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Solinide Photonics

Solinide Photonics provides a silicon‑nitride microcomb chip that generates a coherent multi‑wavelength optical source with over 60% wall‑plug efficiency, replacing dozens of discrete lasers in co‑packaged optics (CPO) systems. The chip delivers 25+ stable wavelength channels, ultra‑low power thresholds, and CMOS‑compatible fabrication, enabling high‑bandwidth, low‑energy interconnects for hyperscale datacenters, AI accelerators, and telecom equipment.

Partille, SwedenFounded 20218700+ followers
Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Datacenter optical interconnects consume megawatts of power because they rely on dozens of discrete lasers, and existing silicon nitride photonic solutions are expensive, low‑volume, and inefficient, limiting scalability for AI training clusters and next‑generation telecom networks.

Solution

Solinide Photonics offers a silicon nitride microcomb chip that generates more than 60 % optical conversion efficiency from a continuous‑wave pump to a coherent multi‑wavelength comb. By replacing multiple discrete lasers with a single integrated source, the technology dramatically reduces power consumption, thermal load, and footprint in co‑packaged optics (CPO) architectures. The photonic molecular design provides ultra‑low threshold operation, turnkey wavelength stability, and CMOS‑compatible fabrication, enabling direct chip‑level integration with existing CPO platforms. The solution supports 25+ wavelength channels with low propagation loss (<0.03 dB/cm) and high Q‑factors (~5 million), delivering high‑bandwidth, low‑energy links for hyperscale datacenters, AI accelerators, 5G/6G networks, quantum communications, and edge computing. Solinide’s approach is backed by industry partnerships and aims to de‑risk the path from prototype to production deployment.

Target Audience

Primary customers are hyperscale datacenter operators, AI accelerator manufacturers, and telecom equipment vendors developing co‑packaged optics solutions for high‑performance computing and next‑generation network infrastructure.

Features

  • Silicon nitride photonic microcomb chip delivering >60 % wall‑plug efficiency, far above the industry norm of 5‑10 %
  • Generates 25+ wavelength channels (>0 dBm) from a single CW laser, eliminating the need for multiple discrete lasers
  • Ultra‑low threshold operation and sub‑0.03 dB/cm propagation loss with Q‑factors around 5 million for high‑precision signal quality
  • CMOS‑compatible, turnkey fabrication enabling direct integration into co‑packaged optics (CPO) modules with minimal thermal footprint
  • Proven reliability of the silicon nitride platform with a 25‑year projected lifetime for datacenter deployments
  • Scalable packaging compatible with standard rack‑mount form factors, ready for hyperscale and edge computing environments
This profile is AI-generated and may contain inaccuracies.