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Huizhou SPEED Wireless Technology

The company provides compact, wafer‑level integrated modules that combine multi‑band antennas, RF front‑ends, wireless charging (MFI/NFC), biometric fingerprint sensors, and thermal‑management heat pipes into a single low‑profile package. Designed for smartphone, wearable and automotive OEMs, the modules support standards such as 5G mmWave, DAB/CMMB and enable faster prototyping, reduced bill‑of‑materials, and simplified integration via API and reference designs.

Huizhou, China100200+ followers
Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Modern electronic devices—smartphones, wearables, automotive infotainment, and IoT modules—require compact, high‑performance RF and wireless components. Conventional antennas, charging coils, and thermal solutions are often bulky, single‑function, and difficult to integrate, leading to longer development cycles and reduced product reliability.

Solution

The company delivers a portfolio of integrated wireless modules that combine antenna, charging, biometric, and thermal management functions into miniaturized, high‑efficiency packages. Leveraging proprietary RF, material, and wafer‑level packaging technologies, each module meets multi‑band, multi‑protocol standards while maintaining a low profile. A unified design‑to‑manufacturing pipeline provides rapid prototyping, volume production, and end‑to‑end quality assurance, enabling OEMs to shorten time‑to‑market and reduce bill‑of‑materials. Compatibility with industry standards (MFI, NFC, 5G mmWave, DAB/CMMB) ensures seamless integration into existing hardware and firmware stacks.

Target Audience

Primary customers are OEMs of smartphones, tablets, wearables, and automotive manufacturers (including Tier‑1 suppliers) that need integrated RF, charging, biometric, or thermal solutions for high‑volume consumer and industrial products.

Features

  • All‑in‑one smart‑terminal antenna with multi‑band support, integrated RF front‑end, and low‑profile shark‑fin form factor.
  • Vehicle‑mounted antenna suite (PEPS start, DAB/CMMB, radar) featuring dual‑polarization mmWave waveguide designs for 5G macro/micro base stations.
  • MFI‑certified wireless charging receiver employing electromagnetic induction, magnetic resonance, and NFC for fast, interoperable power transfer.
  • Living fingerprint module: ultra‑thin, waterproof, screen‑printed coating with full‑automatic cover line for robust biometric authentication.
  • Heat pipe and radiator modules using high‑efficiency thermal‑conductivity materials and wafer‑level packaging for compact heat dissipation.
  • mmWave radar waveguide antenna delivering dual‑polarization operation for automotive and infrastructure radar applications.
  • End‑to‑end R&D capability with a patented technology base, automated quality‑assurance workflow, and global manufacturing capacity.
  • Flexible API and reference design kits for rapid integration into OEM product lines.
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