Smartkem develops advanced semiconductor inks that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible plastic substrates. This technology reduces manufacturing costs and expands the possibilities for flexible, transparent electronic devices like next-generation displays and sensors.
Funding
$7.7M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Traditional semiconductor manufacturing for advanced electronics often requires high-temperature processing, limiting substrate options and increasing production costs. This constraint hinders the development of flexible, low-cost electronic devices such as next-generation displays, AI chips, and sensors.
Solution
Smartkem provides advanced semiconductor materials, specifically TRUFLEX®️ inks, that enable low-temperature processing of organic thin-film transistors (OTFTs) on flexible and transparent plastic substrates. This technology facilitates the creation of high-performing electronic components compatible with existing manufacturing infrastructure, thereby reducing costs and expanding application possibilities. Complementing its material offerings, Smartkem also provides Electronic Design Automation (EDA) tools and access to foundry services, creating a comprehensive ecosystem to accelerate product development and commercialization for its clients.
Target Audience
The primary customers are electronics manufacturers and product developers in the display, AI chip, and sensor markets seeking to leverage flexible electronics and reduce manufacturing costs.
Features
- TRUFLEX®️ semiconductor and dielectric inks for OTFT fabrication.
- Ultra-low temperature processing compatible with flexible plastic substrates.
- Solution processable materials enabling alignment via standard photolithography.
- High-yielding process for large-scale transistor manufacturing.
- Compatibility with various frontplane technologies including MicroLED, EPD, LCD, and OLED.
- Electronic Design Automation (EDA) tools for flexible circuit design, configured with open-source components.
- Access to Gen 2.5 hybrid pilot line foundry services through a partnership with ITRI for product prototyping.
- Capabilities for advanced chip packaging, including glass panel-level packaging for AI chips.
- Development of CMOS for smart sensors utilizing OTFT technology and n-type oxide TFT for low-power applications.
- Joint development initiatives for microLED displays, active-matrix OLED displays, and OTFT-based microarray biochips.