
Solinide Photonics AB
Solinide Photonics develops silicon nitride photonic microcomb chips that replace dozens of discrete lasers in datacenter optical interconnects with a single integrated source. The company's technology achieves over 60% optical conversion efficiency—a significant improvement over the 5-10% industry standard—enabling co-packaged optics architectures that reduce power consumption, cost, and footprint for AI infrastructure and telecommunications.
- Artificial Intelligence
- Hardware
- Semiconductor
- Telecommunications
Funding
Raised to date
€4MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Est. $4.4Macross 1 round

AGCVPHTC€4M · Seed
Announced Aug 2026
Disclosed cumulative: $4.4M
Founders
Founder details are not available yet.
Product
Problem
Modern datacenters consume megawatts of power for optical interconnects alone, and traditional laser technology built on decades-old designs cannot keep pace with the bandwidth demands of AI training clusters and next-generation telecommunications networks. As data volumes between chips grow exponentially, the power, cost, and physical footprint of discrete laser arrays become a critical bottleneck for scaling AI infrastructure.
Solution
Solinide Photonics provides silicon nitride photonic integrated circuits that replace racks of individual lasers with a single microcomb chip producing dozens of precise wavelength channels simultaneously. The company's proprietary photonic molecular architecture achieves over 60% optical conversion efficiency from CW laser light to optical combs, compared to the 5-10% industry standard, dramatically reducing power consumption per optical link. The technology integrates directly with co-packaged optics (CPO) platforms, enabling next-generation datacenter architectures with minimal thermal footprint and standard packaging compatibility. Solinide's packaged O-band micro-comb system is rack-mounted and field-ready, delivering turnkey wavelength stability and 28 wavelength channels above 0dBm for production deployment.
Target Audience
Primary customers are hyperscale datacenter operators, AI infrastructure providers, and telecommunications equipment manufacturers building co-packaged optics systems, as well as photonics researchers and companies needing silicon nitride fabrication services through the MPW program.
Features
- Proprietary photonic molecular design enabling coherent multiwavelength generation with >60% optical conversion efficiency, versus 5-10% industry standard
- Silicon nitride platform with sub-0.03 dB/cm propagation loss and Q-factors around 5 million
- 28 wavelength channels above 0dBm in current SiN processes, with ultra-low threshold operation
- CMOS-compatible fabrication and direct chip integration for co-packaged optics platforms
- Packaged O-band micro-comb system in a rack-mounted, field-ready form factor with turnkey wavelength stability
- Multi-Project Wafer (MPW) service opening silicon nitride photonic fabrication to external researchers and companies