nm), ultrafast electro‑optic modulation (>100 GHz), and strong second‑order non‑linear effects for frequency conversion and quantum state generation. Through wafer‑scale production, Syphos delivers rock‑solid reliability, reduced form factor, and lower per‑unit cost, accelerating time‑to‑market for demanding photonic applications.
Target Audience
Primary customers are OEMs, research labs, and system integrators developing high‑performance metrology, spectroscopy, and quantum photonic products that require compact, reliable, and scalable optical solutions.
Features
- TFLN‑based PICs with propagation losses below 0.1 dB/cm, enabling dense integration of hundreds of components per chip
- Linear electro‑optic modulation exceeding 100 GHz with low power consumption for high‑speed signal processing
- Strong second‑order non‑linearity for efficient frequency conversion and on‑chip quantum state generation
- Broad operational bandwidth covering visible to mid‑infrared (400 nm–4000 nm) for versatile spectroscopy and metrology
- Library of validated IP blocks and building‑block chips to accelerate custom circuit design
- Packaged modular components and known‑good dies ready for system‑level integration or further packaging
- Application‑specific design services that take concepts from idea through to production‑ready photonic chips