Shijia Photons develops and manufactures high-performance optical semiconductor chips and passive optical components for telecommunications and data centers. They offer DFB laser chips and PLC splitter chips designed for advanced network infrastructure, enabling higher data rates and improved signal integrity.
Funding
Funding not disclosed
Founders
Product
Problem
The telecommunications and data center industries require high-performance optical components for efficient data transmission. Current solutions may not always meet the demands for advanced features like narrow linewidth, high power output, and precise wavelength control, impacting network speed and reliability.
Solution
Shijia Photons provides a comprehensive portfolio of optical semiconductor chips and passive optical components designed to enhance network infrastructure. The company specializes in Distributed Feedback (DFB) laser chips and Planar Lightwave Circuit (PLC) splitter chips, catering to the stringent requirements of telecommunication networks and data centers. By leveraging advanced fabrication processes and a dual-chip platform expertise in both active and passive optical technologies, Shijia Photons delivers solutions that enable higher data rates and improved signal integrity. Their product range supports critical applications from backbone networks to fiber-to-the-home deployments.
Target Audience
The primary customers are manufacturers and integrators within the telecommunications sector, data center operators, and companies developing advanced optical sensing and measurement systems.
Features
- DFB laser chips with wavelengths ranging from 1260nm to 1700nm, featuring high power output (up to 200mW) and narrow linewidths (as low as 100kHz).
- Support for CWDM, DWDM, and LWDM applications, including specific chips for LiDAR, TDLAS, and OTDR.
- PLC splitter chips and AWG chips, manufactured using a 6-inch wafer process platform with end-to-end fabrication capabilities.
- Packaging options include TO, TOSA, Butterfly, and mini-box configurations, with integrated drivers and TEC controllers for active laser components.
- Passive optical components such as Variable Optical Attenuators (VOA), Wavelength Division Multiplexers (WDM), Optical Switches (OSW), and Wavelength Selective Switches (WSS).
- High-precision Fiber Array (FA) fabrication with various channel configurations and Mode Field Diameter (MFD) conversions.
- ISO 9001 and RoHS certified manufacturing processes ensuring quality and compliance.
- Vertical integration from MOCVD epitaxial growth to chip processing and packaging, enabling customized solutions and rapid prototyping.