Sorex Sensors manufactures high-sensitivity film bulk acoustic resonator (FBAR) mass sensors for indoor air quality monitoring, capable of detecting harmful particulates and volatile organic compounds at femtogram levels. These sensors provide real-time data on air quality, addressing the health risks associated with invisible toxins in residential and industrial environments.
Funding
$2.8M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
UOFounders
Product
Problem
Indoor air quality is often compromised by invisible toxins, including particulates and volatile organic compounds (VOCs) released from common household items and activities. Traditional methods of detecting these toxins are often inadequate, leaving individuals unaware of potential health risks in their homes and workplaces. The inability to accurately and affordably monitor indoor air quality can lead to long-term health issues.
Solution
Sorex Sensors provides high-sensitivity film bulk acoustic resonator (FBAR) mass sensors designed for real-time indoor air quality monitoring. These compact sensors can detect harmful particulates and VOCs at femtogram levels, offering a significant improvement in accuracy and responsiveness compared to existing sensor technologies. By acting as a highly sensitive "nose," the sensors enable users to identify dangerous build-ups of toxins before they reach harmful levels. The FBAR technology allows for the creation of small, low-power sensors that can be integrated into a variety of devices for comprehensive air quality monitoring.
Target Audience
The primary target audience includes manufacturers of air quality monitoring devices, HVAC system providers, and industrial hygiene professionals seeking accurate and real-time detection of airborne toxins.
Features
- FBAR technology enables high mass sensitivity, capable of measuring mass down to the femtogram range.
- Dual-mode functionality allows for simultaneous measurement of mass attachment and temperature.
- Compact design with a sensing area of approximately 100 µm x 100 µm, facilitating fabrication as an array of 20 sensors in a 4 mm x 4 mm silicon die.
- Low power consumption, operating at approximately µW.
- Fabrication on silicon wafers using standard foundry processes for cost-effective manufacturing.