Starwarden creates a compact, single‑component cooling device that converts extreme localized heat into a manageable thermal load using a 3D‑printed heat‑pipe array. By combining proven heat‑pipe technology with high‑precision metal 3D‑printing, the system provides passive, high‑efficiency thermal management for fusion reactor divertor zones and next‑generation high‑performance semiconductor chips, eliminating complex assembly and scaling to demanding heat fluxes.
Funding
Funding not disclosed
Founders
Product
Problem
Extreme localized heat in fusion reactor divertor zones and high-performance semiconductor devices exceeds the capacity of conventional cooling methods, creating a thermal bottleneck that limits energy output and device speed.
Solution
Starwarden develops a compact, single-component cooling device that converts intense, localized heat into a manageable thermal load. By combining proven heat‑pipe principles with advanced metal 3D‑printing, the company produces a 3D‑printed heat‑pipe array that can be installed with a simple coolant inlet/outlet, eliminating complex assembly. The array efficiently spreads and removes heat from fusion divertor strike points and next‑generation semiconductor chips, enabling continuous net‑positive fusion operation and higher‑frequency semiconductor performance. This approach provides a scalable, high‑efficiency thermal management solution without the need for multiple components or extensive integration effort.
Target Audience
Primary customers are fusion reactor developers and manufacturers, as well as semiconductor companies producing high‑performance, high‑frequency chips that require advanced thermal management.
Features
- Integrated heat‑pipe network fabricated via high‑precision metal 3D‑printing for complex geometries and rapid scalability
- Single‑component design with only coolant in/out connections, removing the need for assembly or additional hardware
- Capability to handle extreme heat fluxes typical of fusion divertor regions and high‑power semiconductor devices
- Passive thermal transport using capillary action and phase‑change mechanisms for high efficiency and reliability
- Adaptable form factors to match diverse reactor and chip architectures while maintaining compact footprint