SwissBN manufactures wafer‑scale hexagonal boron nitride (h‑BN) films using a proprietary chemical vapor deposition process that delivers atomically flat, low‑defect layers across 2‑ to 8‑inch semiconductor wafers. The continuous h‑BN films provide reliable insulating, substrate, and encapsulation layers for advanced electronic, photonic, and quantum devices, and are supplied in standard wafer formats with technical support for integration into existing fabrication lines.
Funding
Funding not disclosed
Founders
Product
Problem
Many emerging electronic, photonic, and quantum devices require atomically flat, large-area hexagonal boron nitride (h‑BN) as an insulating or encapsulation layer, but existing supply chains provide only small, defect‑prone flakes that are unsuitable for wafer‑scale integration.
Solution
SwissBN produces high‑quality, wafer‑scale 2D h‑BN films using a proprietary chemical vapor deposition (CVD) process. The CVD growth yields continuous, atomically flat layers across standard semiconductor wafer diameters, enabling direct integration into existing fabrication lines. By delivering uniform thickness and low defect density, SwissBN’s material supports reliable dielectric, substrate, and encapsulation functions for next‑generation devices. The company supplies the films in standard wafer formats and offers technical support for process adaptation, reducing the barrier for manufacturers and research teams to adopt 2D h‑BN in their products.
Target Audience
Primary customers are semiconductor manufacturers, device engineers, and research laboratories developing advanced electronics, photonics, and quantum technologies that require high‑quality 2D insulating layers.
Features
- Proprietary CVD process that delivers continuous h‑BN films on 2‑inch to 8‑inch wafers
- Atomically flat surface morphology with sub‑nanometer roughness and low impurity levels
- Precise thickness control from monolayer to several tens of nanometers
- Compatibility with standard semiconductor cleanroom equipment and process flows
- Batch‑scale production with repeatable quality metrics and full material certification
- Optional custom wafer sizes and post‑growth surface treatments for specific device requirements